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2025-12-22Add Richtek RT8092 supportMark Brown1-0/+5
Merge series from cy_huang@richtek.com: This patch series add rt8092 regulator support.
2025-12-22spi: dt-bindings: sun6i: Add compatibles for A523's SPI controllersChen-Yu Tsai1-0/+4
The A523 has four SPI controllers. One of them supports MIPI DBI mode in addition to standard SPI. Compared to older generations, this newer controller now has a combined counter for the RX FIFO ad buffer levels. In older generations, the RX buffer level was a separate bitfield in the FIFO status register. In practice this difference is negligible. The buffer is mostly invisible to the implementation. If programmed I/O transfers are limited to the FIFO size, then the contents of the buffer seem to always be flushed over to the FIFO. For DMA, the DRQ trigger levels are only tied to the FIFO levels. In all other aspects, the controller is the same as the one in the R329. Add new compatible strings for the new controllers. Signed-off-by: Chen-Yu Tsai <wens@kernel.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Link: https://patch.msgid.link/20251221110513.1850535-2-wens@kernel.org Signed-off-by: Mark Brown <broonie@kernel.org>
2025-12-22Merge tag 'i2c-for-6.19-rc2' of ↵Linus Torvalds2-0/+9
git://git.kernel.org/pub/scm/linux/kernel/git/wsa/linux Pull i2c fixes from Wolfram Sang: - bcm, pxa, rcar: fix void-pointer-to-enum-cast warning - new hardware IDs / DT bindings for - Intel Nova Lake-S - Mobileye - Qualcomm SM8750 * tag 'i2c-for-6.19-rc2' of git://git.kernel.org/pub/scm/linux/kernel/git/wsa/linux: dt-bindings: i2c: qcom-cci: Document SM8750 compatible i2c: i801: Add support for Intel Nova Lake-S dt-bindings: i2c: dw: Add Mobileye I2C controllers i2c: rcar: Fix Wvoid-pointer-to-enum-cast warning i2c: pxa: Fix Wvoid-pointer-to-enum-cast warning i2c: bcm-iproc: Fix Wvoid-pointer-to-enum-cast warning
2025-12-21dt-bindings: trivial-devices: add MEMSIC 3-axis magnetometerFrank Li1-0/+4
Add compatible string 'memsic,mmc5603' and 'memsic,mmc5633' for MEMSIC 3-axis magnetometer. Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Frank Li <Frank.Li@nxp.com> Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2025-12-21dt-bindings: iio: adc: Add TI ADS1018/ADS1118Kurt Borja1-0/+82
Add documentation for Texas Instruments ADS1018 and ADS1118 analog-to-digital converters. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Signed-off-by: Kurt Borja <kuurtb@gmail.com> Reviewed-by: David Lechner <dlechner@baylibre.com> Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2025-12-21dt-bindings: clock: exynosautov920: add MFD clock definitionsRaghav Sharma1-0/+19
Add device tree clock binding definitions for CMU_MFD Signed-off-by: Raghav Sharma <raghav.s@samsung.com> Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com> Acked-by: Rob Herring (Arm) <robh@kernel.org> Link: https://patch.msgid.link/20251119114744.1914416-2-raghav.s@samsung.com Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
2025-12-21dt-bindings: interconnect: mt8183-emi: Add support for MT8196 EMIAngeloGioacchino Del Regno1-0/+1
Add a new compatible for the External Memory Interface Interconnect found on the MediaTek MT8196 Chromebook SoC. Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Acked-by: Rob Herring (Arm) <robh@kernel.org> Signed-off-by: Nicolas Frattaroli <nicolas.frattaroli@collabora.com> Link: https://lore.kernel.org/r/20251124-mt8196-dvfsrc-v2-3-d9c1334db9f3@collabora.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-12-21dt-bindings: iio: pressure: add honeywell,abp2030paPetre Rodan1-0/+132
Adds binding for digital Honeywell ABP2 series pressure and temperature sensors. The i2c address is hardcoded and depends on the part number. There is an optional interrupt that signals the end of conversion. Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org> Signed-off-by: Petre Rodan <petre.rodan@subdimension.ro> Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2025-12-21dt-bindings: adc: ad9467: add support for ad9211Tomas Melin1-0/+2
