| Age | Commit message (Collapse) | Author | Files | Lines | |
|---|---|---|---|---|---|
| 2012-06-22 | usb: dwc3: Remove duplicate header file inclusion | Sachin Kamat | 1 | -1/+0 | |
| module.h header file was included twice. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Signed-off-by: Felipe Balbi <balbi@ti.com> | |||||
| 2012-03-02 | usb: dwc3: Add Exynos Specific Glue layer | Anton Tikhomirov | 1 | -0/+151 | |
| Adds Exynos Specific Glue layer to support USB peripherals on Samsung Exynos5 chips. [ balbi@ti.com : prevent compilation of Exynos glue layer on platforms which don't provide clk API implementation ] Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com> Signed-off-by: Felipe Balbi <balbi@ti.com> | |||||
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index : kernel/linux.git | |
| Linux kernel stable tree (mirror) | Andrey V.Kosteltsev |
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