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2020-01-27dt-bindings: brcm,avs-ro-thermal: Fix binding check issuesStefan Wahren1-3/+6
Drop the reg property since this only necessary for the parent and add the missing thermal-sensor-cells property description. Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com> Fixes: 37e9cc08e9678 ("dt-bindings: Add Broadcom AVS RO thermal") Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1579200077-17496-1-git-send-email-stefan.wahren@i2se.com
2020-01-27dt-bindings: thermal: Define BCM7216 thermal sensor compatibleFlorian Fainelli1-2/+6
BCM7216 is a 16nm process STB chip, which requires a different compatible string to differentiate different temperature formulas. Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Florian Fainelli <f.fainelli@gmail.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200114190607.29339-4-f.fainelli@gmail.com
2020-01-27dt-bindings: Add Broadcom AVS RO thermalStefan Wahren1-0/+45
Since the BCM2711 doesn't have a AVS TMON block, the thermal information must be retrieved from the AVS ring oscillator block. This block is part of the AVS monitor which contains a bunch of raw sensors. Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1578941778-23321-2-git-send-email-stefan.wahren@i2se.com
2020-01-27dt-bindings: thermal: Add YAML schema for sun8i-thermal driver bindingsYangtao Li1-0/+160
sun8i-thermal driver supports thermal sensor in wide range of Allwinner SoCs. Add YAML schema for its bindings. Signed-off-by: Yangtao Li <tiny.windzz@gmail.com> Signed-off-by: Vasily Khoruzhick <anarsoul@gmail.com> Acked-by: Maxime Ripard <mripard@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20191219172823.1652600-3-anarsoul@gmail.com
2019-12-05Merge branch 'thermal/next' of ↵Linus Torvalds4-55/+225
git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux Pull thermal management updates from Zhang Rui: - Fix a deadlock regression in thermal core framework, which was introduced in 5.3 (Wei Wang) - Initialize thermal control framework earlier to enable thermal mitigation during boot (Amit Kucheria) - Convert the Intelligent Power Allocator (IPA) thermal governor to follow the generic PM_EM instead of its own Energy Model (Quentin Perret) - Introduce a new Amlogic soc thermal driver (Guillaume La Roque) - Add interrupt support for tsens thermal driver (Amit Kucheria) - Add support for MSM8956/8976 in tsens thermal driver (AngeloGioacchino Del Regno) - Add support for r8a774b1 in rcar thermal driver (Biju Das) - Add support for Thermal Monitor Unit v2 in qoriq thermal driver (Yuantian Tang) - Some other fixes/cleanups on thermal core framework and soc thermal drivers (Colin Ian King, Daniel Lezcano, Hsin-Yi Wang, Tian Tao) * 'thermal/next' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (32 commits) thermal: Fix deadlock in thermal thermal_zone_device_check thermal: cpu_cooling: Migrate to using the EM framework thermal: cpu_cooling: Make the power-related code depend on IPA PM / EM: Declare EM data types unconditionally arm64: defconfig: Enable CONFIG_ENERGY_MODEL drivers: thermal: tsens: fix potential integer overflow on multiply thermal: cpu_cooling: Reorder the header file thermal: cpu_cooling: Remove pointless dependency on CONFIG_OF thermal: no need to set .owner when using module_platform_driver thermal: qcom: tsens-v1: Fix kfree of a non-pointer value cpufreq: qcom-hw: Move driver initialization earlier clk: qcom: Initialize clock drivers earlier cpufreq: Initialize cpufreq-dt driver earlier cpufreq: Initialize the governors in core_initcall thermal: Initialize thermal subsystem earlier thermal: Remove netlink support dt: thermal: tsens: Document compatible for MSM8976/56 thermal: qcom: tsens-v1: Add support for MSM8956 and MSM8976 MAINTAINERS: add entry for Amlogic Thermal driver thermal: amlogic: Add thermal driver to support G12 SoCs ...