This device has e.g. different scaling values than currently listed devices. Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Signed-off-by: Tomas Melin <tomas.melin@vaisala.com> Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2025-12-21dt-bindings: iio: adc: Allow interrupts property for AST2600Andrew Jeffery1-0/+3
The device has interrupts allocated according to the datasheet, and the devicetree already defines the interrupt property. Address existing warnings by allowing the property. Signed-off-by: Andrew Jeffery <andrew@codeconstruct.com.au> Acked-by: Rob Herring (Arm) <robh@kernel.org> Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2025-12-21dt-bindings: iio: amplifiers: add adl8113Antoniu Miclaus1-0/+87
Add devicetree bindings for the ADL8113 Low Noise Amplifier. The bindings include support for specifying gain values of external amplifiers connected to the two external bypass paths (A and B). These optional properties allow the gain values to be selectable via the hardwaregain attribute, enabling complete devicetree description of the signal chain including external components. Reviewed-by: Rob Herring (Arm) <robh@kernel.org> Signed-off-by: Antoniu Miclaus <antoniu.miclaus@analog.com> Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2025-12-21dt-bindings: iio: frequency: adf4377: add clk providerAntoniu Miclaus1-0/+8
Add support for clock provider. Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Antoniu Miclaus <antoniu.miclaus@analog.com> Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2025-12-21dt-bindings: iio: adc: Add the NXP SAR ADC for s32g2/3 platformsDaniel Lezcano1-0/+63
The s32g2 and s32g3 NXP platforms have two instances of a Successive Approximation Register ADC. It supports the raw, trigger and scan modes which involves the DMA. Add their descriptions. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Rob Herring (Arm) <robh@kernel.org> Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2025-12-21bindings: iio: adc: Add bindings for TI ADS131M0x ADCsOleksij Rempel1-0/+208
Add device tree bindings documentation for the Texas Instruments ADS131M0x analog-to-digital converters. This family includes the ADS131M02, ADS131M03, ADS131M04, ADS131M06, and ADS131M08 variants. These variants differ primarily in the number of supported channels (2, 3, 4, 6, and 8, respectively), which requires separate compatible strings to validate the channel nodes. Signed-off-by: Oleksij Rempel <o.rempel@pengutronix.de> Reviewed-by: Conor Dooley <conor.dooley@microchip.com> Reviewed-by: David Lechner <dlechner@baylibre.com> Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2025-12-21Merge tag 'spi-fix-v6.19-rc1' of ↵Linus Torvalds1-3/+3
git://git.kernel.org/pub/scm/linux/kernel/git/broonie/spi Pull spi fixes from Mark Brown: "A small collection of fixes for various SPI drivers, plus a relaxation of constraints in the DT for the DesignWare controller to reflect hardware that's been seen. There's several fixes for the Cadence QuadSPI driver since a fix during the last release made some existing issues with error handling during probe more readily visible" * tag 'spi-fix-v6.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/broonie/spi: spi: mt65xx: Use IRQF_ONESHOT with threaded IRQ spi: dt-bindings: snps,dw-abp-ssi: Allow up to 16 chip-selects spi: cadence-quadspi: Fix clock disable on probe failure path spi: cadence-quadspi: Add error logging for DMA request failure spi: fsl-cpm: Check length parity before switching to 16 bit mode spi: mpfs: Fix an error handling path in mpfs_spi_probe()
2025-12-21dt-bindings: riscv: starfive: Append JH-7110 SoC compatible to VisionFive 2 ↵E Shattow1-0/+1
