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Use standard GPIO constants to enhance the readability of DT GPIOs.
Signed-off-by: Florian Vaussard <florian.vaussard@epfl.ch>
Acked-by: Santosh Shilimkar <santosh.shilimkar@ti.com>
Reviewed-by: Stephen Warren <swarren@nvidia.com>
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
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Replace /include/ by #include for OMAP2+ DT, in order to use the
C pre-processor, making use of #define features possible.
Signed-off-by: Florian Vaussard <florian.vaussard@epfl.ch>
Acked-by: Santosh Shilimkar <santosh.shilimkar@ti.com>
Reviewed-by: Stephen Warren <swarren@nvidia.com>
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
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The IGEPv2 board has an 512MB NAND flash memory.
Add a device node for this NAND and its partition layout.
Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
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The IGEPv2 board has an SMSC LAN9221i ethernet chip connected to
the OMAP3 processor though the General-Purpose Memory Controller.
This patch adds a device node for the ethernet chip as a GPMC child
and all its dependencies (regulators, GPIO and pin muxs).
Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
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ISEE IGEPv2 is an TI OMAP3 SoC based embedded board.
This patch adds an initial device tree support to boot
an IGEPv2 from the MMC/SD.
Currently is working everything that is supported by DT
on OMAP3 SoCs (MMC/SD, GPIO LEDs, EEPROM, TWL4030 audio).
Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Tested-by: Enric Balletbo i Serra <eballetbo@gmail.com>
[benoit.cousson@linaro.org: Update the Makefile for 3.8-rc2]
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
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