2019-11-07dt: thermal: tsens: Document compatible for MSM8976/56AngeloGioacchino Del Regno1-0/+2
Support for MSM8976 and MSM8956 (having tsens ip version 1) has been added to the qcom tsens driver: document the addition here. Signed-off-by: AngeloGioacchino Del Regno <kholk11@gmail.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20191005104133.30297-3-kholk11@gmail.com
2019-11-07dt-bindings: thermal: Add DT bindings documentation for Amlogic ThermalGuillaume La Roque1-0/+54
Adding the devicetree binding documentation for the Amlogic temperature sensor found in the Amlogic Meson G12A and G12B SoCs. Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Tested-by: Christian Hewitt <christianshewitt@gmail.com> Tested-by: Kevin Hilman <khilman@baylibre.com> Signed-off-by: Guillaume La Roque <glaroque@baylibre.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20191004090114.30694-2-glaroque@baylibre.com
2019-11-07dt-bindings: thermal: tsens: Convert over to a yaml schemaAmit Kucheria2-55/+168
Older IP only supports the 'uplow' interrupt, but newer IP supports 'uplow' and 'critical' interrupts. Document interrupt support in the tsens driver by converting over to a YAML schema. Suggested-by: Stephen Boyd <swboyd@chromium.org> Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/d519be4c7198f47c3661f7326d1a724b97dc4973.1572526427.git.amit.kucheria@linaro.org
2019-11-07dt-bindings: thermal: rcar-gen3-thermal: Add r8a774b1 supportBiju Das1-0/+1
Document RZ/G2N (R8A774B1) SoC bindings. Signed-off-by: Biju Das <biju.das@bp.renesas.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1569248589-52372-1-git-send-email-biju.das@bp.renesas.com
2019-10-14dt-bindings: thermal: Convert stm32 thermal bindings to json-schemaBenjamin Gaignard2-61/+79
Convert the STM32 thermal binding to DT schema format using json-schema Signed-off-by: Benjamin Gaignard <benjamin.gaignard@st.com> Signed-off-by: Rob Herring <robh@kernel.org>
2019-08-28dt-bindings: thermal: qoriq: Add optional clocks propertyAnson Huang1-0/+1
Some platforms like i.MX8M series SoCs have clock control for TMU, add optional clocks property to the binding doc. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Dong Aisheng <aisheng.dong@nxp.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2019-05-14dt-bindings: rockchip-thermal: Support the PX30 SoC compatibleElaine Zhang1-0/+1
Add a new compatible for thermal founding on PX30 SoCs. Signed-off-by: Elaine Zhang <zhangqing@rock-chips.com> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-05-14dt-bindings: thermal: generic-adc: make lookup-table optionalJean-Francois Dagenais1-2/+8
Update binding description making lookup-table optional. Signed-off-by: Jean-Francois Dagenais <jeff.dagenais@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-05-14dt-bindings: thermal: al-thermal: Add binding documentationTalel Shenhar1-0/+33
Add thermal binding documentation for Amazon's Annapurna Labs Thermal Sensor. Signed-off-by: Talel Shenhar <talel@amazon.com> Reviewed-by: David Woodhouse <dwmw@amazon.co.uk> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-05-14dt: thermal: tsens: Add bindings for qcs404Amit Kucheria1-0/+14
qcs404 uses v1 of the TSENS IP block. Create a fallback DT property "qcom,tsens-v1" to gather common code Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-05-14of: Add bindings of OC hw throttle for Tegra socthermWei Ni1-0/+25
Add OC HW throttle configuration for soctherm in DT. It is used to describe the OCx throttle events. Signed-off-by: Wei Ni <wni@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-05-14of: Add bindings of gpu hw throttle for Tegra socthermWei Ni1-2/+15
Add "nvidia,gpu-throt-level" property to set gpu hw throttle level. Signed-off-by: Wei Ni <wni@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-05-14of: Add bindings of thermtrip for Tegra socthermWei Ni1-3/+17
Add optional property "nvidia,thermtrips". If present, these trips will be used as HW shutdown trips, and critical trips will be used as SW shutdown trips. Signed-off-by: Wei Ni <wni@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-02-06dt-bindings: thermal: add binding document for mt8183 thermal controllerMichael Kao1-0/+1
This patch adds binding document for mt8183 thermal controller. Signed-off-by: Michael Kao <michael.kao@mediatek.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-02-06dt-bindings: thermal: Add binding document for SR thermalPramod Kumar1-0/+105
Add binding document for supported thermal implementation in Stingray. Reviewed-by: Ray Jui <ray.jui@broadcom.com> Reviewed-by: Scott Branden <scott.branden@broadcom.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Pramod Kumar <pramod.kumar@broadcom.com> Signed-off-by: Srinath Mannam <srinath.mannam@broadcom.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-01-02dt-bindings: thermal: rcar-thermal: add R8A77990 supportYoshihiro Kaneko1-2/+3
