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Add trace events for the power allocator governor and the power actor
interface of the cpu cooling device.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Frederic Weisbecker <fweisbec@gmail.com>
Cc: Ingo Molnar <mingo@redhat.com>
Acked-by: Steven Rostedt <rostedt@goodmis.org>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The power allocator governor is a thermal governor that controls system
and device power allocation to control temperature. Conceptually, the
implementation divides the sustainable power of a thermal zone among
all the heat sources in that zone.
This governor relies on "power actors", entities that represent heat
sources. They can report current and maximum power consumption and
can set a given maximum power consumption, usually via a cooling
device.
The governor uses a Proportional Integral Derivative (PID) controller
driven by the temperature of the thermal zone. The output of the
controller is a power budget that is then allocated to each power
actor that can have bearing on the temperature we are trying to
control. It decides how much power to give each cooling device based
on the performance they are requesting. The PID controller ensures
that the total power budget does not exceed the control temperature.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add a basic power model to the cpu cooling device to implement the
power cooling device API. The power model uses the current frequency,
current load and OPPs for the power calculations. The cpus must have
registered their OPPs using the OPP library.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add three optional callbacks to the cooling device interface to allow
them to express power. In addition to the callbacks, add helpers to
identify cooling devices that implement the power cooling device API.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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A governor may need to store its current state between calls to
throttle(). That state depends on the thermal zone, so store it as
private data in struct thermal_zone_device.
The governors may have two new ops: bind_to_tz() and unbind_from_tz().
When provided, these functions let governors do some initialization
and teardown when they are bound/unbound to a tz and possibly store that
information in the governor_data field of the struct
thermal_zone_device.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add support for the temperature alarm peripheral found inside
Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm
peripheral outputs a pulse on an interrupt line whenever the
thermal over temperature stage value changes.
Register a thermal sensor. The temperature reported by this thermal
sensor device should reflect the actual PMIC die temperature if an
ADC is present on the given PMIC. If no ADC is present, then the
reported temperature should be estimated from the over temperature
stage value.
Cc: David Collins <collinsd@codeaurora.org>
Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The fair share governor has the concept of weights, which is the
influence of each cooling device in a thermal zone. The current
implementation forces the weights of all cooling devices in a thermal
zone to add up to a 100. This complicates setups, as you need to know
in advance how many cooling devices you are going to have. If you bind a
new cooling device, you have to modify all the other cooling devices
weights, which is error prone. Furthermore, you can't specify a
"default" weight for platforms since that default value depends on the
number of cooling devices in the platform.
This patch generalizes the concept of weight by allowing any number to
be a "weight". Weights are now relative to each other. Platforms that
don't specify weights get the same default value for all their cooling
devices, so all their cdevs are considered to be equally influential.
It's important to note that previous users of the weights don't need to
alter the code: percentages continue to work as they used to. This
patch just removes the constraint of all the weights in a thermal zone
having to add up to a 100. If they do, you get the same behavior as
before. If they don't, fair share now works for that platform.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Durgadoss R <durgadoss.r@intel.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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It's useful to have access to the weights for the cooling devices for
thermal zones and change them if needed. Export them to sysfs.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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s/asscciated/associated/
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Durgadoss R <durgadoss.r@intel.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The fair share governor is not usable with thermal zones that use the
bind op and don't populate thermal_zone_parameters, the majority of
them. Now that the weight is in the thermal instance, we can use that
in the fair share governor to allow every thermal zone to trivially use
this governor. Furthermore, this simplifies the code.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Durgadoss R <durgadoss.r@intel.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Currently you can specify the weight of the cooling device in the device
tree but that information is not populated to the
thermal_bind_params where the fair share governor expects it to
be. The of thermal zone device doesn't have a thermal_bind_params
structure and arguably it's better to pass the weight inside the
thermal_instance as it is specific to the bind of a cooling device to a
thermal zone parameter.
Core thermal code is fixed to populate the weight in the instance from
the thermal_bind_params, so platform code that was passing the weight
inside the thermal_bind_params continue to work seamlessly.
While we are at it, create a default value for the weight parameter for
those thermal zones that currently don't define it and remove the
hardcoded default in of-thermal.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net>
Cc: Len Brown <lenb@kernel.org>
Cc: Peter Feuerer <peter@piie.net>
Cc: Darren Hart <dvhart@infradead.org>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Kukjin Kim <kgene@kernel.org>
Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Use the normal return values for bool functions
Signed-off-by: Joe Perches <joe@perches.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This patch enables intel_powerclamp driver to run on the
next-generation Intel(R) Xeon Phi Microarchitecture
code named "Knights Landing"
Signed-off-by: Dasaratharaman Chandramouli <dasaratharaman.chandramouli@intel.com>
Acked-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Add PCI ID of Skylake thermal reporting device.
