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2024-11-25Features/Intel|Platforms/Intel: Complete pending changes to [Components.{ARCH}]Mike Beaton1-8/+2
As noted in the code, it was intended to update various manually specified instances of [Components.IA32/X64] to [Components.$(DXE_ARCH)] or [Components.$(PEI_ARCH)] as appropriate, once macro expansion in the Components {ARCH} value was supported. This support was added some time ago[1], but the marked changes were never made. [1]: https://bugzilla.tianocore.org/show_bug.cgi?id=2308 Signed-off-by: Mike Beaton <mjsbeaton@gmail.com>
2024-09-16Update code to be more C11 compliant by using __func__Rebecca Cran1-2/+2
__FUNCTION__ is a pre-standard extension that gcc and Visual C++ among others support, while __func__ was standardized in C99. Since it's more standard, replace __FUNCTION__ with __func__ throughout edk2-platforms. Signed-off-by: Rebecca Cran <rebecca@bsdio.com>
2023-01-13Features/Intel: Prepare for edk2-platforms CIIsaac Oram1-5/+4
Fix some build issues with GCC5 targets Add a Readme.md for AdvancedFeaturePkg Add VS2019, CLANGPDB, and GCC5 build targets to Readme.md for each feature Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Liming Gao <gaoliming@byosoft.com.cn> Cc: Eric Dong <eric.dong@intel.com> Cc: Dandan Bi <dandan.bi@intel.com> Signed-off-by: Isaac Oram <isaac.w.oram@intel.com> Reviewed-by: Sai Chaganty <rangasai.v.chaganty@intel.com>
2022-10-12S3FeaturePkg: Implement working S3 resumeBenjamin Doron8-11/+346
Follow-up commits to MinPlatform (PeiFspWrapperHobProcessLib for memory) and FSP-related board libraries (policy overrides) required for successful S3 resume. Factored allocation logic into new module to avoid MinPlatform dependency on S3Feature package. TODO: Can optimise required size. Cc: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Ankit Sinha <ankit.sinha@intel.com> Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Isaac Oram <isaac.w.oram@intel.com> Cc: Liming Gao <gaoliming@byosoft.com.cn> Signed-off-by: Benjamin Doron <benjamin.doron00@gmail.com> Reviewed-by: Isaac Oram <isaac.w.oram@intel.com> S3FeaturePkg/Build: Add libraries needed by S3FeaturePkg This change is needed for proposed S3FeaturePkg additions. Changes ensure standalone build for S3FeaturePkg and AdvancedFeaturePkg Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Liming Gao <gaoliming@byosoft.com.cn> Cc: Benjamin Doron <benjamin.doron00@gmail.com> Signed-off-by: Isaac Oram <isaac.w.oram@intel.com> Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com> MinPlatformPkg/S3: Use EFI_PHYSICAL_ADDRESS for address This change fixes build warnings with type casts from some compilers. Also changes type for ACPI_S3_MEMORY S3PeiMemBase to EFI_PHYSICAL_ADDRESS. This generally makes code eaiser to understand as opposed to UINT64. Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Liming Gao <gaoliming@byosoft.com.cn> Cc: Chasel Chiu <chasel.chiu@intel.com> Cc: Eric Dong <eric.dong@intel.com> Cc: Benjamin Doron <benjamin.doron00@gmail.com> Signed-off-by: Isaac Oram <isaac.w.oram@intel.com> Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
2022-09-01Features/Intel: Reduce duplicate codeIsaac Oram1-7/+6
Enable simpler initialation of the MinPlatformPkg feature selection PCD. Most features and boards don't benefit from initializing these. Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Liming Gao <gaoliming@byosoft.com.cn> Signed-off-by: Isaac Oram <isaac.w.oram@intel.com> Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
2022-01-19S3FeaturePkg: Use MinPlatformPkg build include filesOram, Isaac W3-66/+26
Use the MinPlatformPkg common core build files to build libraries needed by this feature. Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Liming Gao <gaoliming@byosoft.com.cn> Signed-off-by: Isaac Oram <isaac.w.oram@intel.com> Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com> Reviewed-by: Sai Chaganty <rangasai.v.chaganty@intel.com>
2022-01-19S3FeaturePkg: Fix all relative package pathsOram, Isaac W3-3/+3
Packages should be at the root of a PACKAGES_PATH entry. At some point, paths were relative to edk2-platforms/Features/Intel which was functional, but interferes with the proper functioning of packaging tools. Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Liming Gao <gaoliming@byosoft.com.cn> Signed-off-by: Isaac Oram <isaac.w.oram@intel.com> Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com> Reviewed-by: Sai Chaganty <rangasai.v.chaganty@intel.com>
2021-03-31Features/PowerManagement: Consume MdeLibs.dsc.inc for RegisterFilterLibDandan Bi1-1/+4
REF: https://bugzilla.tianocore.org/show_bug.cgi?id=3246 MdeLibs.dsc.inc was added for some basic/default library instances provided by MdePkg and RegisterFilterLibNull Library was also added into it as the first version of MdeLibs.dsc.inc. So update platform dsc to consume MdeLibs.dsc.inc for RegisterFilterLibNull which will be consumed by IoLib and BaseLib. Cc: Liming Gao <gaoliming@byosoft.com.cn> Signed-off-by: Dandan Bi <dandan.bi@intel.com> Reviewed-by: Michael D Kinney <michael.d.kinney@intel.com>
2020-02-01Features/Intel: Add a Performance Impact section to Readme.md filesMichael Kubacki1-0/+8
REF:https://bugzilla.tianocore.org/show_bug.cgi?id=2417 Performance impact is an important consideration for feature integration. This new section captures the general expectation for overall boot performance impact due to using an advanced feature. Cc: Dandan Bi <dandan.bi@intel.com> Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Chasel Chiu <chasel.chiu@intel.com> Cc: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Eric Dong <eric.dong@intel.com> Cc: Liming Gao <liming.gao@intel.com> Signed-off-by: Michael Kubacki <michael.a.kubacki@intel.com> Reviewed-by: Chasel Chiu <chasel.chiu@intel.com> Reviewed-by: Sai Chaganty <rangasai.v.chaganty@intel.com>
2019-12-07Features/Intel/S3FeaturePkg: Add initial packageMichael Kubacki8-0/+365
Adds a new feature package for the S3 feature. Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Liming Gao <liming.gao@intel.com> Signed-off-by: Michael Kubacki <michael.a.kubacki@intel.com> Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
2019-12-07Features/Intel/PowerManagement: Add Readme.mdMichael Kubacki1-0/+10
Adds the Readme.md file to briefly explain the types of features supported in the PowerManagement feature domain directory. Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Liming Gao <liming.gao@intel.com> Signed-off-by: Michael Kubacki <michael.a.kubacki@intel.com> Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>