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2023-02-09AdvancedFeaturePkg: Improve sample build instructionsIsaac Oram1-6/+8
V1: Make the Windows build example current working directory based instead of arbitrary. V2: Fix case mismatch in edk2 repo local name. Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Liming Gao <gaoliming@byosoft.com.cn> Cc: Rebecca Cran <quic_rcran@quicinc.com> Signed-off-by: Isaac Oram <isaac.w.oram@intel.com> Reviewed-by: Rebecca Cran <rebecca@quicinc.com>
2023-01-13Features/Intel: Prepare for edk2-platforms CIIsaac Oram2-1/+43
Fix some build issues with GCC5 targets Add a Readme.md for AdvancedFeaturePkg Add VS2019, CLANGPDB, and GCC5 build targets to Readme.md for each feature Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Liming Gao <gaoliming@byosoft.com.cn> Cc: Eric Dong <eric.dong@intel.com> Cc: Dandan Bi <dandan.bi@intel.com> Signed-off-by: Isaac Oram <isaac.w.oram@intel.com> Reviewed-by: Sai Chaganty <rangasai.v.chaganty@intel.com>
2022-10-12S3FeaturePkg: Implement working S3 resumeBenjamin Doron1-0/+3
Follow-up commits to MinPlatform (PeiFspWrapperHobProcessLib for memory) and FSP-related board libraries (policy overrides) required for successful S3 resume. Factored allocation logic into new module to avoid MinPlatform dependency on S3Feature package. TODO: Can optimise required size. Cc: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Ankit Sinha <ankit.sinha@intel.com> Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Isaac Oram <isaac.w.oram@intel.com> Cc: Liming Gao <gaoliming@byosoft.com.cn> Signed-off-by: Benjamin Doron <benjamin.doron00@gmail.com> Reviewed-by: Isaac Oram <isaac.w.oram@intel.com> S3FeaturePkg/Build: Add libraries needed by S3FeaturePkg This change is needed for proposed S3FeaturePkg additions. Changes ensure standalone build for S3FeaturePkg and AdvancedFeaturePkg Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Liming Gao <gaoliming@byosoft.com.cn> Cc: Benjamin Doron <benjamin.doron00@gmail.com> Signed-off-by: Isaac Oram <isaac.w.oram@intel.com> Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com> MinPlatformPkg/S3: Use EFI_PHYSICAL_ADDRESS for address This change fixes build warnings with type casts from some compilers. Also changes type for ACPI_S3_MEMORY S3PeiMemBase to EFI_PHYSICAL_ADDRESS. This generally makes code eaiser to understand as opposed to UINT64. Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Liming Gao <gaoliming@byosoft.com.cn> Cc: Chasel Chiu <chasel.chiu@intel.com> Cc: Eric Dong <eric.dong@intel.com> Cc: Benjamin Doron <benjamin.doron00@gmail.com> Signed-off-by: Isaac Oram <isaac.w.oram@intel.com> Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
2022-09-08Features/Intel/OutOfBandManagement/AsfFeaturePkg: Add initial packageCrystalLee5-0/+15
Add a new feature package for Alert standard format support. Alert Standard format specification(DSP0136) REF:https://www.dmtf.org/sites/default/files/standards/documents/DSP0136.pdf Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Isaac Oram <isaac.w.oram@intel.com> Cc: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Liming Gao <gaoliming@byosoft.com.cn> Signed-off-by: CrystalLee <CrystalLee@ami.com> Reviewed-by: Isaac Oram <isaac.w.oram@intel.com>
2022-09-01Features/Intel: Reduce duplicate codeIsaac Oram1-7/+6
Enable simpler initialation of the MinPlatformPkg feature selection PCD. Most features and boards don't benefit from initializing these. Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Liming Gao <gaoliming@byosoft.com.cn> Signed-off-by: Isaac Oram <isaac.w.oram@intel.com> Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