Signed-off-by: Brian Bian <brian.bian@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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drivers/thermal/intel_soc_dts_iosf.c:358:4-7: WARNING: end returns can be simpified
Simplify a trivial if-return sequence. Possibly combine with a
preceding function call.
Generated by: scripts/coccinelle/misc/simple_return.cocci
CC: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Fengguang Wu <fengguang.wu@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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In Intel Quark SoC X1000, there is one on-die digital temperature sensor(DTS).
The DTS offers both hot & critical trip points.
However, in current distribution of UEFI BIOS for Quark platform, only
critical trip point is configured to be 105 degree Celsius (based on Quark
SW ver1.0.1 and hot trip point is not used due to lack of IRQ.
There is no active cooling device for Quark SoC, so Quark SoC thermal
management logic expects Linux distro to orderly power-off when temperature
of the DTS exceeds the configured critical trip point.
Kernel param "polling_delay" in milliseconds is used to control the frequency
the DTS temperature is read by thermal framework. It defaults to 2-second.
To change it, use kernel boot param "intel_quark_dts_thermal.polling_delay=X".
User interacts with Quark SoC DTS thermal driver through sysfs via:
/sys/class/thermal/thermal_zone0/
For example:
- to read DTS temperature
$ cat temp
- to read critical trip point
$ cat trip_point_0_temp
- to read trip point type
$ cat trip_point_0_type
- to emulate temperature raise to test orderly shutdown by Linux distro
$ echo 105 > emul_temp
Tested-by: Bryan O'Donoghue <pure.logic@nexus-software.ie>
Signed-off-by: Ong Boon Leong <boon.leong.ong@intel.com>
Reviewed-by: Bryan O'Donoghue <pure.logic@nexus-software.ie>
Reviewed-by: Kweh, Hock Leong <hock.leong.kweh@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Support two auxiliary DTS present on Braswell platform using side band
IOSF interface. This supports two read write trips, which can be used
to get notification on trip violation.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
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There is no change in functionality but using the common IOSF core APIs.
This driver is now just responsible for enumeration and call relevant
API to create thermal zone and register critical trip.
Also cpuid 0x4c is now handled in the int340x processor thermal driver
with the same functionality.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
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This is becoming a common feature for Intel SoCs to expose the additional
digital temperature sensors (DTSs) using side band interface (IOSF). This
change remove common IOSF DTS handler function from the existing driver
intel_soc_dts_thermal.c and creates a stand alone module, which can
be selected from the SoC specific drivers. In this way there is less
code duplication.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
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Simple patch to make symbols static. Symbols that are not
shared with other parts of the kernel can be made static.
This change also removes several sparse complains.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Lee Jones <lee.jones@linaro.org>
Cc: Pavel Machek <pavel@ucw.cz>
Cc: Ajit Pal Singh <ajitpal.singh@st.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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of_device_id is always used as const.
(See driver.of_match_table and open firmware functions)
Signed-off-by: Fabian Frederick <fabf@skynet.be>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Some temperature sensors only get updated every few seconds and while
waiting for the first irq reporting a (new) temperature to happen there
get_temp operand will return -EAGAIN as it does not have any data to report
yet.
Not logging an error in this case avoids messages like these from showing
up in dmesg on affected systems:
[ 1.219353] thermal thermal_zone0: failed to read out thermal zone 0
[ 2.015433] thermal thermal_zone0: failed to read out thermal zone 0
[ 2.416737] thermal thermal_zone0: failed to read out thermal zone 0
Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Signed-off-by: Hans de Goede <hdegoede@redhat.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Default attributes are created when the device is registered. Attributes
created after device registration can lead to race conditions, where user space
(e.g. udev) sees the device but not the attributes.
Signed-off-by: Matthias Kaehlcke <mka@chromium.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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When thermal zone device register fails or on module exit, the memory
for aux_trip is not freed. This change fixes this issue.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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This patch fixes the wrong control of PD_DET_EN (power down detection mode)
for Exynos7 because exynos7_tmu_control() always enables the power down detection
mode regardless 'on' parameter.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>
Tested-by: Abhilash Kesavan <a.kesavan@samsung.com>
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
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It is possible that _ART/_TRT tables are missing or have errors.
Ignore those failures, as INT3400 thermal zone is still required
for _OSC or mode switch.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Enable Intel Powerclamp driver on Atom* Processor C2000 Product
Family for Microservers (Avoton). Avoton - SoCs for micro-servers
has package C-states which can be used for idle injection.
