summaryrefslogtreecommitdiff
path: root/Documentation/hwmon
diff options
context:
space:
mode:
Diffstat (limited to 'Documentation/hwmon')
-rw-r--r--Documentation/hwmon/index.rst1
-rw-r--r--Documentation/hwmon/intel-m10-bmc-hwmon.rst78
2 files changed, 79 insertions, 0 deletions
diff --git a/Documentation/hwmon/index.rst b/Documentation/hwmon/index.rst
index af064a9ad42f..0a3383f6a2d4 100644
--- a/Documentation/hwmon/index.rst
+++ b/Documentation/hwmon/index.rst
@@ -74,6 +74,7 @@ Hardware Monitoring Kernel Drivers
ina209
ina2xx
ina3221
+ intel-m10-bmc-hwmon
ir35221
ir38064
isl68137
diff --git a/Documentation/hwmon/intel-m10-bmc-hwmon.rst b/Documentation/hwmon/intel-m10-bmc-hwmon.rst
new file mode 100644
index 000000000000..3d148c6e3256
--- /dev/null
+++ b/Documentation/hwmon/intel-m10-bmc-hwmon.rst
@@ -0,0 +1,78 @@
+.. SPDX-License-Identifier: GPL-2.0
+
+Kernel driver intel-m10-bmc-hwmon
+=================================
+
+Supported chips:
+
+ * Intel MAX 10 BMC for Intel PAC N3000
+
+ Prefix: 'n3000bmc-hwmon'
+
+Author: Xu Yilun <yilun.xu@intel.com>
+
+
+Description
+-----------
+
+This driver adds the temperature, voltage, current and power reading
+support for the Intel MAX 10 Board Management Controller (BMC) chip.
+The BMC chip is integrated in some Intel Programmable Acceleration
+Cards (PAC). It connects to a set of sensor chips to monitor the
+sensor data of different components on the board. The BMC firmware is
+responsible for sensor data sampling and recording in shared
+registers. The host driver reads the sensor data from these shared
+registers and exposes them to users as hwmon interfaces.
+
+The BMC chip is implemented using the Intel MAX 10 CPLD. It could be
+reprogramed to some variants in order to support different Intel
+PACs. The driver is designed to be able to distinguish between the
+variants, but now it only supports the BMC for Intel PAC N3000.
+
+
+Sysfs attributes
+----------------
+
+The following attributes are supported:
+
+- Intel MAX 10 BMC for Intel PAC N3000:
+
+======================= =======================================================
+tempX_input Temperature of the component (specified by tempX_label)
+tempX_max Temperature maximum setpoint of the component
+tempX_crit Temperature critical setpoint of the component
+tempX_max_hyst Hysteresis for temperature maximum of the component
+tempX_crit_hyst Hysteresis for temperature critical of the component
+temp1_label "Board Temperature"
+temp2_label "FPGA Die Temperature"
+temp3_label "QSFP0 Temperature"
+temp4_label "QSFP1 Temperature"
+temp5_label "Retimer A Temperature"
+temp6_label "Retimer A SerDes Temperature"
+temp7_label "Retimer B Temperature"
+temp8_label "Retimer B SerDes Temperature"
+
+inX_input Measured voltage of the component (specified by
+ inX_label)
+in0_label "QSFP0 Supply Voltage"
+in1_label "QSFP1 Supply Voltage"
+in2_label "FPGA Core Voltage"
+in3_label "12V Backplane Voltage"
+in4_label "1.2V Voltage"
+in5_label "12V AUX Voltage"
+in6_label "1.8V Voltage"
+in7_label "3.3V Voltage"
+
+currX_input Measured current of the component (specified by
+ currX_label)
+curr1_label "FPGA Core Current"
+curr2_label "12V Backplane Current"
+curr3_label "12V AUX Current"
+
+powerX_input Measured power of the component (specified by
+ powerX_label)
+power1_label "Board Power"
+
+======================= =======================================================
+
+All the attributes are read-only.