2022-08-17PlatformPayloadFeaturePkg: Update contents to match feature conventionsIsaac Oram5-5/+5
Rename gPlatformPayloadPkgTokenSpaceGuid to gPlatformPayloadFeaturePkgTokenSpaceGuid Rename PcdPayloadPackageFeatureEnable to PcdPlatformPayloadFeatureEnable Update Readme including format improvements Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Liming Gao <gaoliming@byosoft.com.cn> Cc: Ray Ni <ray.ni@intel.com> Cc: Guo Dong <guo.dong@intel.com> Signed-off-by: Isaac Oram <isaac.w.oram@intel.com> Reviewed-by: Guo Dong <guo.dong@intel.com> Reviewed-by: Sai Chaganty <rangasai.v.chaganty@intel.com>
2022-08-17PlatformPayloadPkg: Rename to match other feature conventionsIsaac Oram4-4/+4
Rename PlatformPayloadPkg to PlatformPayloadFeaturePkg. Rename Package DEC, DSC, FDF and py scripts to match. Search and replace PlatformPayloadPkg with PlatformPayloadFeaturePkg. Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Liming Gao <gaoliming@byosoft.com.cn> Cc: Ray Ni <ray.ni@intel.com> Cc: Guo Dong <guo.dong@intel.com> Signed-off-by: Isaac Oram <isaac.w.oram@intel.com> Reviewed-by: Sai Chaganty <rangasai.v.chaganty@intel.com> Reviewed-by: Guo Dong <guo.dong@intel.com>
2022-08-08AcpiDebugFeaturePkg: Included modules are mutually exclusiveBenjamin Doron2-0/+2
The DXE and SMM versions of AcpiDebug perform the same task and are therefore mutually exclusive. Including both modules results in a duplicate ACPI table, resulting in the feature not working at all. Therefore, add a new PCD to determine which module will be included. Now, either version successfully write to the debug buffer. Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Isaac Oram <isaac.w.oram@intel.com> Cc: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Ankit Sinha <ankit.sinha@intel.com> Cc: Liming Gao <gaoliming@byosoft.com.cn> Cc: Eric Dong <eric.dong@intel.com> Signed-off-by: Benjamin Doron <benjamin.doron00@gmail.com> Reviewed-by: Isaac Oram <isaac.w.oram@intel.com>
2022-08-08Features/Intel/PlatformPayloadPkg: add platform payload FVGuo Dong5-0/+33
UefiPayloadPkg in EDK2 repo was added SMM variable support for Intel platform with SPI flash. But some of the modules for SMM variable are Intel PCH specific (e.g. SPI library, SMM PCH module), so move these modules into edk2-platforms repo. A platform payload FV could be built from PlatformPayloadPkg which works on Intel platforms (e.g.. ICX, APL, CML, CFL, KBL, TGL, ADL, etc.) with SMM variable. This platform payload FV could be added into universal UEFI payload built from EDK2 UefiPayloadPkg. The steps to build a complete payload (use windows host as example): set WORKSPACE=c:\payload set PACKAGES_PATH=C:\payload\edk2;C:\payload\edk2-platforms\Platform\Intel; C:\payload\edk2-platforms\Features\Intel; edk2\edksetup.bat python edk2\UefiPayloadPkg\UniversalPayloadBuild.py -t VS2019 -D SMM_SUPPORT=TRUE -DVARIABLE_SUPPORT=NONE python edk2-platforms\Features\Intel\PlatformPayloadPkg\PlatformPayloadPkg.py -t VS2019 -D SMM_VARIABLE=TRUE -s The final UEFI payload generated at Build\UefiPayloadPkgX64\UniversalPayload.elf if build success. Cc: Michael D Kinney <michael.d.kinney@intel.com> Cc: Ray Ni <ray.ni@intel.com> Cc: Sean Rhodes <sean@starlabs.systems> Signed-off-by: Guo Dong <guo.dong@intel.com> Signed-off-by: Isaac Oram <isaac.w.oram@intel.com> Reviewed-by: Sai Chaganty <rangasai.v.chaganty@intel.com>
2022-02-03AdvancedFeaturePkg/Build: Add FDF to create FV for all featuresIsaac Oram2-0/+50
