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Initially the thermal framework had a very simple notification
mechanism to send generic netlink messages to the userspace.
The notification function was never called from anywhere and the
corresponding dead code was removed. It was probably a first attempt
to introduce the netlink notification.
At LPC2018, the presentation "Linux thermal: User kernel interface",
proposed to create the notifications to the userspace via a kfifo.
The advantage of the kfifo is the performance. It is usually used from
a 1:1 communication channel where a driver captures data and sends it
as fast as possible to a userspace process.
The drawback is that only one process uses the notification channel
exclusively, thus no other process is allowed to use the channel to
get temperature or notifications.
This patch defines a generic netlink API to discover the current
thermal setup and adds event notifications as well as temperature
sampling. As any genetlink protocol, it can evolve and the versioning
allows to keep the backward compatibility.
In order to prevent the user from getting flooded with data on a
single channel, there are two multicast channels, one for the
temperature sampling when the thermal zone is updated and another one
for the events, so the user can get the events only without the
thermal zone temperature sampling.
Also, a list of commands to discover the thermal setup is added and
can be extended when needed.
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200706105538.2159-3-daniel.lezcano@linaro.org
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This function is not needed by drivers.
Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200703104354.19657-4-andrzej.p@collabora.com
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set_mode() is only called when tzd's mode is about to change. Actual
setting is performed in thermal_core, in thermal_zone_device_set_mode().
The meaning of set_mode() callback is actually to notify the driver about
the mode being changed and giving the driver a chance to oppose such
change.
To better reflect the purpose of the method rename it to change_mode()
Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
[for acerhdf]
Acked-by: Peter Kaestle <peter@piie.net>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629122925.21729-12-andrzej.p@collabora.com
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Prepare for making the drivers not access tzd's private members.
Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
[staticize thermal_zone_device_set_mode()]
Signed-off-by: kernel test robot <lkp@intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629122925.21729-7-andrzej.p@collabora.com
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get_mode() is now redundant, as the state is stored in struct
thermal_zone_device.
Consequently the "mode" attribute in sysfs can always be visible, because
it is always possible to get the mode from struct tzd.
Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
[for acerhdf]
Acked-by: Peter Kaestle <peter@piie.net>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629122925.21729-6-andrzej.p@collabora.com
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Prepare for changing the place where the mode is stored: now it is in
drivers, which might or might not implement get_mode()/set_mode() methods.
A lot of cleanup can be done thanks to storing it in struct tzd. The
get_mode() methods will become redundant.
Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
Reviewed-by: Guenter Roeck <linux@roeck-us.net>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629122925.21729-4-andrzej.p@collabora.com
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All users of the function depends on THERMAL, no stub is
needed. Remove it.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-9-daniel.lezcano@linaro.org
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All callers of the functions depends on THERMAL, it is pointless to
define stubs. Remove them.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-8-daniel.lezcano@linaro.org
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The thermal framework can not be compiled as a module. The IS_ENABLED
macro is useless here and can be replaced by an ifdef.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-7-daniel.lezcano@linaro.org
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The function is not used any place other than the thermal
directory. It does not make sense to export its definition in the
global header as there is no use of it.
Move the definition to the internal header and allow better
self-encapsulation.
Take the opportunity to add the parameter names to make checkpatch
happy and remove the pointless stubs.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-6-daniel.lezcano@linaro.org
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The function is not used any place other than the thermal
directory. It does not make sense to export its definition in the
global header as there is no use of it.
Move the definition to the internal header and allow better
self-encapsulation.
Take the opportunity to add the parameter names to make checkpatch
happy and remove the pointless stubs.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-5-daniel.lezcano@linaro.org
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The struct thermal_trip is only used by the thermal internals, it is
pointless to export the definition in the global header.
Move the structure to the thermal_core.h internal header.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-4-daniel.lezcano@linaro.org
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The exported IPA functions are used by the IPA. It is pointless to
declare the functions in the thermal.h file.
For better self-encapsulation and less impact for the compilation if a
change is made on it. Move the code in the thermal core internal
header file.
As the users depends on THERMAL then it is pointless to have the stub,
remove them.
Take also the opportunity to fix checkpatch warnings/errors when
moving the code around.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-3-daniel.lezcano@linaro.org
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The structure belongs to the thermal core internals but it is exported
in the include/linux/thermal.h
For better self-encapsulation and less impact for the compilation if a
change is made on it. Move the structure in the thermal core internal
header file.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-2-daniel.lezcano@linaro.org
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The default governor set at compilation time is a thermal internal
business, no need to export to the global thermal header.
