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git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:
"The top merge commit was re-generated yesterday because two topic
branches were dropped from this pull request in the last minute due to
some unaddressed comments. All the other material has been in
linux-next for quite a while.
Specifics:
- Enhance thermal core to handle unexpected device cooling states
after fresh boot and system resume. From Zhang Rui and Chen Yu.
- Several fixes and cleanups on Rockchip and RCAR thermal drivers.
From Caesar Wang and Kuninori Morimoto.
- Add Broxton support for Intel processor thermal reporting device
driver. From Amy Wiles"
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
thermal: trip_point_temp_store() calls thermal_zone_device_update()
thermal: rcar: rcar_thermal_get_temp() return error if strange temp
thermal: rcar: check irq possibility in rcar_thermal_irq_xxx()
thermal: rcar: check every rcar_thermal_update_temp() return value
thermal: rcar: move rcar_thermal_dt_ids to upside
thermal: rockchip: Support the RK3399 SoCs in thermal driver
thermal: rockchip: Support the RK3228 SoCs in thermal driver
dt-bindings: rockchip-thermal: Support the RK3228/RK3399 SoCs compatible
thermal: rockchip: fix a trivial typo
Thermal: Enable Broxton SoC thermal reporting device
thermal: constify pch_dev_ops structure
Thermal: do thermal zone update after a cooling device registered
Thermal: handle thermal zone device properly during system sleep
Thermal: initialize thermal zone device correctly
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git://git.kernel.org/pub/scm/linux/kernel/git/powerpc/linux
Pull powerpc updates from Michael Ellerman:
"Core:
- Ground work for the new Power9 MMU from Aneesh Kumar K.V
- Optimise FP/VMX/VSX context switching from Anton Blanchard
Misc:
- Various cleanups from Krzysztof Kozlowski, John Ogness, Rashmica
Gupta, Russell Currey, Gavin Shan, Daniel Axtens, Michael Neuling,
Andrew Donnellan
- Allow wrapper to work on non-english system from Laurent Vivier
- Add rN aliases to the pt_regs_offset table from Rashmica Gupta
- Fix module autoload for rackmeter & axonram drivers from Luis de
Bethencourt
- Include KVM guest test in all interrupt vectors from Paul Mackerras
- Fix DSCR inheritance over fork() from Anton Blanchard
- Make value-returning atomics & {cmp}xchg* & their atomic_ versions
fully ordered from Boqun Feng
- Print MSR TM bits in oops messages from Michael Neuling
- Add TM signal return & invalid stack selftests from Michael Neuling
- Limit EPOW reset event warnings from Vipin K Parashar
- Remove the Cell QPACE code from Rashmica Gupta
- Append linux_banner to exception information in xmon from Rashmica
Gupta
- Add selftest to check if VSRs are corrupted from Rashmica Gupta
- Remove broken GregorianDay() from Daniel Axtens
- Import Anton's context_switch2 benchmark into selftests from
Michael Ellerman
- Add selftest script to test HMI functionality from Daniel Axtens
- Remove obsolete OPAL v2 support from Stewart Smith
- Make enter_rtas() private from Michael Ellerman
- PPR exception cleanups from Michael Ellerman
- Add page soft dirty tracking from Laurent Dufour
- Add support for Nvlink NPUs from Alistair Popple
- Add support for kexec on 476fpe from Alistair Popple
- Enable kernel CPU dlpar from sysfs from Nathan Fontenot
- Copy only required pieces of the mm_context_t to the paca from
Michael Neuling
- Add a kmsg_dumper that flushes OPAL console output on panic from
Russell Currey
- Implement save_stack_trace_regs() to enable kprobe stack tracing
from Steven Rostedt
- Add HWCAP bits for Power9 from Michael Ellerman
- Fix _PAGE_PTE breaking swapoff from Aneesh Kumar K.V
- Fix _PAGE_SWP_SOFT_DIRTY breaking swapoff from Hugh Dickins
- scripts/recordmcount.pl: support data in text section on powerpc
from Ulrich Weigand
- Handle R_PPC64_ENTRY relocations in modules from Ulrich Weigand
cxl:
- cxl: Fix possible idr warning when contexts are released from
Vaibhav Jain
- cxl: use correct operator when writing pcie config space values
from Andrew Donnellan
- cxl: Fix DSI misses when the context owning task exits from Vaibhav
Jain
- cxl: fix build for GCC 4.6.x from Brian Norris
- cxl: use -Werror only with CONFIG_PPC_WERROR from Brian Norris
- cxl: Enable PCI device ID for future IBM CXL adapter from Uma
Krishnan
Freescale:
- Freescale updates from Scott: Highlights include moving QE code out
of arch/powerpc (to be shared with arm), device tree updates, and
minor fixes"
