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2026-02-24IntelFsp2Pkg: Replace include guards with #pragma onceMichael Kubacki1-4/+1
Replace traditional `#ifndef`/`#define`/`#endif` include guards with `#pragma` once. `#pragma once` is a widely supported preprocessor directive that prevents header files from being included multiple times. It is supported by all toolchains used to build edk2: GCC, Clang/LLVM, and MSVC. Compared to macro-based include guards, `#pragma once`: - Eliminates the risk of macro name collisions or copy/paste errors where two headers inadvertently use the same guard macro. - Eliminate inconsistency in the way include guard macros are named (e.g., some files use `__FILE_H__`, others use `FILE_H_`, etc.). - Reduces boilerplate (three lines replaced by one). - Avoids polluting the macro namespace with guard symbols. - Can improve build times as the preprocessor can skip re-opening the file entirely, rather than re-reading it to find the matching `#endif` ("multiple-include optimization"). - Note that some compilers may already optimize traditional include guards, by recognzining the idiomatic pattern. This change is made acknowledging that overall portability of the code will technically be reduced, as `#pragma once` is not part of the C/C++ standards. However, this is considered acceptable given: 1. edk2 already defines a subset of supported compilers in BaseTools/Conf/tools_def.template, all of which have supported `#pragma once` for over two decades. 2. There have been concerns raised to the project about inconsistent include guard naming and potential macro collisions. Approximate compiler support dates: - MSVC: Supported since Visual C++ 4.2 (1996) - GCC: Supported since 3.4 (2004) (http://gnu.ist.utl.pt/software/gcc/gcc-3.4/changes.html) - Clang (LLVM based): Since initial release in 2007 Signed-off-by: Michael Kubacki <michael.kubacki@microsoft.com>
2024-04-09IntelFsp2Pkg: Fsp T new ARCH UPD SupportDuggapu Chinni B1-0/+13
Changes to support spec changes 1. Remove usage of Pcd. 2. Change code to validate the Temporary Ram size input. 3. Consume the input saved in YMM Register Cc: Sai Chaganty <rangasai.v.chaganty@intel.com> Cc: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Chiu Chasel <chasel.chiu@intel.com> Cc: Duggapu Chinni B <chinni.b.duggapu@intel.com> Cc: Ni Ray <ray.ni@intel.com> Signed-off-by: Duggapu Chinni B <chinni.b.duggapu@intel.com> Reviewed-by: Chiu Chasel <chasel.chiu@intel.com> Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
2021-12-07IntelFsp2Pkg: Apply uncrustify changesMichael Kubacki1-9/+8
REF: https://bugzilla.tianocore.org/show_bug.cgi?id=3737 Apply uncrustify changes to .c/.h files in the IntelFsp2Pkg package Cc: Andrew Fish <afish@apple.com> Cc: Leif Lindholm <leif@nuviainc.com> Cc: Michael D Kinney <michael.d.kinney@intel.com> Signed-off-by: Michael Kubacki <michael.kubacki@microsoft.com> Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
2019-04-09IntelFsp2Pkg: Replace BSD License with BSD+Patent LicenseMichael D Kinney1-7/+1
https://bugzilla.tianocore.org/show_bug.cgi?id=1373 Replace BSD 2-Clause License with BSD+Patent License. This change is based on the following emails: https://lists.01.org/pipermail/edk2-devel/2019-February/036260.html https://lists.01.org/pipermail/edk2-devel/2018-October/030385.html RFCs with detailed process for the license change: V3: https://lists.01.org/pipermail/edk2-devel/2019-March/038116.html V2: https://lists.01.org/pipermail/edk2-devel/2019-March/037669.html V1: https://lists.01.org/pipermail/edk2-devel/2019-March/037500.html Contributed-under: TianoCore Contribution Agreement 1.1 Signed-off-by: Michael D Kinney <michael.d.kinney@intel.com> Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
2016-11-14IntelFsp2Pkg: Support to return error status from FSP API doneThomaiyar, Richard Marian1-0/+35
Added FspMemoryInitDone2, FspTempRamExitDone2, FspSiliconInitDone2 to return error status to Boot Loader for FSP API calls. To maintain backward compatibility existing functions (FspMemoryInitDone, FspTempRamExitDone, FspSiliconInitDone) declaration left untouched. Cc: Maurice Ma <maurice.ma@intel.com> Cc: Jiewen Yao <jiewen.yao@intel.com> Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com> Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: Richard Thomaiyar <richard.marian.thomaiyar@intel.com> Reviewed-by: Jiewen Yao <jiewen.yao@intel.com> Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
2016-07-18IntelFsp2Pkg BaseFspPlatformLib: Remove Boot Loader tempram MigrationSatya Yarlagadda1-9/+0
In FSP2.0, Boot loader should migrate its temp ram before calling the tempramexit API to tear down the tempram. so, we don't need the function to migrate the BL TempRam in the IntelFsp2Pkg. Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com> Cc: Jiewen Yao <jiewen.yao@intel.com> Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com> Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com> Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
2016-05-13Add IntelFsp2Pkg and IntelFsp2WrapperPkg.Jiewen Yao1-0/+105
Add FSP2.0 support. This series of patch is to support FSP2.0 specification at https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf Some major updates include: 1) One FSP binary is separated to multiple components: FSP-T, FSP-M, FSP-S, and optional FSP-O. Each component has its own configuration data region. 2) All FSP-APIs use same UPD format - FSP_UPD_HEADER. 3) Add EnumInitPhaseEndOfFirmware notifyphase. 4) FSP1.1/FSP1.0 compatibility is NOT maintained. 5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg, to indicate that it is for FspWrapper only. IntelFspPkg and IntelFspWrapperPkg will be deprecated. The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg and IntelFsp2WrapperPkg. The old platform can still use IntelFspPkg and IntelFspWrapperPkg for compatibility consideration. Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com> Cc: Maurice Ma <maurice.ma@intel.com> Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com> Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: Jiewen Yao <jiewen.yao@intel.com> Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com> Reviewed-by: Maurice Ma <maurice.ma@intel.com> Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>