Reported-by: Jose Navarro <jose.navarro@intel.com>
Suggested-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Tested-by: Jose Carlos Venegas Munoz <jos.c.venegas.munoz@intel.com>
Signed-off-by: Miguel Bernal Marin <miguel.bernal.marin@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This patch cleanup the code to use oneline for entry of exynos compatible
table.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>
Acked-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Swap interrupt disable and thermal zone unregistration in the error and
remove paths, to make them more symmetrical with the initialization
path.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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As soon as the interrupt has been enabled by devm_request_irq(), the
interrupt routine may be called, depending on the current status of the
hardware.
However, at that point rcar_thermal_common hasn't been initialized
complely yet. E.g. rcar_thermal_common.base is still NULL, causing a
NULL pointer dereference:
Unable to handle kernel NULL pointer dereference at virtual address 0000000c
pgd = c0004000
[0000000c] *pgd=00000000
Internal error: Oops: 5 [#1] SMP ARM
CPU: 0 PID: 1 Comm: swapper/0 Not tainted 3.19.0-rc7-ape6evm-04564-gb6e46cb7cbe82389 #30
Hardware name: Generic R8A73A4 (Flattened Device Tree)
task: ee8953c0 ti: ee896000 task.ti: ee896000
PC is at rcar_thermal_irq+0x1c/0xf0
LR is at _raw_spin_lock_irqsave+0x48/0x54
Postpone the call to devm_request_irq() until all initialization has
been done to fix this.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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"cpufreq_cooling_unregister"
The cpufreq_cooling_unregister() function tests whether its argument is NULL
and then returns immediately. Thus the test around the call is not needed.
This issue was detected by using the Coccinelle software.
Signed-off-by: Markus Elfring <elfring@users.sourceforge.net>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Fix following build warning if CONFIG_PM_SLEEP is not set:
drivers/thermal/ti-soc-thermal/ti-bandgap.c:1478:12: warning: 'ti_bandgap_suspend' defined but not used [-Wunused-function]
static int ti_bandgap_suspend(struct device *dev)
^
drivers/thermal/ti-soc-thermal/ti-bandgap.c:1492:12: warning: 'ti_bandgap_resume' defined but not used [-Wunused-function]
static int ti_bandgap_resume(struct device *dev)
^
Acked-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Grygorii Strashko <Grygorii.Strashko@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The exynos_tmu_data() function should on entrance test not only for valid
data pointer, but also for data->tmu_read one.
It is important, since afterwards it is dereferenced to get temperature code.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Tested-by: Abhilash Kesavan <a.kesavan@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal
Pull more thermal managament updates from Zhang Rui:
"Specifics:
- Exynos thermal driver refactoring. Several cleanups, code
optimization, unused symbols removal, and unused feature removal in
Exynos thermal driver. Thanks Lukasz for this effort.
- Exynos thermal driver support to OF thermal. After the code
refactoring, the driver earned the support to OF thermal. Chip
thermal data were moved from driver code to DTS, reducing the code
footprint. Thanks Lukasz for this.
- After receiving the OF thermal support, the exynos thermal driver
now must allow modular build. Thanks Arnd for detecting, reporting
and fixing this.
- Exynos thermal driver support to Exynos 7 SoC. Thanks Abhilash for
this.
- Accurate temperature reporting on Rockchip thermal driver, thanks
to Caesar.
- Fix on how OF thermal enables its zones, thanks Lukasz for fixing.
- Fixes in OF thermal examples under Documentation/. Thanks Srinivas
for fixing"
* 'fixes' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal:
thermal: exynos: Add TMU support for Exynos7 SoC
dts: Documentation: Add documentation for Exynos7 SoC thermal bindings
cpufreq: exynos: allow modular build
thermal: Fix examples in DT documentation
thermal: exynos: Correct sanity check at exynos_report_trigger() function
thermal: Kconfig: Remove config for not used EXYNOS_THERMAL_CORE
thermal: exynos: Remove exynos_tmu_data.c file
thermal: rockchip: make temperature reporting much more accurate
thermal: exynos: Remove exynos_thermal_common.[c|h] files
thermal: samsung: core: Exynos TMU rework to use device tree for configuration
dts: Documentation: Update exynos-thermal.txt example for Exynos5440
dts: Documentation: Extending documentation entry for exynos-thermal
cpufreq: exynos: Use device tree to determine if cpufreq cooling should be registered
thermal: exynos: Modify exynos thermal code to use device tree for cpu cooling configuration
thermal: exynos: Provide thermal_exynos.h file to be included in device tree files
thermal: exynos: cosmetic: Correct comment format
thermal: of: Enable thermal_zoneX when sensor is correctly added
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git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal managament updates from Zhang Rui:
"Specifics:
- Abstract the code and introduce helper functions for all int340x
thermal drivers. From: Srinivas Pandruvada.
- Reorganize the ACPI LPAT table support code so that it can be
shared for both ACPI PMIC driver and int340x thermal driver.