Document the R-Car E3 (R8A77990) SoC bindings. Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> Tested-by: Simon Horman <horms+renesas@verge.net.au> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-01-02dt-bindings: thermal: rcar-thermal: add R8A774C0 supportFabrizio Castro1-2/+3
Document RZ/G2E SoC (a.k.a. r8a774c0) bindings. Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-01-02dt-bindings: thermal: tegra-bpmp: Add Tegra194 supportThierry Reding1-1/+2
The thermal controller implementation on Tegra194 is very similar to the implementation on Tegra186. Add a compatible string for the new generation. Signed-off-by: Thierry Reding <treding@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-01-02dt-bindings: thermal: rcar-gen3-thermal: All variants use 3 interruptsGeert Uytterhoeven1-2/+1
RZ/G2M also has 3 interrupts routed to the TSC, but the list was not updated to reflect this. Just drop the list, as this is the case for this TSC variant in all R-Car Gen3 and RZ/G2 SoCs. Fixes: be6af481f3b2d508 ("dt-bindings: thermal: rcar-gen3-thermal: Add r8a774a1 support") Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-10-26Merge branch 'linus' of ↵Linus Torvalds6-18/+78
git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal Pull thermal SoC updates from Eduardo Valentin: "Several new things coming up. Specifics: - Rework of tsens and hisi thermal drivers - OF-thermal now allows sharing multiple cooling devices on maps - Added support for r8a7744 and R8A77970 on rcar thermal driver - Added support for r8a774a1 on rcar_gen3 thermal driver - New thermal driver stm32 - Fixes on multiple thermal drivers: of-thermal, imx, qoriq, armada, qcom-spmi, rcar, da9062/61" * 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (41 commits) thermal: da9062/61: Prevent hardware access during system suspend thermal: rcar_thermal: Prevent doing work after unbind thermal: rcar_thermal: Prevent hardware access during system suspend thermal: rcar_gen3_thermal: add R8A77980 support dt-bindings: thermal: rcar-gen3-thermal: document R8A77980 bindings thermal: add stm32 thermal driver dt-bindings: stm32-thermal: add binding documentation thermal: rcar_thermal: add R8A77970 support dt-bindings: thermal: rcar-thermal: document R8A77970 bindings thermal: rcar_thermal: fix duplicate IRQ request dt-bindings: thermal: rcar: Add device tree support for r8a7744 thermal/drivers/hisi: Add the dual clusters sensors for hi3660 thermal/drivers/hisi: Add more sensors channel thermal/drivers/hisi: Remove pointless irq field thermal/drivers/hisi: Use platform_get_irq_byname thermal/drivers/hisi: Replace macro name with relevant sensor location thermal/drivers/hisi: Add multiple sensors support thermal/drivers/hisi: Prepare to support multiple sensors thermal/drivers/hisi: Factor out the probe functions thermal/drivers/hisi: Set the thermal zone private data to the sensor pointer ...
2018-10-25dt-bindings: thermal: rcar-gen3-thermal: document R8A77980 bindingsSergei Shtylyov1-1/+3
Document the R-Car V3H (R8A77980) SoC in the Renesas R-Car gen3 thermal bindings. Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-10-25dt-bindings: stm32-thermal: add binding documentationDavid HERNANDEZ SANCHEZ1-0/+61
Add thermal binding documentation for STM32 DTS sensor Signed-off-by: David Hernandez Sanchez <david.hernandezsanchez@st.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-10-25dt-bindings: thermal: rcar-thermal: document R8A77970 bindingsSergei Shtylyov1-2/+3
Document the R-Car V3M (R8A77970) SoC in the Renesas R-Car gen2 thermal bindings. The hardware is the same as in the R-Car D3 (R8A77995) plus an extra status register. Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-10-23dt-bindings: thermal: rcar: Add device tree support for r8a7744Biju Das1-0/+1
Add thermal sensor support for r8a7744 SoC. The Renesas RZ/G1N (r8a7744) thermal sensor module is identical to the R-Car Gen2 family. No driver change is needed due to the fallback compatible value "renesas,rcar-gen2-thermal". Signed-off-by: Biju Das <biju.das@bp.renesas.com> Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-10-23dt-bindings: thermal: Fix a typo in documentationAmit Kucheria1-1/+1
c(1) + x(1) was actually meant to be c(1) * x(1). Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Reviewed-by: Matthias Kaehlcke <mka@chromium.org> Acked-by: Rob Herring <robh@kernel.org> Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-10-23thermal: qoriq: add i.mx8mq supportAnson Huang1-3/+3
Add i.mx8mq specific compatible string. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-08-25dt-bindings: thermal: rcar-gen3-thermal: Add r8a774a1 supportFabrizio Castro1-0/+1
Document RZ/G2M (R8A774A1) SoC bindings. Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com> Reviewed-by: Biju Das <biju.das@bp.renesas.com> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-08-25dt-bindings: thermal: qcom-spmi-temp-alarm: Improve thermal zone in exampleMatthias Kaehlcke1-8/+3
