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ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux into thermal
Merge thermal drivers updates for 6.11-rc1 from Daniel Lezcano:
"- Group all Renesas drivers inside a dedicated sub directory and add
the missing dependency to OF (Niklas Söderlund)
- Add suspend/resume support on k3_j72xx_bandgap and take the
opportunity to remove a unneeded delay in the init time code path
(Théo Lebrun)
- Fix thermal zone definition for MT8186 and MT8188 (Julien Panis)
- Convert hisilicon-thermal.txt to dt-schema (Abdulrasaq Lawani)
- Add the DT bindings for the X1E80100 temperature sensor (Abel Vesa)
- Fix the thermal zone node name regular expression in the DT schema
(Krzysztof Kozlowski)
- Take into account some production platforms may not have calibration
data. Deal with it with a default value instead of failing the
initialization (Chen-Yu Tsai)
- Fix the sensor cell size on the Exynos platform (Krzysztof Kozlowski)
- Bring the common definition of '#thermal-sensor-cells' property in
order to simplify the bindings on all the platforms where this
change makes sense and do some minor cleanups (Krzysztof Kozlowski)
- Fix a race between removal and clock disable on the broadcom driver
(Krzysztof Kozlowski)
- Drop 'trips' node as required from the thermal zone bindings in
order to fix the remaining warnings appearing with thermal zone
whithout trip points defined (Rob Herring)
- Simplify all the drivers where dev_err_probe() can apply (Krzysztof
Kozlowski)
- Cleanup code related to stih416 as this platform is not described
anywhere (Raphael Gallais-Pou)"
* tag 'thermal-v6.11-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (45 commits)
thermal/drivers/sti: Cleanup code related to stih416
thermal/drivers/generic-adc: Simplify with dev_err_probe()
thermal/drivers/generic-adc: Simplify probe() with local dev variable
thermal/drivers/qcom-tsens: Simplify with dev_err_probe()
thermal/drivers/qcom-spmi-adc-tm5: Simplify with dev_err_probe()
thermal/drivers/imx: Simplify with dev_err_probe()
thermal/drivers/imx: Simplify probe() with local dev variable
thermal/drivers/hisi: Simplify with dev_err_probe()
thermal/drivers/exynos: Simplify with dev_err_probe()
thermal/drivers/exynos: Simplify probe() with local dev variable
thermal/drivers/broadcom: Simplify with dev_err_probe()
thermal/drivers/broadcom: Simplify probe() with local dev variable
thermal/drivers/broadcom: Fix race between removal and clock disable
dt-bindings: thermal: Drop 'trips' node as required
dt-bindings: thermal: qoriq: reference thermal-sensor schema
dt-bindings: thermal: cleanup examples indentation
dt-bindings: thermal: simplify few bindings
dt-bindings: thermal: ti,j72xx: reference thermal-sensor schema
dt-bindings: thermal: ti,am654: reference thermal-sensor schema
dt-bindings: thermal: st,stm32: reference thermal-sensor schema
...
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"st,stih416-mpe-thermal" compatible seems to appear nowhere in the
device-tree nor in the documentation.
Remove compatible and related code.
Signed-off-by: Raphael Gallais-Pou <rgallaispou@gmail.com>
Link: https://lore.kernel.org/r/20240708161840.102004-1-rgallaispou@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Error handling in probe() can be a bit simpler with dev_err_probe().
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240709-thermal-probe-v1-12-241644e2b6e0@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Simplify the probe() function by using local 'dev' instead of
&pdev->dev.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240709-thermal-probe-v1-11-241644e2b6e0@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Error handling in probe() can be a bit simpler with dev_err_probe().
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Bjorn Andersson <andersson@kernel.org>
Link: https://lore.kernel.org/r/20240709-thermal-probe-v1-10-241644e2b6e0@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Error handling in probe() can be a bit simpler with dev_err_probe().
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Bjorn Andersson <andersson@kernel.org>
Link: https://lore.kernel.org/r/20240709-thermal-probe-v1-9-241644e2b6e0@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Error handling in probe() can be a bit simpler with dev_err_probe().
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240709-thermal-probe-v1-8-241644e2b6e0@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Simplify the probe() function by using local 'dev' instead of
&pdev->dev.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240709-thermal-probe-v1-7-241644e2b6e0@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Error handling in probe() can be a bit simpler with dev_err_probe().
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240709-thermal-probe-v1-6-241644e2b6e0@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Error handling in probe() can be a bit simpler with dev_err_probe().
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240709-thermal-probe-v1-5-241644e2b6e0@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Simplify the probe() function by using local 'dev' instead of
&pdev->dev. While touching devm_kzalloc(), use preferred sizeof(*)
syntax.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com>
Link: https://lore.kernel.org/r/20240709-thermal-probe-v1-4-241644e2b6e0@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Error handling in probe() can be a bit simpler with dev_err_probe().