Lite board Append "starfive,jh7110" compatible to VisionFive 2 Lite and VisionFive 2 Lite eMMC boards in the least-compatible end of the list. Appending "starfive,jh7110" reduces the number of compatible strings to check in the OpenSBI platform driver. JH-7110S SoC on these boards is the same as JH-7110 SoC however rated for thermal, voltage, and frequency characteristics for a maximum of 1.25GHz operation. Link: https://lore.kernel.org/lkml/1f96a267-f5c6-498e-a2c4-7a47a73ea7e7@canonical.com/ Suggested-by: Heinrich Schuchardt <heinrich.schuchardt@canonical.com> Signed-off-by: E Shattow <e@freeshell.de> Signed-off-by: Conor Dooley <conor.dooley@microchip.com>
2025-12-20Merge tag 'mmc-v6.19-rc1' of ↵Linus Torvalds1-1/+1
git://git.kernel.org/pub/scm/linux/kernel/git/ulfh/mmc Pull MMC host fixes from Ulf Hansson: - sdhci-esdhc-imx: Fix build problem dependency - sdhci-of-arasan: Increase card-detect stable timeout to 2 seconds - sdhci-of-aspeed: Fix DT doc for missing properties * tag 'mmc-v6.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/ulfh/mmc: mmc: sdhci-esdhc-imx: add alternate ARCH_S32 dependency to Kconfig mmc: sdhci-of-arasan: Increase CD stable timeout to 2 seconds dt-bindings: mmc: sdhci-of-aspeed: Switch ref to sdhci-common.yaml
2025-12-19dt-bindings: misc: pci1de4,1: add required reg property for endpointAndrea della Porta1-1/+7
The PCI subsystem links an endpoint Device Tree node to its corresponding pci_dev structure only if the Bus/Device/Function (BDF) encoded in the 'reg' property matches the actual hardware topology. Add the 'reg' property and mark it as required to ensure proper binding between the device_node and the pci_dev. Update the example to reflect this requirement. Signed-off-by: Andrea della Porta <andrea.porta@suse.com> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/b58bfcd957b2270fcf932d463f2db534b2ae1a6d.1766077285.git.andrea.porta@suse.com Signed-off-by: Florian Fainelli <florian.fainelli@broadcom.com>
2025-12-19dt-bindings: arm: add CTCU device for monacoJie Gan1-2/+7
The CTCU device for monaco shares the same configurations as SA8775p. Add a fallback to enable the CTCU for monaco to utilize the compitable of the SA8775p. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Acked-by: Suzuki K Poulose <suzuki.poulose@arm.com> Reviewed-by: Bjorn Andersson <andersson@kernel.org> Signed-off-by: Jie Gan <jie.gan@oss.qualcomm.com> Signed-off-by: Suzuki K Poulose <suzuki.poulose@arm.com> Link: https://lore.kernel.org/r/20251103-enable-ctcu-for-monaco-v4-1-92ff83201584@oss.qualcomm.com
2025-12-19dt-bindings: interconnect: qcom,sa8775p-rpmh: Fix incorrectly added reg and ↵Krzysztof Kozlowski1-0/+31
clocks Commit 8a55fbe4c94d ("dt-bindings: interconnect: add reg and clocks properties to enable QoS on sa8775p") claims that all interconnects have clocks and MMIO address space, but that is just not true. Only few have. Bindings should restrict properties and should not allow specifying non-existing hardware description, so fix missing constraints for 'reg' and 'clocks'. Fixes: 8a55fbe4c94d ("dt-bindings: interconnect: add reg and clocks properties to enable QoS on sa8775p") Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Acked-by: Rob Herring (Arm) <robh@kernel.org> Link: https://lore.kernel.org/r/20251129094612.16838-2-krzysztof.kozlowski@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-12-19regulator: dt-bindings: rt5739: Add compatible for rt8092ChiYuan Huang1-0/+5
Append rt8092 compatible in rt5739 document. Compared to rt5739, RT8092 can offer up to 4A output current. Signed-off-by: ChiYuan Huang <cy_huang@richtek.com> Link: https://patch.msgid.link/9b67b2d2b4268d356f41ae2d0c3202e7813ea6b1.1766125676.git.cy_huang@richtek.com Signed-off-by: Mark Brown <broonie@kernel.org>
2025-12-19dt-bindings: riscv: add Zilsd and Zclsd extension descriptionsPincheng Wang1-0/+36
