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author | Olof Johansson <olof@lixom.net> | 2018-12-04 00:04:49 +0300 |
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committer | Olof Johansson <olof@lixom.net> | 2018-12-04 00:04:49 +0300 |
commit | 332da8486b58ebe5c1901b445e01ca45c20b6c72 (patch) | |
tree | 4095b01c5b022024b6747bdeb9ebcdabf3bb2fa7 /tools/perf/scripts/python/export-to-sqlite.py | |
parent | acfbaa5d3bd6e8f7d3b40f2f6e87399037c78333 (diff) | |
parent | 972910948fb6f555e83f37bc6172f51984d738a9 (diff) | |
download | linux-332da8486b58ebe5c1901b445e01ca45c20b6c72.tar.xz |
Merge tag 'qcom-dts-for-4.21' of git://git.kernel.org/pub/scm/linux/kernel/git/agross/linux into next/dt
Qualcomm Device Tree Changes for v4.21
* Add entry for Qualcomm TSENS thermal drivers
* Update msm8974 thermal entries
* Fix msm8974 Hammerhead magnetometer gpios
* Add SoC specific compatibles for SDHC nodes
* Remove Arrow SD600 eval board
* tag 'qcom-dts-for-4.21' of git://git.kernel.org/pub/scm/linux/kernel/git/agross/linux:
ARM: dts: qcom: Remove Arrow SD600 eval board
ARM: dts: qcom: Add SoC-specific string for sdhci-msm-v4 nodes
ARM: dts: qcom: msm8974-hammerhead: correct gpios property on magnetometer
ARM: dts: msm8974: thermal: Add "qcom,sensors" property
ARM: dts: msm8974: thermal: split address space into two
MAINTAINERS: Add entry for Qualcomm TSENS thermal drivers
Signed-off-by: Olof Johansson <olof@lixom.net>
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