Move the config options to the internal header.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-1-daniel.lezcano@linaro.org
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The function thermal_zone_set_trips() is used by the thermal core code
in order to update the next trip points, there are no other users.
Move the function definition in the thermal_core.h, remove the
EXPORT_SYMBOL_GPL and document the function.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20200331165449.30355-1-daniel.lezcano@linaro.org
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Add "inline" to thermal_zone_of_get_sensor_id() function to avoid below
build warning of !defined(CONFIG_THERMAL_OF).
In file included from drivers/hwmon/hwmon.c:22:
include/linux/thermal.h:382:12: warning: 'thermal_zone_of_get_sensor_id'
defined but not used [-Wunused-function]
382 | static int thermal_zone_of_get_sensor_id(struct device_node *tz_np,
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reported-by: Stephen Rothwell <sfr@canb.auug.org.au>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1583222684-10229-1-git-send-email-Anson.Huang@nxp.com
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This patch adds new API thermal_zone_of_get_sensor_id() to
provide the feature of getting sensor ID from DT thermal
zone's node. It's useful for thermal driver to register the
specific thermal zone devices from DT in a common way.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reviewed-by: Dong Aisheng <aisheng.dong@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1582330132-13461-2-git-send-email-Anson.Huang@nxp.com
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This removes the kelvin to/from Celsius conversion helper macros in
<linux/thermal.h> which were switched to the inline helper functions in
<linux/units.h>.
Link: http://lkml.kernel.org/r/1576386975-7941-9-git-send-email-akinobu.mita@gmail.com
Signed-off-by: Akinobu Mita <akinobu.mita@gmail.com>
Reviewed-by: Andy Shevchenko <andy.shevchenko@gmail.com>
Cc: Sujith Thomas <sujith.thomas@intel.com>
Cc: Darren Hart <dvhart@infradead.org>
Cc: Andy Shevchenko <andy@infradead.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Amit Kucheria <amit.kucheria@verdurent.com>
Cc: Jean Delvare <jdelvare@suse.com>
Cc: Guenter Roeck <linux@roeck-us.net>
Cc: Keith Busch <kbusch@kernel.org>
Cc: Jens Axboe <axboe@fb.com>
Cc: Christoph Hellwig <hch@lst.de>
Cc: Sagi Grimberg <sagi@grimberg.me>
Cc: Emmanuel Grumbach <emmanuel.grumbach@intel.com>
Cc: Hartmut Knaack <knaack.h@gmx.de>
Cc: Johannes Berg <johannes.berg@intel.com>
Cc: Jonathan Cameron <jic23@kernel.org>
Cc: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Cc: Kalle Valo <kvalo@codeaurora.org>
Cc: Lars-Peter Clausen <lars@metafoo.de>
Cc: Luca Coelho <luciano.coelho@intel.com>
Cc: Peter Meerwald-Stadler <pmeerw@pmeerw.net>
Cc: Stanislaw Gruszka <sgruszka@redhat.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
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There are no users of netlink messages for thermal inside the kernel.
Remove the code and adjust the documentation.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/8ff02cf62186c7a54fff325fad40a2e9ca3affa6.1571656014.git.amit.kucheria@linaro.org
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The file contents mostly describes driver internals.
Signed-off-by: Mauro Carvalho Chehab <mchehab+samsung@kernel.org>
Signed-off-by: Jonathan Corbet <corbet@lwn.net>
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Rename the thermal documentation files to ReST, add an
index for them and adjust in order to produce a nice html
output via the Sphinx build system.
At its new index.rst, let's add a :orphan: while this is not linked to
the main index.rst file, in order to avoid build warnings.
Signed-off-by: Mauro Carvalho Chehab <mchehab+samsung@kernel.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:
- Remove the 'module' Kconfig option for thermal subsystem framework
because the thermal framework are required to be ready as early as
possible to avoid overheat at boot time (Daniel Lezcano)
- Fix a bug that thermal framework pokes disabled thermal zones upon
resume (Wei Wang)
- A couple of cleanups and trivial fixes on int340x thermal drivers
(Srinivas Pandruvada, Zhang Rui, Sumeet Pawnikar)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
drivers: thermal: processor_thermal: Downgrade error message
mlxsw: Remove obsolete dependency on THERMAL=m
hwmon/drivers/core: Simplify complex dependency
thermal/drivers/core: Fix typo in the option name
thermal/drivers/core: Remove depends on THERMAL in Kconfig
thermal/drivers/core: Remove module unload code
thermal/drivers/core: Remove the module Kconfig's option
thermal: core: skip update disabled thermal zones after suspend
thermal: make device_register's type argument const
thermal: intel: int340x: processor_thermal_device: simplify to get driver data
thermal/int3403_thermal: favor _TMP instead of PTYP
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thermal_of_cooling_device_register() and thermal_cooling_device_register()
are typically called from driver probe functions, and
thermal_cooling_device_unregister() is called from remove functions. This
makes both a perfect candidate for device managed functions.