Add descriptions for the Zilsd (Load/Store pair instructions) and Zclsd (Compressed Load/Store pair instructions) ISA extensions which were ratified in commit f88abf1 ("Integrating load/store pair for RV32 with the main manual") of the riscv-isa-manual. Signed-off-by: Pincheng Wang <pincheng.plct@isrc.iscas.ac.cn> Reviewed-by: Nutty Liu <nutty.liu@hotmail.com> Acked-by: Conor Dooley <conor.dooley@microchip.com> Link: https://patch.msgid.link/20250826162939.1494021-2-pincheng.plct@isrc.iscas.ac.cn Signed-off-by: Paul Walmsley <pjw@kernel.org>
2025-12-19dt-bindings: crypto: qcom,prng: document x1e80100Harshal Dev1-0/+1
Document x1e80100 compatible for the True Random Number Generator. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Signed-off-by: Harshal Dev <harshal.dev@oss.qualcomm.com> Signed-off-by: Herbert Xu <herbert@gondor.apana.org.au>
2025-12-18dt-bindings: memory: SDRAM channel: standardise node nameClément Le Goffic1-2/+5
Add a pattern for sdram channel node name. Signed-off-by: Clément Le Goffic <clement.legoffic@foss.st.com> Reviewed-by: Rob Herring (Arm) <robh@kernel.org> Signed-off-by: Clément Le Goffic <legoffic.clement@gmail.com> Link: https://patch.msgid.link/20251118-b4-ddr-bindings-v9-5-a033ac5144da@gmail.com Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
2025-12-18dt-bindings: memory: add DDR4 channel compatibleClément Le Goffic1-0/+10
Add in the memory channel binding the DDR4 compatible to support DDR4 memory channel. Signed-off-by: Clément Le Goffic <clement.legoffic@foss.st.com> Reviewed-by: Rob Herring (Arm) <robh@kernel.org> Signed-off-by: Clément Le Goffic <legoffic.clement@gmail.com> Link: https://patch.msgid.link/20251118-b4-ddr-bindings-v9-4-a033ac5144da@gmail.com Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
2025-12-18dt-bindings: memory: factorise LPDDR channel binding into SDRAM channelClément Le Goffic1-11/+12
LPDDR, DDR and so SDRAM channels exist and share the same properties, they have a compatible, ranks, and an io-width. Signed-off-by: Clément Le Goffic <clement.legoffic@foss.st.com> Reviewed-by: Rob Herring (Arm) <robh@kernel.org> Signed-off-by: Clément Le Goffic <legoffic.clement@gmail.com> Link: https://patch.msgid.link/20251118-b4-ddr-bindings-v9-3-a033ac5144da@gmail.com Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
2025-12-18dt-bindings: memory: introduce DDR4Clément Le Goffic1-0/+34
Introduce JEDEC compliant DDR bindings, that use new memory-props binding. The DDR4 compatible can be made of explicit vendor names and part numbers or be of the form "ddrX-YYYY,AAAA...-ZZ" when associated with an SPD, where (according to JEDEC SPD4.1.2.L-6): - YYYY is the manufacturer ID - AAAA... is the part number - ZZ is the revision ID The former form is useful when the SDRAM vendor and part number are known, for example, when memory is soldered on the board. The latter form is useful when SDRAM nodes are created at runtime by boot firmware that doesn't have access to static part number information. Signed-off-by: Clément Le Goffic <clement.legoffic@foss.st.com> Signed-off-by: Clément Le Goffic <legoffic.clement@gmail.com> Reviewed-by: Rob Herring (Arm) <robh@kernel.org> Link: https://patch.msgid.link/20251118-b4-ddr-bindings-v9-2-a033ac5144da@gmail.com Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
2025-12-18dt-bindings: memory: factorise LPDDR props into SDRAM propsClément Le Goffic6-78/+98
LPDDR and DDR bindings are SDRAM types and are likely to share the same properties (at least for density, io-width and reg). To avoid bindings duplication, factorise the properties. The compatible description has been updated because the MR (Mode registers) used to get manufacturer ID and revision ID are not present in case of DDR. Those information should be in a SPD (Serial Presence Detect) EEPROM in case of DIMM module or are known in case of soldered memory chips as they are in the datasheet of the memory chips. Signed-off-by: Clément Le Goffic <clement.legoffic@foss.st.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Clément Le Goffic <legoffic.clement@gmail.com> Link: https://patch.msgid.link/20251118-b4-ddr-bindings-v9-1-a033ac5144da@gmail.com Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
