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path: root/drivers/thermal/samsung/exynos_thermal_common.c
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2015-01-25thermal: exynos: Remove exynos_thermal_common.[c|h] filesLukasz Majewski1-445/+0
After defining all necessary Exynos data in the device tree and heavy reusage of the of-thermal.c those files can be removed. Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-01-25thermal: exynos: Modify exynos thermal code to use device tree for cpu ↵Lukasz Majewski1-52/+70
cooling configuration Up till now exynos_tmu_data.c was used for storing CPU cooling configuration data. Now the Exynos thermal core code uses device tree to get this data. For this purpose generic thermal code for configuring CPU cooling was used. Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-12-08thermal: exynos: pass cpu_present_mask to cpufreq_cooling_register()Viresh Kumar1-3/+1
cpufreq_cooling_register() expects mask of all the CPUs where frequency constraint is applicable. This platform has more than one CPU to which these constraints will apply and so passing mask of only CPU0 wouldn't be sufficient. Also, this platform has a single cluster of CPUs and the constraint applies to all CPUs. If CPU0 is hoplugged out then we may face strange BUGs as cpu_cooling framework isn't aware of any siblings sharing clock line. Fix it by passing cpu_present_mask to cpufreq_cooling_register(). Cc: Chanwoo Choi <cw00.choi@samsung.com> Cc: Kyungmin Park <kyungmin.park@samsung.com> Cc: Amit Daniel Kachhap <amit.daniel@samsung.com> Cc: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-12-08thermal: cpu_cooling: check for the readiness of cpufreq layerEduardo Valentin1-3/+5
In this patch, the cpu_cooling code checks for the usability of cpufreq layer before proceeding with the CPU cooling device registration. The main reason is: CPU cooling device is not usable if cpufreq cannot switch frequencies. Similar checks are spread in thermal drivers. Thus, the advantage now is to have the check in a single place: cpu cooling device registration. For this reason, this patch also updates the existing drivers that depend on CPU cooling to simply propagate the error code of the cpu cooling registration call. Therefore, in case cpufreq is not ready, the thermal drivers will still return -EPROBE_DEFER, in an attempt to try again when cpufreq layer gets ready. Cc: devicetree@vger.kernel.org Cc: Grant Likely <grant.likely@linaro.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Cc: linux-arm-kernel@lists.infradead.org Cc: linux-kernel@vger.kernel.org Cc: linux-pm@vger.kernel.org Cc: linux-samsung-soc@vger.kernel.org Cc: Naveen Krishna Chatradhi <ch.naveen@samsung.com> Cc: Rob Herring <robh+dt@kernel.org> Cc: Zhang Rui <rui.zhang@intel.com> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-21thermal: Exynos: Deletion of unnecessary checks before two function callsMarkus Elfring1-6/+3
The functions cpufreq_cooling_unregister() and thermal_zone_device_unregister() test whether their argument is NULL and then return immediately. Thus the test around the call is not needed. This issue was detected by using the Coccinelle software. Signed-off-by: Markus Elfring <elfring@users.sourceforge.net> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-01-02thermal:samsung: fix compilation warningNaveen Krishna Chatradhi1-1/+1
This patch fixes a compilation warning. warning: passing argument 5 of 'thermal_zone_device_register' discards 'const' qualifier from pointer target type [enabled by default] include/linux/thermal.h:270:29: note: expected 'struct thermal_zone_device_ops *' but argument is of type 'const struct thermal_zone_device_ops *' Signed-off-by: Naveen Krishna Chatradhi <ch.naveen@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-10-15thermal: exynos: Remove check for thermal device pointer at ↵Lukasz Majewski1-2/+0
exynos_report_trigger() The commit 4de0bdaa9677d11406c9becb70c60887c957e1f0 ("thermal: exynos: Add support for instance based register/unregister") broke check for presence of therm_dev at global thermal zone in exynos_report_trigger(). The resulting wrong test prevents thermal_zone_device_update() call, which calls handlers for situation when trip points are passed. Such behavior prevents thermal driver from proper reaction (when TMU interrupt is raised) in a situation when overheating is detected at TMU hardware. It turns out, that after exynos thermal subsystem redesign (at v3.12) this check is not needed, since it is not possible to register thermal zone without valid thermal device. Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com> Reviewed-by: Tomasz Figa <t.figa@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-29thermal: exynos: Fix potential NULL pointer dereferenceSachin Kamat1-3/+3
NULL pointer was being dereferenced in its own error message. Changed it to the correct device pointer. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: use device resource management infrastructureAmit Daniel Kachhap1-13/+23
This patch uses the device pointer stored in the configuration structure and converts to dev_* prints and devm API's. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Make the zone handling use trip informationAmit Daniel Kachhap1-25/+42
This code simplifies the zone handling to use the trip information passed by the TMU driver and not the hardcoded macros. This also helps in adding more zone support. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Return success even if no cooling data suppliedAmit Daniel Kachhap1-2/+2
This patch removes the error return in the bind/unbind routine as the platform may not register any cpufreq cooling data. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Modify private_data to appropriate name driver_dataAmit Daniel Kachhap1-2/+2
This patch renames member private_data to driver_data of the thermal zone registration structure as this item stores the driver related data and uses it to call the driver related callbacks. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Add support for instance based register/unregisterAmit Daniel Kachhap1-15/+36
This code modifies the thermal driver to have multiple thermal zone support by replacing the global thermal zone variable with device data member of thermal_zone_device. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Move exynos_thermal.h from include/* to driver/* folderAmit Daniel Kachhap1-1/+0
This patch renames and moves include/linux/platform_data/exynos_thermal.h to drivers/thermal/samsung/exynos_tmu.h. This file movement is needed as exynos SOC's are not supporting non-DT based platforms and this file now just contains exynos tmu driver related definations. Also struct freq_clip_table is now moved to exynos_thermal_common.c as it fixes the compilation issue occuring because now this new tmu header file is included in tmu driver c file and not in the common thermal header file. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Bifurcate exynos thermal common and tmu controller codeAmit Daniel Kachhap1-0/+385
This code bifurcates exynos thermal implementation into common and sensor specific parts. The common thermal code interacts with core thermal layer and core cpufreq cooling parts and is independent of SOC specific driver. This change is needed to cleanly add support for new TMU sensors. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>