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authorZhang Rui <rui.zhang@intel.com>2012-06-27 06:08:19 +0400
committerZhang Rui <rui.zhang@intel.com>2012-09-24 10:44:37 +0400
commitb81b6ba3d9ac5feb14388bb73ac5a39d9a7540dc (patch)
tree02dfdca3257a5540c1d20b8d5ed460bb56b403c8 /include/linux/thermal.h
parent4ae46befb49d4173122e0afa995c4e93d01948a2 (diff)
downloadlinux-b81b6ba3d9ac5feb14388bb73ac5a39d9a7540dc.tar.xz
Thermal: rename structure thermal_cooling_device_instance to thermal_instance
This struct is used to describe the behavior for a thermal cooling device on a certain trip point for a certain thremal zone. thermal_cooling_device_instance is not accurate, as a cooling device can be used for more than one trip point in one thermal zone device. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
Diffstat (limited to 'include/linux/thermal.h')
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