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240709-thermal-probe-v1-3-241644e2b6e0@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Simplify the probe() function by using local 'dev' instead of
&pdev->dev.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240709-thermal-probe-v1-2-241644e2b6e0@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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During the probe, driver enables clocks necessary to access registers
(in get_temp()) and then registers thermal zone with managed-resources
(devm) interface. Removal of device is not done in reversed order,
because:
1. Clock will be disabled in driver remove() callback - thermal zone is
still registered and accessible to users,
2. devm interface will unregister thermal zone.
This leaves short window between (1) and (2) for accessing the
get_temp() callback with disabled clock.
Fix this by enabling clock also via devm-interface, so entire cleanup
path will be in proper, reversed order.
Fixes: 8454c8c09c77 ("thermal/drivers/bcm2835: Remove buggy call to thermal_of_zone_unregister")
Cc: stable@vger.kernel.org
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240709-thermal-probe-v1-1-241644e2b6e0@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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It is possible to have thermal zones which don't have any trip points.
These zones in effect simply represent a temperature sensor without any
action associated with it. While the schema has always required a
'trips' node, users have existed for a long time without it. Update the
schema to match reality.
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240709150154.3272825-1-robh@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-12-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Preferred indentation for DTS examples in the bindings is 4-space. It
is also preferred not to have redundant/unused labels. No functional
change
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-22-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Simplify few bindings which already reference thermal-sensor.yaml schema
by dropping unneeded requiring of '#thermal-sensor-cells' and dropping
assigned-clocks properties (core schema allows it if 'clocks' are
there).
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-21-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-20-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-19-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-18-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-17-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-16-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Reviewed-by: Biju Das <biju.das.jz@bp.renesas.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-15-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-14-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-13-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Amit Kucheria <amitk@kernel.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-11-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-10-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-9-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-8-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-7-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-6-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-5-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Florian Fainelli <florian.fainelli@broadcom.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-4-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Reviewed-by: Vasily Khoruzhick <anarsoul@gmail.com>
Acked-by: Chen-Yu Tsai <wens@csie.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-3-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and all in-tree DTS provide
'#thermal-sensor-cells', so reference the thermal-sensor.yaml to
simplify it, bring the common definition of '#thermal-sensor-cells'
property and require it.
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Guillaume LA ROQUE <glaroque@baylibre.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-2-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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All Samsung Exynos SoCs Thermal Management Units have only one sensor,
so make '#thermal-sensor-cells' fixed at 0.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-1-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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On some pre-production hardware, the SoCs do not contain calibration
data for the thermal sensors. The downstream drivers provide default
values that sort of work, instead of having the thermal sensors not
work at all.
Port the default values to the upstream driver. These values are from
the ChromeOS kernels, which sadly do not cover the MT7988.
Signed-off-by: Chen-Yu Tsai <wenst@chromium.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20240620092306.2352606-1-wenst@chromium.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Linux kernel uses thermal zone node name during registering thermal
zones and has a hard-coded limit of 20 characters, including terminating
NUL byte. The bindings expect node names to finish with '-thermal'
which is eight bytes long, thus we have only 11 characters for the reset
of the node name (thus 10 for the pattern after leading fixed character).
Reported-by: Rob Herring <robh@kernel.org>
Closes: https://lore.kernel.org/all/CAL_JsqKogbT_4DPd1n94xqeHaU_J8ve5K09WOyVsRX3jxxUW3w@mail.gmail.com/
Fixes: 1202a442a31f ("dt-bindings: thermal: Add yaml bindings for thermal zones")
Cc: stable@vger.kernel.org
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240702145248.47184-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Document the Temperature Sensor (TSENS) on the X1E80100 Platform.
Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org>
Signed-off-by: Abel Vesa <abel.vesa@linaro.org>
Reviewed-by: Amit Kucheria <amitk@kernel.org>
Link: https://lore.kernel.org/r/20240628-x1e80100-bindings-thermal-qcom-tsens-v2-1-4843d4c2ba24@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Convert the hisilicon SoCs tsensor txt bindings to dt-schema
Signed-off-by: Abdulrasaq Lawani <abdulrasaqolawani@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240618-hisilicon-thermal-dt-bindings-conversion-v4-1-7eba97fbe6d0@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Fix thermal zone names for consistency with the other SoCs:
- GPU0 must be used as the first GPU item.
- SOCx deal with audio DSP, video, and infra subsystems.
The naming must be fixed "atomically" so compilation does not break.
As a result, the change is made in the dt-bindings and in the LVTS
driver within a single commit, despite the checkpatch warning.
The definitions can be safely modified here because they are used only
in the LVTS driver, which is modified accordingly, and have not yet
been included in a released kernel.
