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authorHuang Ying <ying.huang@intel.com>2017-09-07 02:22:30 +0300
committerLinus Torvalds <torvalds@linux-foundation.org>2017-09-07 03:27:28 +0300
commit225311a46411c37e20e73d99f4382f141e12f6f9 (patch)
tree07073d6ba4af58e79fb91cbc7dfb9b985852005e /drivers/s390
parent98cc093cba1e925eb34963dedb5f1684f1bdb2f4 (diff)
downloadlinux-225311a46411c37e20e73d99f4382f141e12f6f9.tar.xz
mm: test code to write THP to swap device as a whole
To support delay splitting THP (Transparent Huge Page) after swapped out, we need to enhance swap writing code to support to write a THP as a whole. This will improve swap write IO performance. As Ming Lei <ming.lei@redhat.com> pointed out, this should be based on multipage bvec support, which hasn't been merged yet. So this patch is only for testing the functionality of the other patches in the series. And will be reimplemented after multipage bvec support is merged. Link: http://lkml.kernel.org/r/20170724051840.2309-7-ying.huang@intel.com Signed-off-by: "Huang, Ying" <ying.huang@intel.com> Cc: "Kirill A . Shutemov" <kirill.shutemov@linux.intel.com> Cc: Andrea Arcangeli <aarcange@redhat.com> Cc: Dan Williams <dan.j.williams@intel.com> Cc: Hugh Dickins <hughd@google.com> Cc: Jens Axboe <axboe@kernel.dk> Cc: Johannes Weiner <hannes@cmpxchg.org> Cc: Michal Hocko <mhocko@kernel.org> Cc: Minchan Kim <minchan@kernel.org> Cc: Rik van Riel <riel@redhat.com> Cc: Ross Zwisler <ross.zwisler@intel.com> [for brd.c, zram_drv.c, pmem.c] Cc: Shaohua Li <shli@kernel.org> Cc: Vishal L Verma <vishal.l.verma@intel.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
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