| Age | Commit message (Collapse) | Author | Files | Lines |
|---|
|
Add a new feature package for Alert standard format support.
Alert Standard format specification(DSP0136)
REF:https://www.dmtf.org/sites/default/files/standards/documents/DSP0136.pdf
Cc: Sai Chaganty <rangasai.v.chaganty@intel.com>
Cc: Isaac Oram <isaac.w.oram@intel.com>
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Cc: Liming Gao <gaoliming@byosoft.com.cn>
Signed-off-by: CrystalLee <CrystalLee@ami.com>
Reviewed-by: Isaac Oram <isaac.w.oram@intel.com>
|
|
Rename gPlatformPayloadPkgTokenSpaceGuid to
gPlatformPayloadFeaturePkgTokenSpaceGuid
Rename PcdPayloadPackageFeatureEnable to PcdPlatformPayloadFeatureEnable
Update Readme including format improvements
Cc: Sai Chaganty <rangasai.v.chaganty@intel.com>
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Cc: Liming Gao <gaoliming@byosoft.com.cn>
Cc: Ray Ni <ray.ni@intel.com>
Cc: Guo Dong <guo.dong@intel.com>
Signed-off-by: Isaac Oram <isaac.w.oram@intel.com>
Reviewed-by: Guo Dong <guo.dong@intel.com>
Reviewed-by: Sai Chaganty <rangasai.v.chaganty@intel.com>
|
|
Rename PlatformPayloadPkg to PlatformPayloadFeaturePkg.
Rename Package DEC, DSC, FDF and py scripts to match.
Search and replace PlatformPayloadPkg with PlatformPayloadFeaturePkg.
Cc: Sai Chaganty <rangasai.v.chaganty@intel.com>
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Cc: Liming Gao <gaoliming@byosoft.com.cn>
Cc: Ray Ni <ray.ni@intel.com>
Cc: Guo Dong <guo.dong@intel.com>
Signed-off-by: Isaac Oram <isaac.w.oram@intel.com>
Reviewed-by: Sai Chaganty <rangasai.v.chaganty@intel.com>
Reviewed-by: Guo Dong <guo.dong@intel.com>
|
|
The DXE and SMM versions of AcpiDebug perform the same task and
are therefore mutually exclusive. Including both modules results in a
duplicate ACPI table, resulting in the feature not working at all.
Therefore, add a new PCD to determine which module will be included.
Now, either version successfully write to the debug buffer.
Cc: Sai Chaganty <rangasai.v.chaganty@intel.com>
Cc: Isaac Oram <isaac.w.oram@intel.com>
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Cc: Ankit Sinha <ankit.sinha@intel.com>
Cc: Liming Gao <gaoliming@byosoft.com.cn>
Cc: Eric Dong <eric.dong@intel.com>
Signed-off-by: Benjamin Doron <benjamin.doron00@gmail.com>
Reviewed-by: Isaac Oram <isaac.w.oram@intel.com>
|
|
UefiPayloadPkg in EDK2 repo was added SMM variable support for Intel
platform with SPI flash. But some of the modules for SMM variable are
Intel PCH specific (e.g. SPI library, SMM PCH module), so move these
modules into edk2-platforms repo.
A platform payload FV could be built from PlatformPayloadPkg which works
on Intel platforms (e.g.. ICX, APL, CML, CFL, KBL, TGL, ADL, etc.) with
SMM variable. This platform payload FV could be added into universal UEFI
payload built from EDK2 UefiPayloadPkg.
The steps to build a complete payload (use windows host as example):
set WORKSPACE=c:\payload
set PACKAGES_PATH=C:\payload\edk2;C:\payload\edk2-platforms\Platform\Intel;
C:\payload\edk2-platforms\Features\Intel;
edk2\edksetup.bat
python edk2\UefiPayloadPkg\UniversalPayloadBuild.py -t VS2019
-D SMM_SUPPORT=TRUE -DVARIABLE_SUPPORT=NONE
python edk2-platforms\Features\Intel\PlatformPayloadPkg\PlatformPayloadPkg.py
-t VS2019 -D SMM_VARIABLE=TRUE -s
The final UEFI payload generated at Build\UefiPayloadPkgX64\UniversalPayload.elf
if build success.
Cc: Michael D Kinney <michael.d.kinney@intel.com>
Cc: Ray Ni <ray.ni@intel.com>
Cc: Sean Rhodes <sean@starlabs.systems>
Signed-off-by: Guo Dong <guo.dong@intel.com>
Signed-off-by: Isaac Oram <isaac.w.oram@intel.com>
Reviewed-by: Sai Chaganty <rangasai.v.chaganty@intel.com>
|
|
The AdvancedFeaturePkg is supposed to include all features.
Add Beep Debug feature to include DSC and FDF.
Order features based on their domains.
Cc: Sai Chaganty <rangasai.v.chaganty@intel.com>
Cc: Liming Gao <gaoliming@byosoft.com.cn>
Signed-off-by: Isaac Oram <isaac.w.oram@intel.com>
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
|
|
Packages should be at the root of a PACKAGES_PATH entry.