Fixes: 78c88534e5e1 ("dt-bindings: thermal: mediatek: Add LVTS thermal controller definition for MT8188")
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Julien Panis <jpanis@baylibre.com>
Link: https://lore.kernel.org/r/20240603-mtk-thermal-mt818x-dtsi-v7-2-8c8e3c7a3643@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Fix a thermal zone name for consistency with the other SoCs:
MFG contains GPU, the latter is more specific and must be used here.
The naming must be fixed "atomically" so compilation does not break.
As a result, the change is made in the dt-bindings and in the LVTS
driver within a single commit, despite the checkpatch warning.
The definition can be safely modified here because it is used only
in the LVTS driver, which is modified accordingly, and has not yet
been included in a released kernel.
Fixes: a2ca202350f9 ("dt-bindings: thermal: mediatek: Add LVTS thermal controller definition for MT8186")
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Julien Panis <jpanis@baylibre.com>
Link: https://lore.kernel.org/r/20240603-mtk-thermal-mt818x-dtsi-v7-1-8c8e3c7a3643@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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This add suspend-to-ram support.
The derived_table is kept-as is, so the resume is only about
pm_runtime_* calls and restoring the same registers as the probe.
Extract the hardware initialization procedure to a function called at
both probe-time & resume-time.
The probe-time loop is split in two to ensure doing the hardware
initialization before registering thermal zones. That ensures our
callbacks cannot be called while in bad state.
The 100ms delay in the hardware initialization sequence was removed.
It was initially added to be sure the thresholds are programmed before
enabling the interrupt, but in fact it's not needed (tested on J7200
platform).
Signed-off-by: Théo Lebrun <theo.lebrun@bootlin.com>
Acked-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Thomas Richard <thomas.richard@bootlin.com>
Link: https://lore.kernel.org/r/20240425153238.498750-1-thomas.richard@bootlin.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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The R-Car thermal driver depends on OF, describe this.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240506154011.344324-3-niklas.soderlund+renesas@ragnatech.se
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Move all Renesas thermal drivers to a vendor specific directory.
All drivers are moved verbatim apart from the updated include path for
thermal_hwmon.h.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240506154011.344324-2-niklas.soderlund+renesas@ragnatech.se
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The order in which lists are sorted in __thermal_zone_device_update()
is reverse with respect to what it should be due to a mistake in
thermal_trip_notify_cmp().
Fix it and observe that it is not necessary to sort the lists in
different orders. They can both be sorted in ascending order if
way_down_list is walked in reverse order which allows the code to
be slightly more straightforward (and less prone to silly mistakes).
Fixes: 7454f2c42cce ("thermal: core: Sort trip point crossing notifications by temperature")
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Link: https://patch.msgid.link/12481676.O9o76ZdvQC@rjwysocki.net
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Commit 202aa0d4bb53 ("thermal: core: Do not call handle_thermal_trip()
if zone temperature is invalid") caused __thermal_zone_device_update()
to return early if the current thermal zone temperature was invalid.
This was done to avoid running handle_thermal_trip() and governor
callbacks in that case which led to confusion. However, it went too
far because monitor_thermal_zone() still needs to be called even when
the zone temperature is invalid to ensure that it will be updated
eventually in case thermal polling is enabled and the driver has no
other means to notify the core of zone temperature changes (for example,
it does not register an interrupt handler or ACPI notifier).
Also if the .set_trips() zone callback is expected to set up monitoring
interrupts for a thermal zone, it has to be provided with valid
boundaries and that can only happen if the zone temperature is known.
Accordingly, to ensure that __thermal_zone_device_update() will
run again after a failing zone temperature check, make it call
monitor_thermal_zone() regardless of whether or not the zone
temperature is valid and make the latter schedule a thermal zone
temperature update if the zone temperature is invalid even if
polling is not enabled for the thermal zone.
Fixes: 202aa0d4bb53 ("thermal: core: Do not call handle_thermal_trip() if zone temperature is invalid")
Reported-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Link: https://patch.msgid.link/2764814.mvXUDI8C0e@rjwysocki.net
[ rjw: Changed THERMAL_RECHECK_DELAY_MS to 250 ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Commit da781936e7c3 ("thermal: gov_power_allocator: Allow binding
without trip points") allowed the governor to bind even when trip_max
is NULL. This allows a NULL pointer dereference to happen in the manage
callback.
Add an early return to prevent it, since the governor is expected to not do
anything in this case.
Fixes: da781936e7c3 ("thermal: gov_power_allocator: Allow binding without trip points")
Signed-off-by: Nícolas F. R. A. Prado <nfraprado@collabora.com>
Link: https://patch.msgid.link/20240702-power-allocator-null-trip-max-v1-1-47a60dc55414@collabora.com
Cc: All applicable <stable@vger.kernel.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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