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authorDaniel Lezcano <daniel.lezcano@oss.qualcomm.com>2026-05-08 21:05:09 +0300
committerRafael J. Wysocki <rafael.j.wysocki@intel.com>2026-05-13 22:03:15 +0300
commitdc04e81fa2188d96af0c795ff45e4e5a209183b2 (patch)
treeb271169a443063516cbfef26726f661eefacb497 /include/linux/debugobjects.h
parent11568924a9319c951f7086c002741c03d4d0f740 (diff)
downloadlinux-dc04e81fa2188d96af0c795ff45e4e5a209183b2.tar.xz
thermal/core: Add dedicated release callback for thermal zones
The thermal class release callback currently handles thermal zone cleanup by checking the device name prefix. Move the thermal zone cleanup to a dedicated struct device release callback. This avoids relying on device names to select the release path and keeps the thermal zone lifetime handling local to the thermal zone object. Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Link: https://patch.msgid.link/20260508180511.1306659-3-daniel.lezcano@oss.qualcomm.com Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Diffstat (limited to 'include/linux/debugobjects.h')
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