2025-12-18dt-bindings: gpio-mmio: Add compatible string for opencores,gpioStafford Horne1-5/+10
In FPGA Development boards with GPIOs we use the opencores gpio verilog rtl. This is compatible with the gpio-mmio. Add the compatible string to allow as below. Example: gpio0: gpio@91000000 { compatible = "opencores,gpio", "brcm,bcm6345-gpio"; reg = <0x91000000 0x1>, <0x91000001 0x1>; reg-names = "dat", "dirout"; gpio-controller; #gpio-cells = <2>; status = "okay"; }; Link: https://opencores.org/projects/gpio Signed-off-by: Stafford Horne <shorne@gmail.com> Acked-by: Conor Dooley <conor.dooley@microchip.com> Link: https://lore.kernel.org/r/20251217080843.70621-2-shorne@gmail.com Signed-off-by: Bartosz Golaszewski <bartosz.golaszewski@oss.qualcomm.com>
2025-12-18dt-binding: Update oss email address for Coresight documentsJie Gan7-12/+12
Update the OSS email addresses across all Coresight documents, as the previous addresses have been deprecated. Signed-off-by: Jie Gan <jie.gan@oss.qualcomm.com> Acked-by: Rob Herring (Arm) <robh@kernel.org> Signed-off-by: Suzuki K Poulose <suzuki.poulose@arm.com> Link: https://lore.kernel.org/r/20250902042143.1010-1-jie.gan@oss.qualcomm.com
2025-12-18dt-bindings: gpio: gpio-pca95xx: Add tcal6408 and tcal6416Jan Remmet1-0/+2
TCAL6408 and TCAL6416 supports latchable inputs and maskable interrupt. add compatibles ti,tcal6408 and ti,tcal6416 The TI variants has the same programming model as the NXP PCAL6408 and PCAL6416, but supports other supply voltages. Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Signed-off-by: Jan Remmet <j.remmet@phytec.de> Link: https://lore.kernel.org/r/20251216-wip-jremmet-tcal6416rtw-v2-2-6516d98a9836@phytec.de Signed-off-by: Bartosz Golaszewski <bartosz.golaszewski@oss.qualcomm.com>
2025-12-18spi: atcspi200: Add support for Andes ATCSPI200 SPIMark Brown1-0/+85
Merge series from CL Wang <cl634@andestech.com>: This series adds support for the Andes ATCSPI200 SPI controller.
2025-12-18Add support for NXP XSPIMark Brown1-0/+88
Merge series from Haibo Chen <haibo.chen@nxp.com>: XSPI is a flexible SPI host controller which supports up to 2 external devices (2 CS). It support Single/Dual/Quad/Octal mode data transfer. The difference between XSPI and Flexspi is XSPI support multiple independent execution environments (EENVs) for HW virtualization with some limitations. Each EENV has its own interrupt and its own set of programming registers that exists in a specific offset range in the XSPI memory map. The main environment (EENV0) address space contains all of the registers for controlling EENV0 plus all of the general XSPI control and programming registers. The register mnemonics for the user environments (EENV1 to EENV4) have "_SUB_n" appended to the mnemonic for the corresponding main-environment register. Current driver based on EENV0, which means system already give EENV0 right to linux. This driver use SPI memory interface of the SPI framework to issue flash memory operations. Tested this driver with mtd_debug and UBIFS on NXP i.MX943 EVK board which has one MT35XU512ABA spi nor flash. NOw this driver has the following key features: - Support up to OCT DDR mode - Support AHB read - Support IP read and IP write - Support two CS
2025-12-18dt-bindings: sram: Document qcom,kaanapali-imem and its child nodeJingyi Wang1-0/+2
On Qualcomm Kaanapali platform, IMEM is a block of SRAM shared across multiple IP blocks which can falk back to "mmio-sram". Documnent it and its child node "qcom,pil-reloc-info" which is used for collecting remoteproc ramdumps. Signed-off-by: Jingyi Wang <jingyi.wang@oss.qualcomm.com> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Link: https://lore.kernel.org/r/20251123-knp-soc-binding-v4-1-42b349a66c59@oss.qualcomm.com Signed-off-by: Bjorn Andersson <andersson@kernel.org>