Introduce devm_thermal_of_cooling_device_register(). This function can
also be used to replace thermal_cooling_device_register() by passing a NULL
pointer as device node. The new function requires both struct device *
and struct device_node * as parameters since the struct device_node *
parameter is not always identical to dev->of_node.
Don't introduce a device managed remove function since it is not needed
at this point.
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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...because it can be, the buffer is strlcpy'd into a local buffer in a
thermal struct member.
Signed-off-by: Jean-Francois Dagenais <jeff.dagenais@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Update licences format for core thermal files.
Signed-off-by: Lina Iyer <ilina@codeaurora.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This extends the sysfs interface for thermal cooling devices and exposes
some pretty useful statistics. These statistics have proven to be quite
useful specially while doing benchmarks related to the task scheduler,
where we want to make sure that nothing has disrupted the test,
specially the cooling device which may have put constraints on the CPUs.
The information exposed here tells us to what extent the CPUs were
constrained by the thermal framework.
The write-only "reset" file is used to reset the statistics.
The read-only "time_in_state_ms" file shows the time (in msec) spent by the
device in the respective cooling states, and it prints one line per
cooling state.
The read-only "total_trans" file shows single positive integer value
showing the total number of cooling state transitions the device has
gone through since the time the cooling device is registered or the time
when statistics were reset last.
The read-only "trans_table" file shows a two dimensional matrix, where
an entry <i,j> (row i, column j) represents the number of transitions
from State_i to State_j.
This is how the directory structure looks like for a single cooling
device:
$ ls -R /sys/class/thermal/cooling_device0/
/sys/class/thermal/cooling_device0/:
cur_state max_state power stats subsystem type uevent
/sys/class/thermal/cooling_device0/power:
autosuspend_delay_ms runtime_active_time runtime_suspended_time
control runtime_status
/sys/class/thermal/cooling_device0/stats:
reset time_in_state_ms total_trans trans_table
This is tested on ARM 64-bit Hisilicon hikey620 board running Ubuntu and
ARM 64-bit Hisilicon hikey960 board running Android.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Here, prototype of thermal_zone_device_register is not matching
with static inline thermal_zone_device_register. One is using
const thermal_zone_params. Other is using non-const.
Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Some BIOS implement ACPI notification code 0x83 to indicate active
relationship table(ART) and/or thermal relationship table(TRT) changes
to INT3400 device. This event needs to be propagated to user space so
that it can be handled by the user space thermal daemon.
Signed-off-by: Brian Bian <brian.bian@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The thermal core does not use the ability to look up pointers by ID, so
convert it from using an IDR to the more space-efficient IDA.
Signed-off-by: Matthew Wilcox <mawilcox@microsoft.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Finally, move the last thermal zone sysfs attributes to
tz->device.groups: trips attributes. This requires adding a
attribute_group to thermal_zone_device, creating it dynamically, and
then setting all trips attributes in it. The trips attribute is then
added to the tz->device.groups.
As the removal of all attributes are handled by device core, the device
remove calls are not needed anymore.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Added one additional parameter to thermal_zone_device_update() to provide
caller with an optional capability to specify reason.
Currently this event is used by user space governor to trigger different
processing based on event code. Also it saves an additional call to read
temperature when the event is received.
The following events are cuurently defined:
- Unspecified event
- New temperature sample
- Trip point violated
- Trip point changed
- thermal device up and down
- thermal device power capability changed
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The .get_trend callback in struct thermal_zone_device_ops has
the prototype:
int (*get_trend) (struct thermal_zone_device *, int,
enum thermal_trend *);
whereas the .get_trend callback in struct thermal_zone_of_device_ops
has:
int (*get_trend)(void *, long *);
Streamline both prototypes and add the trip argument to the OF callback
aswell and use enum thermal_trend * instead of an integer pointer.
While the OF prototype may be the better one, this should be decided at
framework level and not on OF level.
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Reviewed-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This patch implements .set_trips for device tree thermal zones.
As the hardware-tracked trip points is supported by thermal core patch[0].
patch[0]
"thermal: Add support for hardware-tracked trip points".
