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REF: https://bugzilla.tianocore.org/show_bug.cgi?id=3893
1.Added SecFspWrapperPlatformSecLibSample support for X64.
2.Adopted FSPT_ARCH2_UPD in SecFspWrapperPlatformSecLibSample.
3.Moved Fsp.h up one level to be shared across IA32 and X64.
Cc: Chasel Chiu <chasel.chiu@intel.com>
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Cc: Star Zeng <star.zeng@intel.com>
Cc: Ashraf Ali S <ashraf.ali.s@intel.com>
Signed-off-by: Ted Kuo <ted.kuo@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
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REF: https://bugzilla.tianocore.org/show_bug.cgi?id=3737
Apply uncrustify changes to .c/.h files in the IntelFsp2WrapperPkg package
Cc: Andrew Fish <afish@apple.com>
Cc: Leif Lindholm <leif@nuviainc.com>
Cc: Michael D Kinney <michael.d.kinney@intel.com>
Signed-off-by: Michael Kubacki <michael.kubacki@microsoft.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
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Fix various typos in comments and documentation.
Cc: Chasel Chiu <chasel.chiu@intel.com>
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Cc: Star Zeng <star.zeng@intel.com>
Reviewed-by: Philippe Mathieu-Daude <philmd@redhat.com>
Signed-off-by: Philippe Mathieu-Daude <philmd@redhat.com>
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Star Zeng <star.zeng@intel.com>
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https://bugzilla.tianocore.org/show_bug.cgi?id=1373
Replace BSD 2-Clause License with BSD+Patent License. This change is
based on the following emails:
https://lists.01.org/pipermail/edk2-devel/2019-February/036260.html
https://lists.01.org/pipermail/edk2-devel/2018-October/030385.html
RFCs with detailed process for the license change:
V3: https://lists.01.org/pipermail/edk2-devel/2019-March/038116.html
V2: https://lists.01.org/pipermail/edk2-devel/2019-March/037669.html
V1: https://lists.01.org/pipermail/edk2-devel/2019-March/037500.html
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Michael D Kinney <michael.d.kinney@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
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Keep NASM file only for new added modules.
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Liming Gao <liming.gao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
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Manually converts Ia32/PeiCoreEntry.asm, Ia32/SecEntry.asm and Ia32/Stack.asm
to Ia32/PeiCoreEntry.nasm, Ia32/SecEntry.nasm and Ia32/Stack.nasm.
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Liming Gao <liming.gao@intel.com>
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Add FSP2.0 support.
This series of patch is to support FSP2.0 specification at
https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf
Some major updates include:
1) One FSP binary is separated to multiple components:
FSP-T, FSP-M, FSP-S, and optional FSP-O.
Each component has its own configuration data region.
2) All FSP-APIs use same UPD format - FSP_UPD_HEADER.
3) Add EnumInitPhaseEndOfFirmware notifyphase.
4) FSP1.1/FSP1.0 compatibility is NOT maintained.
5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg,
to indicate that it is for FspWrapper only.
IntelFspPkg and IntelFspWrapperPkg will be deprecated.
The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg
and IntelFsp2WrapperPkg.
The old platform can still use IntelFspPkg and IntelFspWrapperPkg
for compatibility consideration.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
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