This produces three FV and no FD. FvAdvancedPreMemory.fv contains PEIM for pre-memory use. FvAdvancedUncompressed.fv contains post memory PEIM and drivers for DXE and SMM. FvAdvanced.fv contains the compressed FvAdvancedUncompressed.fv in an FV file format as is common practice. These FV are not expected to be used as is, but are needed to test the individual features for things like filename collisions. Some features require build customization so binary reuse is not feasible at this time. Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Liming Gao <gaoliming@byosoft.com.cn> Signed-off-by: Isaac Oram <isaac.w.oram@intel.com> Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
2022-02-03AdvancedFeaturePkg: Add missing featuresIsaac Oram5-46/+180
The AdvancedFeaturePkg is supposed to include all features. Add Beep Debug feature to include DSC and FDF. Order features based on their domains. Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Liming Gao <gaoliming@byosoft.com.cn> Signed-off-by: Isaac Oram <isaac.w.oram@intel.com> Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
2022-01-19AdvancedFeaturePkg: Fix all relative package pathsOram, Isaac W3-21/+24
Packages should be at the root of a PACKAGES_PATH entry. At some point, paths were relative to edk2-platforms/Features/Intel which was functional, but interferes with the proper functioning of packaging tools. Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Liming Gao <gaoliming@byosoft.com.cn> Signed-off-by: Isaac Oram <isaac.w.oram@intel.com> Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com> Reviewed-by: Sai Chaganty <rangasai.v.chaganty@intel.com>
2021-07-09AdvancedFeaturePkg: Fail to build this package.Chasel Chiu1-2/+17
REF: https://bugzilla.tianocore.org/show_bug.cgi?id=3484 Fixed the build failure of this package. Cc: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Liming Gao <gaoliming@byosoft.com.cn> Cc: Isaac Oram <isaac.w.oram@intel.com> Signed-off-by: Chasel Chiu <chasel.chiu@intel.com> Reviewed-by: Sai Chaganty <rangasai.v.chaganty@intel.com>
2020-06-18Features/Intel/PostCodeDebugFeaturePkg: add it.Tan, Ming1-0/+1
REF: https://bugzilla.tianocore.org/show_bug.cgi?id=2478 The PostCodeDebugFeaturePkg include some useful post code debug libraries, such as get post code from status code and show it. It provide a library PostCodeStatusCodeHandlerLib used by edk2 StatusCodeHandler.efi, used to show the post code. It also provide a library of PostCodeMap lib, it map the status code to post code. Cc: Liming Gao <liming.gao@intel.com> Signed-off-by: Ming Tan <ming.tan@intel.com> Reviewed-by: Eric Dong <eric.dong@intel.com> Reviewed-by: Dandan Bi <dandan.bi@intel.com>
2020-06-18Features/Intel/BeepDebugFeaturePkg: add it.Tan, Ming1-41/+42
REF: https://bugzilla.tianocore.org/show_bug.cgi?id=2792 The BeepDebugFeaturePkg include some useful beep debug libraries, such as get beep value from status code and beep. It provide a library BeepStatusCodeHandlerLib used by edk2 StatusCodeHandler.efi, used to do beep if needed. It also provide a library of BeepMap lib, it map the status code to beep value. A library of Beep lib is needed by platform, and this pkg has a Null implementation. Cc: Liming Gao <liming.gao@intel.com> Signed-off-by: Ming Tan <ming.tan@intel.com> Reviewed-by: Eric Dong <eric.dong@intel.com> Reviewed-by: Dandan Bi <dandan.bi@intel.com>
2020-05-08Remove temporary build workaround in Features/Intel/AdvancedFeaturePkgEric Dong5-168/+42
[edk2-devel] [PATCH] From: Heng Luo <heng.luo@intel.com> Ref: https://bugzilla.tianocore.org/show_bug.cgi?id=2688 Remove Features/Intel/AdvancedFeaturePkg/TemporaryBuildWorkaround, Add Features/Intel/AdvancedFeaturePkg/Include/AdvancedFeaturesPcd.dsc to support Feature PCDs. Use AdvancedFeaturePkg/Include/AdvancedFeaturesPcd.dsc instead of AdvancedFeaturePkg/TemporaryBuildWorkaround/TemporaryBuildWorkaround.dsc Cc: Liming Gao <liming.gao@intel.com> Cc: Eric Dong <eric.dong@intel.com> Cc: Ray Ni <ray.ni@intel.com> Signed-off-by: Heng Luo <heng.luo@intel.com> Reviewed-by: Eric Dong <eric.dong@intel.com>