* tag 'powerpc-4.5-1' of git://git.kernel.org/pub/scm/linux/kernel/git/powerpc/linux: (149 commits)
powerpc/module: Handle R_PPC64_ENTRY relocations
scripts/recordmcount.pl: support data in text section on powerpc
powerpc/powernv: Fix OPAL_CONSOLE_FLUSH prototype and usages
powerpc/mm: fix _PAGE_SWP_SOFT_DIRTY breaking swapoff
powerpc/mm: Fix _PAGE_PTE breaking swapoff
cxl: Enable PCI device ID for future IBM CXL adapter
cxl: use -Werror only with CONFIG_PPC_WERROR
cxl: fix build for GCC 4.6.x
powerpc: Add HWCAP bits for Power9
powerpc/powernv: Reserve PE#0 on NPU
powerpc/powernv: Change NPU PE# assignment
powerpc/powernv: Fix update of NVLink DMA mask
powerpc/powernv: Remove misleading comment in pci.c
powerpc: Implement save_stack_trace_regs() to enable kprobe stack tracing
powerpc: Fix build break due to paca mm_context_t changes
cxl: Fix DSI misses when the context owning task exits
MAINTAINERS: Update Scott Wood's e-mail address
powerpc/powernv: Fix minor off-by-one error in opal_mce_check_early_recovery()
powerpc: Fix style of self-test config prompts
powerpc/powernv: Only delay opal_rtc_read() retry when necessary
...
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This patchset attempts to new compatible for thermal founding
on RK3228/RK3399 SoCs.
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add bindings documentation for TMU (Thermal Monitoring Unit) on QorIQ
platform.
Signed-off-by: Jia Hongtao <hongtao.jia@freescale.com>
Reviewed-by: Scott Wood <scottwood@freescale.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Scott Wood <scottwood@freescale.com>
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This patchset attempts to new compatible for thermal founding
on RK3368 SoCs.
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The "init" pinctrl is defined we'll set
pinctrl to this state before probe and then "default" after probe.
Add the "init" and "sleep" pinctrl as the OTP gpio state, since we need
switch the pin to gpio state before the TSADC controller is reset.
AFAIK, the TSADC controller is reset, the tshut polarity will be
a *low* signal in a short period of time for some devices.
Says:
The TSADC get the temperature on rockchip thermal.
If T(current temperature) < (setting temperature), the OTP output the
*high* signal.
If T(current temperature) > (setting temperature), the OTP output the
*low* Signal.
In some cases, the OTP pin is connected to the PMIC, maybe the
PMIC can accept the reset response time to avoid this issue.
In other words, the system will be always reboot if we make the
OTP pin is connected the others IC to control the power.
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Reviewed-by: Douglas Anderson <dianders@chromium.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add OMAP36xx support to ti-soc-thermal driver. This
chip is also unreliable. The data provided here is
based on OMAP36xx TRM:
http://www.ti.com/lit/ug/swpu177aa/swpu177aa.pdf
Signed-off-by: Eduardo Valentin <edubezva@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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This adds support for OMAP3 chips to ti-soc-thermal. As requested by
TI people, it is marked unreliable and warning is printed.
Signed-off-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The cooling-{min,max}-level properties are marked as optional in
Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt and the usage
in various device tree matches this, i.e., some cooling device in the
device trees provide these properties while others do not.
Make the bindings in
Documentation/devicetree/bindings/thermal/thermal.txt consistent with
the cpufreq-dt bindings by marking the cooling-*-level properties as
optional.
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Ian Campbell <ijc+devicetree@hellion.org.uk>
Cc: Kumar Gala <galak@codeaurora.org>
Signed-off-by: Rob Herring <robh@kernel.org>
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The device trees in the kernel as well as the binding description in
Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt use the
cooling-{min,max}-level property.
Fix the inconsistency with the binding description in
Documentation/devicetree/bindings/thermal/thermal.txt by changing
cooling-*-state properties to cooling-*-level.
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Ian Campbell <ijc+devicetree@hellion.org.uk>
Cc: Kumar Gala <galak@codeaurora.org>
Signed-off-by: Rob Herring <robh@kernel.org>
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This adds documentation of device tree bindings for the
thermal sensor controller of hi6220 SoC.
Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Introduce an optional property called, sustainable-power, which
represents the power (in mW) which the thermal zone can safely
dissipate.
If provided the property is parsed and associated with the thermal
zone via the thermal zone parameters.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add support for the temperature alarm peripheral found inside
Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm
peripheral outputs a pulse on an interrupt line whenever the
thermal over temperature stage value changes.
Register a thermal sensor. The temperature reported by this thermal
sensor device should reflect the actual PMIC die temperature if an
ADC is present on the given PMIC. If no ADC is present, then the
reported temperature should be estimated from the over temperature
stage value.
Cc: David Collins <collinsd@codeaurora.org>
Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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r8a73a4 is R-Mobile APE6, not AP6.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal
Pull more thermal managament updates from Zhang Rui:
"Specifics:
- Exynos thermal driver refactoring. Several cleanups, code
optimization, unused symbols removal, and unused feature removal in
Exynos thermal driver. Thanks Lukasz for this effort.
- Exynos thermal driver support to OF thermal. After the code
refactoring, the driver earned the support to OF thermal. Chip
thermal data were moved from driver code to DTS, reducing the code
footprint. Thanks Lukasz for this.
- After receiving the OF thermal support, the exynos thermal driver
now must allow modular build. Thanks Arnd for detecting, reporting
and fixing this.
- Exynos thermal driver support to Exynos 7 SoC. Thanks Abhilash for
this.
- Accurate temperature reporting on Rockchip thermal driver, thanks
to Caesar.
- Fix on how OF thermal enables its zones, thanks Lukasz for fixing.
- Fixes in OF thermal examples under Documentation/. Thanks Srinivas
for fixing"
* 'fixes' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal:
thermal: exynos: Add TMU support for Exynos7 SoC
dts: Documentation: Add documentation for Exynos7 SoC thermal bindings
cpufreq: exynos: allow modular build
thermal: Fix examples in DT documentation
thermal: exynos: Correct sanity check at exynos_report_trigger() function
thermal: Kconfig: Remove config for not used EXYNOS_THERMAL_CORE
thermal: exynos: Remove exynos_tmu_data.c file
thermal: rockchip: make temperature reporting much more accurate
thermal: exynos: Remove exynos_thermal_common.[c|h] files
thermal: samsung: core: Exynos TMU rework to use device tree for configuration
dts: Documentation: Update exynos-thermal.txt example for Exynos5440
dts: Documentation: Extending documentation entry for exynos-thermal
cpufreq: exynos: Use device tree to determine if cpufreq cooling should be registered
thermal: exynos: Modify exynos thermal code to use device tree for cpu cooling configuration
thermal: exynos: Provide thermal_exynos.h file to be included in device tree files
thermal: exynos: cosmetic: Correct comment format
thermal: of: Enable thermal_zoneX when sensor is correctly added
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Align compatible strings for several IP blocks present on Tegra chips
with the latest doctrine from the DT maintainers:
http://marc.info/?l=devicetree&m=142255654213019&w=2
The primary objective here is to avoid checkpatch warnings, per:
http://marc.info/?l=linux-tegra&m=142201349727836&w=2
DT binding text files have been updated for the following IP blocks:
- PCIe
- SOR
- SoC timers
- AHB "gizmo"
- APB_MISC
- pinmux control
- UART
- PWM
- I2C
- SPI
- RTC
- PMC
- eFuse
- AHCI
- HDA
- XUSB_PADCTRL
- SDHCI
- SOC_THERM
- AHUB
- I2S
- EHCI
- USB PHY
N.B. The nvidia,tegra20-timer compatible string is removed from the
nvidia,tegra30-timer.txt documentation file because it's already
mentioned in the nvidia,tegra20-timer.txt documentation file.