2025-12-18dt-bindings: interrupt-controller: qcom,pdc: Document Kaanapali Power Domain ↵Jingyi Wang1-0/+1
Controller Add a compatible for the Power Domain Controller on Kaanapali platforms. Signed-off-by: Jingyi Wang <jingyi.wang@oss.qualcomm.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20251021-knp-pdc-v2-1-a38767f5bb8e@oss.qualcomm.com Signed-off-by: Bjorn Andersson <andersson@kernel.org>
2025-12-18dt-bindings: arm: qcom: Document Kaanapali SoC and its reference boardsJingyi Wang1-0/+6
Document the Kaanapali SoC binding and the boards which use it. Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Signed-off-by: Jingyi Wang <jingyi.wang@oss.qualcomm.com> Link: https://lore.kernel.org/r/20251215-knp-dts-v4-1-1541bebeb89f@oss.qualcomm.com Signed-off-by: Bjorn Andersson <andersson@kernel.org>
2025-12-17dt-bindings: kbuild: Support single binding targetsRob Herring (Arm)2-5/+12
Running the full 'make dt_binding_check' is slow. A shortcut is to set DT_SCHEMA_FILES env variable to a substring of DT schema files to test. It both limits which examples are validated and which schemas are used to validate the examples. This is a problem because errors from other schemas are missed. What makes validation slow is checking all examples, so we really just need a way to test a single example. Add a %.yaml target to validate the schema and validate the example: make example-schema.yaml The behavior for 'make dt_binding_check DT_SCHEMA_FILES=example-schema' is unchanged. Really it should mirror dtbs_check and validate all the examples with a subset of schemas, but there are lots of users of expecting the existing behavior. Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Link: https://patch.msgid.link/20251208224304.2907913-1-robh@kernel.org Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
2025-12-17dt-bindings: serial: renesas,rsci: Document RZ/G3E supportBiju Das1-11/+88
Add documentation for the serial communication interface (RSCI) found on the Renesas RZ/G3E (R9A09G047) SoC. The RSCI IP on this SoC is identical to that on the RZ/T2H (R9A09G077) SoC, but it has a 32-stage FIFO compared to 16 on RZ/T2H. It supports both FIFO and non-FIFO mode operation. RZ/G3E has 6 clocks(5 module clocks + 1 external clock) compared to 3 clocks (2 module clocks + 1 external clock) on RZ/T2H, and it has multiple resets. It has 6 interrupts compared to 4 on RZ/T2H. Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com> Tested-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com> Link: https://patch.msgid.link/20251129164325.209213-2-biju.das.jz@bp.renesas.com Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2025-12-17dt-bindings: usb: ehci/ohci: Allow "dma-coherent"Rob Herring (Arm)2-0/+4
EHCI and OHCI controllers can be DMA coherent on some platforms, so allow the "dma-coherent" property. Signed-off-by: Rob Herring (Arm) <robh@kernel.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Link: https://patch.msgid.link/20251215212515.3318052-1-robh@kernel.org Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2025-12-17dt-bindings: usb: aspeed,usb-vhub: Add ast2700 supportRyan Chen1-2/+20
Add the "aspeed,ast2700-usb-vhub" compatible. The ast2700 vhub controller requires an reset, so make the "resets" property mandatory for this compatible to reflect the hardware requirement. Signed-off-by: Ryan Chen <ryan_chen@aspeedtech.com> Acked-by: Conor Dooley <conor.dooley@microchip.com> Link: https://patch.msgid.link/20251128-upstream_vhub-v2-1-1fa66a5833c2@aspeedtech.com Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2025-12-17spi: dt-bindings: Add support for ATCSPI200 SPI controllerCL Wang1-0/+85
Document devicetree bindings for the Andes ATCSPI200 SPI controller. Signed-off-by: CL Wang <cl634@andestech.com> Acked-by: Conor Dooley <conor.dooley@microchip.com> Link: https://patch.msgid.link/20251215132349.513843-2-cl634@andestech.com Signed-off-by: Mark Brown <broonie@kernel.org>