2020-04-01Features/Intel: Add LogoFeaturePkg to TemporaryBuildWorkaroundLuo, Heng2-2/+7
Ref: https://bugzilla.tianocore.org/show_bug.cgi?id=2644 Need to add LogoFeaturePkg to TemporaryBuildWorkaround because OpenBoard still includes TemporaryBuildWorkaround for building BIOS. Cc: Dandan Bi <dandan.bi@intel.com> Cc: Liming Gao <liming.gao@intel.com> Signed-off-by: Heng Luo <heng.luo@intel.com> Reviewed-by: Eric Dong <eric.dong@intel.com> Reviewed-by: Ray Ni <ray.ni@intel.com>
2020-03-27Features/Intel: Add LogoFeaturePkg to provide logo images and driversHeng Luo4-4/+18
REF: https://bugzilla.tianocore.org/show_bug.cgi?id=2584 1. LogoDxe.inf includes a BMP logo in the EFI file, the driver decodes the BMP file and provide the image via EDKII_PLATFORM_LOGO_PROTOCOL. 2. JpegLogoDxe.inf includes a JPEG logo in the EFI file, the driver use EFI_HII_IMAGE_DECODER_PROTOCOL to decode the Jpeg file and provide the image via EDKII_PLATFORM_LOGO_PROTOCOL. Cc: Dandan Bi <dandan.bi@intel.com> Cc: Liming Gao <liming.gao@intel.com> Cc: Eric Dong <eric.dong@intel.com> Cc: Ray Ni <ray.ni@intel.com> Signed-off-by: Heng Luo <heng.luo@intel.com> Reviewed-by: Liming Gao <liming.gao@intel.com>
2019-12-07Features/Intel/AdvancedFeaturePkg: Add FDF include filesMichael Kubacki2-0/+114
Adds FDF files that group all currently available advanced features so they can be conveniently included into board packages. The Minimum Platform defines two firmware volumes for advanced features: FvAdvancedPreMemory and FvAdvanced. This change provides all pre-memory advanced feature modules to be included in FvAdvancedPreMemory via AdvancedFeaturePkg/Include/PreMemory.fdf. All post-memory advanced feature modules to be included in FvAdvanced are available in AdvancedFeaturePkg/Include/PostMemory.fdf. Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Liming Gao <liming.gao@intel.com> Signed-off-by: Michael Kubacki <michael.a.kubacki@intel.com> Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
2019-12-07Features/Intel/AdvancedFeaturePkg: Add temporary build workaroundMichael Kubacki4-0/+164
This change adds a temporary build workaround to allow the advanced feature PCDs to be used in conditional statements in DSC files even if they are not referenced in INF files. Support to allow a FeaturePCD to be used in a conditional statement without being referenced in an INF file has been requested in the following Bugzilla item: https://bugzilla.tianocore.org/show_bug.cgi?id=2270 This change can be reverted when that Bugzilla is completed and the change is submitted to edk2. Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Liming Gao <liming.gao@intel.com> Signed-off-by: Michael Kubacki <michael.a.kubacki@intel.com> Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
2019-12-07Features/Intel/AdvancedFeaturePkg: Add packageMichael Kubacki3-0/+138
This change adds AdvancedFeaturePkg to the Features/Intel directory. AdvancedFeaturePkg is a special package that is located at the root level of Features/Intel. All advanced features can be built using the AdvancedFeaturePkg build. To build all advanced features, follow the instructions in the Feature/Intel/Readme.md file. The actual build is performed by executing the following command in the Features/Intel directory: "build -p AdvancedFeaturePkg/AdvancedFeaturePkg.dsc -a IA32 -a X64" Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Liming Gao <liming.gao@intel.com> Signed-off-by: Michael Kubacki <michael.a.kubacki@intel.com> Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
generated by cgit v1.2.3 (git 2.39.0) at 2026-09-30 02:49:45 +0300