At some point, paths were relative to edk2-platforms/Features/Intel
which was functional, but interferes with the proper functioning
of packaging tools.
Cc: Sai Chaganty <rangasai.v.chaganty@intel.com>
Cc: Liming Gao <gaoliming@byosoft.com.cn>
Signed-off-by: Isaac Oram <isaac.w.oram@intel.com>
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
Reviewed-by: Sai Chaganty <rangasai.v.chaganty@intel.com>
|
|
REF: https://bugzilla.tianocore.org/show_bug.cgi?id=2478
The PostCodeDebugFeaturePkg include some useful post code debug
libraries, such as get post code from status code and show it.
It provide a library PostCodeStatusCodeHandlerLib used by edk2
StatusCodeHandler.efi, used to show the post code.
It also provide a library of PostCodeMap lib, it map the status code
to post code.
Cc: Liming Gao <liming.gao@intel.com>
Signed-off-by: Ming Tan <ming.tan@intel.com>
Reviewed-by: Eric Dong <eric.dong@intel.com>
Reviewed-by: Dandan Bi <dandan.bi@intel.com>
|
|
REF: https://bugzilla.tianocore.org/show_bug.cgi?id=2792
The BeepDebugFeaturePkg include some useful beep debug
libraries, such as get beep value from status code and beep.
It provide a library BeepStatusCodeHandlerLib used by edk2
StatusCodeHandler.efi, used to do beep if needed.
It also provide a library of BeepMap lib, it map the status code
to beep value.
A library of Beep lib is needed by platform, and this pkg has a
Null implementation.
Cc: Liming Gao <liming.gao@intel.com>
Signed-off-by: Ming Tan <ming.tan@intel.com>
Reviewed-by: Eric Dong <eric.dong@intel.com>
Reviewed-by: Dandan Bi <dandan.bi@intel.com>
|
|
[edk2-devel] [PATCH]
From: Heng Luo <heng.luo@intel.com>
Ref: https://bugzilla.tianocore.org/show_bug.cgi?id=2688
Remove Features/Intel/AdvancedFeaturePkg/TemporaryBuildWorkaround,
Add Features/Intel/AdvancedFeaturePkg/Include/AdvancedFeaturesPcd.dsc
to support Feature PCDs.
Use AdvancedFeaturePkg/Include/AdvancedFeaturesPcd.dsc instead of
AdvancedFeaturePkg/TemporaryBuildWorkaround/TemporaryBuildWorkaround.dsc
Cc: Liming Gao <liming.gao@intel.com>
Cc: Eric Dong <eric.dong@intel.com>
Cc: Ray Ni <ray.ni@intel.com>
Signed-off-by: Heng Luo <heng.luo@intel.com>
Reviewed-by: Eric Dong <eric.dong@intel.com>
|
|
REF: https://bugzilla.tianocore.org/show_bug.cgi?id=2584
1. LogoDxe.inf includes a BMP logo in the EFI file,
the driver decodes the BMP file and provide the image
via EDKII_PLATFORM_LOGO_PROTOCOL.
2. JpegLogoDxe.inf includes a JPEG logo in the EFI file,
the driver use EFI_HII_IMAGE_DECODER_PROTOCOL to decode the Jpeg
file and provide the image via EDKII_PLATFORM_LOGO_PROTOCOL.
Cc: Dandan Bi <dandan.bi@intel.com>
Cc: Liming Gao <liming.gao@intel.com>
Cc: Eric Dong <eric.dong@intel.com>
Cc: Ray Ni <ray.ni@intel.com>
Signed-off-by: Heng Luo <heng.luo@intel.com>
Reviewed-by: Liming Gao <liming.gao@intel.com>
|
|
Adds FDF files that group all currently available advanced features
so they can be conveniently included into board packages.
The Minimum Platform defines two firmware volumes for advanced
features: FvAdvancedPreMemory and FvAdvanced.
This change provides all pre-memory advanced feature modules to
be included in FvAdvancedPreMemory via
AdvancedFeaturePkg/Include/PreMemory.fdf. All post-memory advanced
feature modules to be included in FvAdvanced are available in
AdvancedFeaturePkg/Include/PostMemory.fdf.
Cc: Sai Chaganty <rangasai.v.chaganty@intel.com>
Cc: Liming Gao <liming.gao@intel.com>
Signed-off-by: Michael Kubacki <michael.a.kubacki@intel.com>
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
|
|
This change adds AdvancedFeaturePkg to the Features/Intel
directory. AdvancedFeaturePkg is a special package that is
located at the root level of Features/Intel.
All advanced features can be built using the AdvancedFeaturePkg
build. To build all advanced features, follow the instructions in
the Feature/Intel/Readme.md file. The actual build is performed by
executing the following command in the Features/Intel directory:
"build -p AdvancedFeaturePkg/AdvancedFeaturePkg.dsc -a IA32 -a X64"
Cc: Sai Chaganty <rangasai.v.chaganty@intel.com>
Cc: Liming Gao <liming.gao@intel.com>
Signed-off-by: Michael Kubacki <michael.a.kubacki@intel.com>
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
|