This second version takes into account the following requests from
Rob Herring <robherring2@gmail.com>:
- Per-IP block patches have been combined into a single patch
- Explicit documentation about which compatible strings are actually
matched by the driver has been removed. In its place is implicit
documentation that loosely follows Rob's prescribed format:
"Must contain '"nvidia,<chip>-pcie", "nvidia,tegra20-pcie"' where
<chip> is tegra30, tegra132, ..." [...] "You should attempt to
document known values of <chip> if you use it"
Signed-off-by: Paul Walmsley <paul@pwsan.com>
Cc: Alexandre Courbot <gnurou@gmail.com>
Cc: Dylan Reid <dgreid@chromium.org>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Hans de Goede <hdegoede@redhat.com>
Cc: Ian Campbell <ijc+devicetree@hellion.org.uk>
Cc: Jingchang Lu <jingchang.lu@freescale.com>
Cc: John Crispin <blogic@openwrt.org>
Cc: Kumar Gala <galak@codeaurora.org>
Cc: Linus Walleij <linus.walleij@linaro.org>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Mikko Perttunen <mperttunen@nvidia.com>
Cc: Murali Karicheri <m-karicheri2@ti.com>
Cc: Paul Walmsley <pwalmsley@nvidia.com>
Cc: Pawel Moll <pawel.moll@arm.com>
Cc: Peter De Schrijver <pdeschrijver@nvidia.com>
Cc: Peter Hurley <peter@hurleysoftware.com>
Cc: Sean Paul <seanpaul@chromium.org>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Takashi Iwai <tiwai@suse.de>
Cc: Tejun Heo <tj@kernel.org>
Cc: "Terje Bergström" <tbergstrom@nvidia.com>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: Tuomas Tynkkynen <ttynkkynen@nvidia.com>
Cc: Wolfram Sang <wsa@the-dreams.de>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: dri-devel@lists.freedesktop.org
Cc: linux-i2c@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: linux-pci@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: linux-pwm@vger.kernel.org
Cc: linux-tegra@vger.kernel.org
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Rob Herring <robh@kernel.org>
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Add documentation for exynos7 thermal bindings including compatible
name and special clock properties.
Acked-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Abhilash Kesavan <a.kesavan@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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There are various issues with the examples in this documentation, some
of the DT labels are invalid and one of the macro THERMAL_NO_LIMITS
referenced is not available as well.
This patch attempts to fix such errors in the documentation.
Signed-off-by: Srinivas Kandagatla <srinivas.kandagatla@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Updating exynos-thermal.txt documentation entry for Exynos5440
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Properties necessary for providing Exynos thermal configuration via device
tree.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The Armada 375 Z1 SoC revision is no longer supported. This commit
removes the quirk needed for the thermal sensor.
Acked-by: Jason Cooper <jason@lakedaemon.net>
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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This add the necessary binding documentation for the thermal
found on Rockchip SoCs
Signed-off-by: zhaoyifeng <zyf@rock-chips.com>
Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com>
Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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This adds binding documentation and headers for the Tegra124
SOCTHERM device tree node.
Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Acked-by: Stephen Warren <swarren@nvidia.com>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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- r8a7792 (R-Car V2H)
- r8a7793 (R-Car M2-N)
- r8a7794 (R-Car E2)
r8a7791 is now called "R-Car M2-W".
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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i.MX6SX has some new features of thermal interrupt function,
there are LOW, HIGH and PANIC irq for thermal sensor, so add
platform data to separate different thermal version;
The reset value of LOW ALARM is 0 which means the highest
temp, so the LOW ALARM will be triggered once irq is enabled,
so we need to correct it before enabling thermal irq;
Enable PANIC ALARM as critical trip point, it will trigger
system reset via SRC module once PANIC IRQ is triggered, it
is pure hardware function, so use it instead of software
reset by cooling device.
Signed-off-by: Anson Huang <b20788@freescale.com>
Tested-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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and 'sti-thermal' of .git into next
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The documentation only mentioned the generic fallback compatible property.
Add the missing SoC-specific compatible properties, some of which are
already in use.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: linux-pm@vger.kernel.org
Acked-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This patch add registers, bit fields and compatible strings for Exynos3250 TMU
(Thermal Management Unit). Exynos3250 uses the Cortex-A7 dual cores and has
a target speed of 1.0 GHz.
Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>
[Add MUX address setting bits by Jonghwa Lee]
Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Kyungmin Park <kyungmin.park@samsung.com>
Reviewed-by: Amit Daniel Kachhap<amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Signed-off-by: Ajit Pal Singh <ajitpal.singh@st.com>
Acked-by: Peter Griffin <peter.griffin@linaro.org>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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'intel-soc-dts-thermal' and 'thermal-soc-fixes' of .git into next
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Now that a generic infrastructure is in place, it's possible to support
the Armada 380 SoC thermal sensor. This sensor is similar to the one
available in the already supported SoCs, with its specific temperature formula
and specific sensor initialization.
Acked-by: Jason Cooper <jason@lakedaemon.net>
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Now that a generic infrastructure is in place, it's possible to support
the new Armada 375 SoC thermal sensor. This sensor is similar to the one
available in the already supported SoCs, with its specific temperature formula
and specific sensor initialization.