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This adds support for hardware-tracked trip points to the device tree
thermal sensor framework.
The framework supports an arbitrary number of trip points. Whenever
the current temperature is updated, the trip points immediately
below and above the current temperature are found. A .set_trips
callback is then called with the temperatures. If there is no trip
point above or below the current temperature, the passed trip
temperature will be -INT_MAX or INT_MAX respectively. In this callback,
the driver should program the hardware such that it is notified
when either of these trip points are triggered. When a trip point
is triggered, the driver should call `thermal_zone_device_update'
for the respective thermal zone. This will cause the trip points
to be updated again.
If .set_trips is not implemented, the framework behaves as before.
This patch is based on an earlier version from Mikko Perttunen
<mikko.perttunen@kapsi.fi>
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Add apis for platform thermal drivers to query for slope and offset
attributes, which might be needed for temperature calculations.
Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Fixes commit 60f9ce3ada53
("thermal: of-thermal: allow setting trip_temp on hardware")
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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In current of-thermal, the .set_trip_temp only support to
set trip_temp for SW. But some sensors support to set
trip_temp on hardware, so that can trigger interrupt,
shutdown or any other events.
This patch adds .set_trip_temp() callback in
thermal_zone_of_device_ops{}, so that the sensor device can
use it to set trip_temp on hardware.
Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The commit 17e8351a7739 consistently use int for temperature,
however it missed a few in trip temperature and thermal_core.
In current codes, the trip->temperature used "unsigned long"
and zone->temperature used"int", if the temperature is negative
value, it will get wrong result when compare temperature with
trip temperature.
This patch can fix it.
Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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In some cases, platform thermal driver may report invalid trip points,
thermal core should not take any action for these trip points.
This fixed a regression that bogus trip point starts to screw up thermal
control on some Lenovo laptops, after
commit bb431ba26c5cd0a17c941ca6c3a195a3a6d5d461
Author: Zhang Rui <rui.zhang@intel.com>
Date: Fri Oct 30 16:31:47 2015 +0800
Thermal: initialize thermal zone device correctly
After thermal zone device registered, as we have not read any
temperature before, thus tz->temperature should not be 0,
which actually means 0C, and thermal trend is not available.
In this case, we need specially handling for the first
thermal_zone_device_update().
Both thermal core framework and step_wise governor is
enhanced to handle this. And since the step_wise governor
is the only one that uses trends, so it's the only thermal
governor that needs to be updated.
Tested-by: Manuel Krause <manuelkrause@netscape.net>
Tested-by: szegad <szegadlo@poczta.onet.pl>
Tested-by: prash <prash.n.rao@gmail.com>
Tested-by: amish <ammdispose-arch@yahoo.com>
Tested-by: Matthias <morpheusxyz123@yahoo.de>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Chen Yu <yu.c.chen@intel.com>
CC: <stable@vger.kernel.org> #3.18+
Link: https://bugzilla.redhat.com/show_bug.cgi?id=1317190
Link: https://bugzilla.kernel.org/show_bug.cgi?id=114551
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Add resource managed version of thermal_zone_of_sensor_register() and
thermal_zone_of_sensor_unregister().
This helps in reducing the code size in error path, remove of
driver remove callbacks and making proper sequence for deallocations.
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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When a new cooling device is registered, we need to update the
thermal zone to set the new registered cooling device to a proper
state.
This fixes a problem that the system is cool, while the fan devices
are left running on full speed after boot, if fan device is registered
after thermal zone device.
Here is the history of why current patch looks like this:
https://patchwork.kernel.org/patch/7273041/
CC: <stable@vger.kernel.org> #3.18+
Reference:https://bugzilla.kernel.org/show_bug.cgi?id=92431
Tested-by: Manuel Krause <manuelkrause@netscape.net>
Tested-by: szegad <szegadlo@poczta.onet.pl>
Tested-by: prash <prash.n.rao@gmail.com>
Tested-by: amish <ammdispose-arch@yahoo.com>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Chen Yu <yu.c.chen@intel.com>
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After thermal zone device registered, as we have not read any
temperature before, thus tz->temperature should not be 0,
which actually means 0C, and thermal trend is not available.
In this case, we need specially handling for the first
thermal_zone_device_update().
Both thermal core framework and step_wise governor is
enhanced to handle this. And since the step_wise governor
is the only one that uses trends, so it's the only thermal
governor that needs to be updated.