2025-12-17spi: atcspi200: Add ATCSPI200 SPI controller driverCL Wang0-0/+0
Add driver for the Andes ATCSPI200 SPI controller. Signed-off-by: CL Wang <cl634@andestech.com> Link: https://patch.msgid.link/20251215132349.513843-3-cl634@andestech.com Signed-off-by: Mark Brown <broonie@kernel.org>
2025-12-17spi: dt-bindings: nxp,imx94-xspi: Document imx94 xspiHaibo Chen1-0/+88
Document imx94 xspi that supports interface to serial flash supporting following features: - Single-bit SPI, Dual SPI, Quad SPI and Octal SPI. - Single Data Rate or Double Data Rate modes. - Direct memory mapping of all AHB memory accesses to the chip system memory space. - Multi-master AHB accesses with priority. Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org> Signed-off-by: Haibo Chen <haibo.chen@nxp.com> Link: https://patch.msgid.link/20251216-xspi-v7-1-282525220979@nxp.com Signed-off-by: Mark Brown <broonie@kernel.org>
2025-12-17spi: dt-bindings: snps,dw-abp-ssi: Allow up to 16 chip-selectsRob Herring (Arm)1-3/+3
At least the Microchip Sparx5 supports up to 16 chip-selects, so increase the maximum. The pattern for the child unit-address was unconstrained, so update it to match the maximum number of chip-selects. Signed-off-by: Rob Herring (Arm) <robh@kernel.org> Link: https://patch.msgid.link/20251215230323.3634112-1-robh@kernel.org Signed-off-by: Mark Brown <broonie@kernel.org>
2025-12-17dt-bindings: eeprom: at24: Add compatible for Giantec GT24P64ALuca Weiss1-0/+1
Add the compatible for another 64Kb EEPROM from Giantec. Signed-off-by: Luca Weiss <luca.weiss@fairphone.com> Acked-by: Rob Herring (Arm) <robh@kernel.org> Link: https://lore.kernel.org/r/20251210-fp4-cam-prep-v1-1-0eacbff271ec@fairphone.com Signed-off-by: Bartosz Golaszewski <bartosz.golaszewski@oss.qualcomm.com>
2025-12-17dt-bindings: eeprom: at24: Add compatible for Belling BL24C04A/BL24C16FFUKAUMI Naoki1-0/+2
Add the compatible for Belling BL24C04A 4Kb EEPROM and BL24C16F 16Kb EEPROM. Signed-off-by: FUKAUMI Naoki <naoki@radxa.com> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Link: https://lore.kernel.org/r/20251202084941.1785-2-naoki@radxa.com Signed-off-by: Bartosz Golaszewski <bartosz.golaszewski@oss.qualcomm.com>
2025-12-17dt-bindings: arm: qcom: Add Medion SPRCHRGD deviceGeorg Gottleuber1-0/+1
Introduce new binding for the Medion SPRCHRGD 14 S1 notebook with X1E78100 SoC. Signed-off-by: Georg Gottleuber <ggo@tuxedocomputers.com> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Link: https://lore.kernel.org/r/20251204155212.230058-5-ggo@tuxedocomputers.com Signed-off-by: Bjorn Andersson <andersson@kernel.org>
2025-12-17dt-bindings: vendor-prefixes: Add Medion AGGeorg Gottleuber1-0/+2
Add Medion AG, a German electronics company, to the list of vendor prefixes. Link: https://www.medion.com/ Signed-off-by: Georg Gottleuber <ggo@tuxedocomputers.com> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Link: https://lore.kernel.org/r/20251204155212.230058-4-ggo@tuxedocomputers.com Signed-off-by: Bjorn Andersson <andersson@kernel.org>
2025-12-17dt-bindings: arm: qcom: Add TUXEDO Computers deviceGeorg Gottleuber1-0/+6
Introduce new binding for the TUXEDO Elite 14 Gen1 laptop with X1E78100 SoC. Signed-off-by: Georg Gottleuber <ggo@tuxedocomputers.com> Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org> Link: https://lore.kernel.org/r/20251204155212.230058-3-ggo@tuxedocomputers.com Signed-off-by: Bjorn Andersson <andersson@kernel.org>
2025-12-17dt-bindings: vendor-prefixes: Add prefix for TUXEDO Computers GmbHGeorg Gottleuber1-0/+2
TUXEDO Computers GmbH is a German supplier for computers. Signed-off-by: Georg Gottleuber <ggo@tuxedocomputers.com> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20251204155212.230058-2-ggo@tuxedocomputers.com Signed-off-by: Bjorn Andersson <andersson@kernel.org>