| Age | Commit message (Collapse) | Author | Files | Lines | |
|---|---|---|---|---|---|
| 2014-11-05 | usb: dwc3: exynos: remove non-DT support for Exynos Specific Glue layer | Jingoo Han | 1 | -24/+0 | |
| DWC3 Exynos Specific Glue layer can be used only for Exynos SoCs. In addition, non-DT for EXYNOS SoCs is not supported from v3.11; thus, there is no need to support non-DT for DWC3 Exynos Specific Glue layer. The 'linux/platform_data/dwc3-exynos.h' file has been used for non-DT support. Thus, the 'dwc3-exynos.h' file is removed, because it is not used anymore. Signed-off-by: Jingoo Han <jg1.han@samsung.com> Signed-off-by: Felipe Balbi <balbi@ti.com> | |||||
| 2012-03-02 | usb: dwc3: Add Exynos Specific Glue layer | Anton Tikhomirov | 1 | -0/+24 | |
| Adds Exynos Specific Glue layer to support USB peripherals on Samsung Exynos5 chips. [ balbi@ti.com : prevent compilation of Exynos glue layer on platforms which don't provide clk API implementation ] Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com> Signed-off-by: Felipe Balbi <balbi@ti.com> | |||||
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index : kernel/linux.git | |
| Linux kernel stable tree (mirror) | Andrey V.Kosteltsev |
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