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| author | Amit Daniel Kachhap <amit.daniel@samsung.com> | 2013-06-24 14:50:48 +0400 |
|---|---|---|
| committer | Eduardo Valentin <eduardo.valentin@ti.com> | 2013-08-13 17:52:04 +0400 |
| commit | 0e97194bcfa09fc835016e3aa12b932827a9e2a6 (patch) | |
| tree | e647abb418fdddb8b9348f2dcc7e370f976834a0 /scripts/patch-kernel | |
| parent | 498d22f616f6880531b6d75630a9cc0ecd1f7865 (diff) | |
| download | linux-0e97194bcfa09fc835016e3aa12b932827a9e2a6.tar.xz | |
ARM: dts: thermal: exynos: Add documentation for Exynos SoC thermal bindings
Proper description for Exynos4 bindings added to Documentation/devicetree/
bindings. It adds description to use multiple TMU instances, optional voltage
supply node and optional shared register across multiple TMU's.
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Diffstat (limited to 'scripts/patch-kernel')
0 files changed, 0 insertions, 0 deletions