- Add support for Braswell in intel_soc_dts thermal driver.
- a couple of small fixes/cleanups for step_wise governor and int340x
thermal driver"
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
Thermal/int340x_thermal: remove unused uuids.
thermal: step_wise: spelling fixes
thermal: int340x: fix sparse warning
Thermal/int340x: LPAT conversion for temperature
ACPI / PMIC: Use common LPAT table handling functions
ACPI / LPAT: Common table processing functions
thermal: Intel SoC DTS: Add Braswell support
Thermal/int340x/int3402: Provide notification support
Thermal/int340x/processor_thermal: Add thermal zone support
Thermal/int340x/int3403: Use int340x thermal API
Thermal/int340x/int3402: Use int340x thermal API
Thermal/int340x: Add common thermal zone handler
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Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Signed-off-by: Brian Norris <computersforpeace@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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this patch fixes following sparse warning:
processor_thermal_device.c:188:6: warning: symbol 'proc_thermal_remove' was not declared. Should it be static?
Signed-off-by: Lad, Prabhakar <prabhakar.csengg@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Add registers, bit fields and compatible strings for Exynos7 TMU
(Thermal Management Unit). Following are a few of the differences
in the Exynos7 TMU from earlier SoCs:
- 8 trigger levels
- Different bit offsets and more registers for the rising
and falling thresholds.
- New power down detection bit in the TMU_CONTROL register
which does not update the CURRENT_TEMP0 when tmu power down
is detected.
- Change in bit offset for the NEXT_DATA field of EMUL_CON
register. EMUL_CON register address has also changed.
- INTSTAT and INTCLEAR registers present in earlier SoCs
have been combined into one INTPEND register. The register
address for INTCLEAR and INTPEND is also different.
- Since there are 8 rising/falling interrupts as against
at most 4 in earlier SoCs the INTEN bit offsets are different.
- Multiple probe support which is handled by a TMU_CONTROL1
register (No support for this in the current patch).
This patch adds special clock support required only for Exynos7. It
also updates the "code_to_temp" prototype as Exynos7 has 9 bit
code-temp mapping.
Acked-by: Lukasz Majewski <l.majewski@samsung.com>
Tested-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Abhilash Kesavan <a.kesavan@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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into next
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When LPAT table is present, we need to convert raw temperature to
real temp using LPAT.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Added Intel Braswell CPU id for SOC DTS. Since this doesn't support
APIC IRQ, the driver is modified to have capability to not register
any modifiable trips.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Up till now, by mistake, wrong variable was tested against being NULL.
Since exynos_report_trigger() is always called with valid p pointer,
it is only necessary to check if a valid thermal zone device is passed.
Reported-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Conflicts:
arch/arm/boot/dts/imx6sx-sdb.dts
net/sched/cls_bpf.c
Two simple sets of overlapping changes.
Signed-off-by: David S. Miller <davem@davemloft.net>
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After removing exynos_thermal_common.[c|h] files the CONFIG_EXYNOS_THERMA_CORE
is not needed anymore.
This patch removes this entry from Kconfig.
Reported-by: Paul Bolle <pebolle@tiscali.nl>
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Data already present in the exynos_tmu_data.c file has been moved to the
appropriate device tree files.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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In general, the kernel should report temperature readings exactly as
reported by the hardware. The cpu / gpu thermal driver works in 5 degree
increments,but we ought to do more accurate. The temperature will do
linear interpolation between the entries in the table.
Test= $md5sum /dev/zero &
$while true; do grep "" /sys/class/thermal/thermal_zone[1-2]/temp;
sleep .5; done
e.g. We can get the result as follows:
/sys/class/thermal/thermal_zone1/temp:39994
/sys/class/thermal/thermal_zone2/temp:39086
/sys/class/thermal/thermal_zone1/temp:39994
/sys/class/thermal/thermal_zone2/temp:39540
/sys/class/thermal/thermal_zone1/temp:39540
/sys/class/thermal/thermal_zone2/temp:39540
/sys/class/thermal/thermal_zone1/temp:39540
/sys/class/thermal/thermal_zone2/temp:39994
Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Reviewed-by: Daniel Kurtz <djkurtz@chromium.org>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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After defining all necessary Exynos data in the device tree and heavy
reusage of the of-thermal.c those files can be removed.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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This patch brings support for providing configuration via device tree.
Previously this data has been hardcoded in the exynos_tmu_data.c file.
Such approach was not scalable and very often required copying the whole
data.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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cooling configuration
Up till now exynos_tmu_data.c was used for storing CPU cooling configuration
data. Now the Exynos thermal core code uses device tree to get this data.
For this purpose generic thermal code for configuring CPU cooling was
used.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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