In addition, we also add support for the Z1 SoC stepping, which needs
an initialization-quirk to work properly.
Acked-by: Jason Cooper <jason@lakedaemon.net>
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This patch adds the registers, bit fields and compatible strings
required to support for the 5 TMU channels on Exynos5260.
Signed-off-by: Naveen Krishna Chatradhi <ch.naveen@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Exynos5420 has 5 TMU channels, the TRIMINFO register is
misplaced for TMU channels 2, 3 and 4
TRIMINFO at 0x1006c000 contains data for TMU channel 3
TRIMINFO at 0x100a0000 contains data for TMU channel 4
TRIMINFO at 0x10068000 contains data for TMU channel 2
This patch
1 Adds the neccessary register changes and arch information
to support Exynos5420 SoCs.
2. Handles the gate clock for misplaced TRIMINFO register
3. Updates the Documentation at
Documentation/devicetree/bindings/thermal/exynos-thermal.txt
Signed-off-by: Naveen Krishna Chatradhi <ch.naveen@samsung.com>
Signed-off-by: Andrew Bresticker <abrestic@chromium.org>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Tomasz Figa <t.figa@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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On Exynos5440 and Exynos5420 there are registers common
across the TMU channels.
To support that, we introduced a ADDRESS_MULTIPLE flag in the
driver and the 2nd set of register base and size are provided
in the "reg" property of the node.
As per Amit's suggestion, this patch changes the base_common
to base_second and SHARED_MEMORY to ADDRESS_MULTIPLE.
Signed-off-by: Naveen Krishna Chatradhi <ch.naveen@samsung.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Tomasz Figa <t.figa@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Thermal sensor needs pll3_usb_otg when measuring temperature,
otherwise the temperature read will be incorrect, so need to
enable this clk before sensor working, for alarm function,
as hardware will take measurement periodically, so we should
keep this clk always on once alarm function is enabled.
Signed-off-by: Anson Huang <b20788@freescale.com>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.
This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.
This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.
Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
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Proper description for Exynos4 bindings added to Documentation/devicetree/
bindings. It adds description to use multiple TMU instances, optional voltage
supply node and optional shared register across multiple TMU's.
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
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This is based on the initial imx thermal work done by
Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still
valid). Since he is no longer interested in the work and I have
rewritten a significant amount of the code, I just took the authorship
over from him.
It adds the imx thermal support using Temperature Monitor (TEMPMON)
block found on some Freescale i.MX SoCs. The driver uses syscon regmap
interface to access TEMPMON control registers and calibration data, and
supports cpufreq as the cooling device.
Signed-off-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
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This change updates the ti-soc-thermal driver to use
standard GPIO DT bindings to read the GPIO number associated
to thermal shutdown IRQ, in case the device features it.
Previously, the code was using a specific DT bindings.
As now OMAP supports the standard way to model GPIOs,
there is no point in having a ti specific binding.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devicetree-discuss@lists.ozlabs.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
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Update documentation by adding an example for DRA752 on DT description.
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Add missing irq line for TALERT on DT entry for OMAP5430.
Cc: linux-pm@vger.kernel.org
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This patch moves the ti-soc-thermal driver out of
the staging tree to the thermal tree.
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: Radhesh Fadnis <radhesh.fadnis@ti.com>
Cc: Cyril Roelandt <tipecaml@gmail.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devel@driverdev.osuosl.org
Cc: linux-pm@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This driver supports both Armada 370 and Armada XP SoC
thermal management controllers.
Armada 370 has a register to check a valid temperature, whereas
Armada XP does not. Each has a different initialization (i.e. calibration)
function. The temperature conversion formula is the same for both.
The controller present in each SoC have a very similar feature set,
so it corresponds to have one driver to support both of them.
Although this driver may present similarities to Dove and Kirkwood
thermal driver, the exact differences and coincidences are not fully
known. For this reason, support is given through a separate driver.
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The Marvell Dove SoC has a thermal sensor. Add a driver using the
thermal framework.
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor.
Signed-off-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org>
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Support for loading the Renesas R-Car thermal module via devicetree.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This driver is based on the thermal management framework in thermal_sys.c. A
thermal zone device is created with the trip points to which cooling devices
can be bound, the current cooling device is cpufreq, e.g. CPU frequency is
clipped down to cool the CPU, and other cooling devices can be added and bound
to the trip points dynamically. The platform specific PRCMU interrupts are
used to active thermal update when trip points are reached.
Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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