CC: <stable@vger.kernel.org> #3.18+
Tested-by: Manuel Krause <manuelkrause@netscape.net>
Tested-by: szegad <szegadlo@poczta.onet.pl>
Tested-by: prash <prash.n.rao@gmail.com>
Tested-by: amish <ammdispose-arch@yahoo.com>
Tested-by: Matthias <morpheusxyz123@yahoo.de>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Chen Yu <yu.c.chen@intel.com>
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When the prototype for thermal_zone_bind_cooling_device
changed, the static inline wrapper function was left alone,
which in theory can cause build warnings:
I have seen this error in the past:
drivers/thermal/db8500_thermal.c: In function 'db8500_cdev_bind':
drivers/thermal/db8500_thermal.c:78:9: error: too many arguments to function 'thermal_zone_bind_cooling_device'
ret = thermal_zone_bind_cooling_device(thermal, i, cdev,
while this one no longer shows up, there is no doubt that
the prototype is still wrong, so let's just fix it anyway.
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Fixes: 6cd9e9f629f1 ("thermal: of: fix cooling device weights in device tree")
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The macros KELVIN_TO_CELSIUS and CELSIUS_TO_KELVIN actually convert
between deciKelvins and Celsius, so rename them to reflect that. While
at it, use a statement expression in DECI_KELVIN_TO_CELSIUS to prevent
expanding the argument multiple times and get rid of a few casts.
Signed-off-by: Rasmus Villemoes <linux@rasmusvillemoes.dk>
Acked-by: Darren Hart <dvhart@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The thermal core already has a function to get the maximum power of a
cooling device: power_actor_get_max_power(). Add a function to get the
minimum power of a cooling device.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Reviewed-by: Daniel Kurtz <djkurtz@chromium.org>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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thermal_zone_of_sensor_register is documented as returning a pointer
to either a valid thermal_zone_device on success, or a corresponding
ERR_PTR() value.
In contrast, the function returns NULL when THERMAL_OF is configured
off. Fix this.
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The thermal code uses int, long and unsigned long for temperatures
in different places.
Using an unsigned type limits the thermal framework to positive
temperatures without need. Also several drivers currently will report
temperatures near UINT_MAX for temperatures below 0°C. This will probably
immediately shut the machine down due to overtemperature if started below
0°C.
'long' is 64bit on several architectures. This is not needed since INT_MAX °mC
is above the melting point of all known materials.
Consistently use a plain 'int' for temperatures throughout the thermal code and
the drivers. This only changes the places in the drivers where the temperature
is passed around as pointer, when drivers internally use another type this is
not changed.
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Jean Delvare <jdelvare@suse.de>
Reviewed-by: Lukasz Majewski <l.majewski@samsung.com>
Reviewed-by: Darren Hart <dvhart@linux.intel.com>
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Reviewed-by: Peter Feuerer <peter@piie.net>
Cc: Punit Agrawal <punit.agrawal@arm.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: Jean Delvare <jdelvare@suse.de>
Cc: Peter Feuerer <peter@piie.net>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: Lukasz Majewski <l.majewski@samsung.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: linux-acpi@vger.kernel.org
Cc: platform-driver-x86@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-omap@vger.kernel.org
Cc: linux-samsung-soc@vger.kernel.org
Cc: Guenter Roeck <linux@roeck-us.net>
Cc: Rafael J. Wysocki <rjw@rjwysocki.net>
Cc: Maxime Ripard <maxime.ripard@free-electrons.com>
Cc: Darren Hart <dvhart@infradead.org>
Cc: lm-sensors@lm-sensors.org
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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It is common to have a linear extrapolation from
the current sensor readings and the actual temperature
value. This is specially the case when the sensor
is in use to extrapolate hotspots.
This patch adds slope and offset constants for
single sensor linear extrapolation equation. Because
the same sensor can be use in different locations,
from board to board, these constants are added
as part of thermal_zone_params.
The constants are available through sysfs.
It is up to the device driver to determine
the usage of these values.
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The power allocator governor is a thermal governor that controls system
and device power allocation to control temperature. Conceptually, the
implementation divides the sustainable power of a thermal zone among
all the heat sources in that zone.
This governor relies on "power actors", entities that represent heat
sources. They can report current and maximum power consumption and
can set a given maximum power consumption, usually via a cooling
device.
The governor uses a Proportional Integral Derivative (PID) controller
driven by the temperature of the thermal zone. The output of the
controller is a power budget that is then allocated to each power
actor that can have bearing on the temperature we are trying to
control. It decides how much power to give each cooling device based
on the performance they are requesting. The PID controller ensures
that the total power budget does not exceed the control temperature.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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