The current example for a thermal zone isn't very useful as reference since it would result in a hardware shutdown at 145°C, instead of allowing the system to try to shutdown gracefully. Without an ADC channel a maximum of two trip points is useful in practice for this sensor, with temperatures corresponding to the stage 1 and stage 2 'hardware trip points'. A critical trip point at stage 2 may allow the system to shutdown before a hardware shutdown at stage 3 kicks in. It should be noted though that by default the chip performs a 'partial shutdown' when the temperature reaches stage 2, which may prevent an orderly shutdown. The 'partial shutdown' can be disabled by software. Signed-off-by: Matthias Kaehlcke <mka@chromium.org> Reviewed-by: Douglas Anderson <dianders@chromium.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-08-25dt-bindings: thermal: qcom-spmi-temp-alarm: Fix documentation of 'reg'Matthias Kaehlcke1-3/+2
The documentation claims that the 'reg' property consists of two values, the SPMI address and the length of the controller's registers. However the SPMI bus to which it is added specifies "#size-cells = <0>;". Remove the controller register length from the documentation of the field and the example. Signed-off-by: Matthias Kaehlcke <mka@chromium.org> Reviewed-by: Douglas Anderson <dianders@chromium.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-08-24Merge branch 'next' of ↵Linus Torvalds1-8/+3
git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management updates from Zhang Rui: - Add Daniel Lezcano as the reviewer of thermal framework and SoC driver changes (Daniel Lezcano). - Fix a bug in intel_dts_soc_thermal driver, which does not translate IO-APIC GSI (Global System Interrupt) into Linux irq number (Hans de Goede). - For device tree bindings, allow cooling devices sharing same trip point with same contribution value to share cooling map (Viresh Kumar). * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: dt-bindings: thermal: Allow multiple devices to share cooling map MAINTAINERS: Add Daniel Lezcano as designated reviewer for thermal Thermal: Intel SoC DTS: Translate IO-APIC GSI number to linux irq number
2018-08-16Merge branch 'linus' of ↵Linus Torvalds2-6/+30
git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal Pull thermal management updates from Eduardo Valentin: - rework tsens driver to add support for tsens-v2 (Amit Kucheria) - rework armada thermal driver to use syscon and multichannel support (Miquel Raynal) - fixes to TI SoC, IMX, Exynos, RCar, and hwmon drivers * 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (34 commits) thermal: armada: fix copy-paste error in armada_thermal_probe() thermal: rcar_thermal: avoid NULL dereference in absence of IRQ resources thermal: samsung: Remove Exynos5440 clock handling left-overs thermal: tsens: Fix negative temperature reporting thermal: tsens: switch from of_iomap() to devm_ioremap_resource() thermal: tsens: Rename variable thermal: tsens: Add generic support for TSENS v2 IP thermal: tsens: Rename tsens-8996 to tsens-v2 for reuse thermal: tsens: Add support to split up register address space into two dt: thermal: tsens: Document the fallback DT property for v2 of TSENS IP thermal: tsens: Get rid of unused fields in structure thermal_hwmon: Pass the originating device down to hwmon_device_register_with_info thermal_hwmon: Sanitize attribute name passed to hwmon dt-bindings: thermal: armada: add reference to new bindings dt-bindings: cp110: add the thermal node in the syscon file dt-bindings: cp110: update documentation since DT de-duplication dt-bindings: ap806: add the thermal node in the syscon file dt-bindings: cp110: prepare the syscon file to list other syscons nodes dt-bindings: ap806: prepare the syscon file to list other syscons nodes dt-bindings: cp110: rename cp110 syscon file ...
2018-08-06dt-bindings: thermal: Allow multiple devices to share cooling mapViresh Kumar1-8/+3
Allow cooling devices sharing same trip point with same contribution value to share the cooling map as well. Otherwise the same information will be duplicated for each device sharing the trip point. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2018-07-28dt: thermal: tsens: Document the fallback DT property for v2 of TSENS IPAmit Kucheria1-6/+25
We want to create common code for v2 of the TSENS IP block that is used in a large number of Qualcomm SoCs. "qcom,tsens-v2" should be able to handle most of the common functionality start with a common get_temp() function. It is also necessary to split out the memory regions for the TM and SROT register banks because their offsets are not constant across SoC families. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Tested-by: Matthias Kaehlcke <mka@chromium.org> Reviewed-by: Matthias Kaehlcke <mka@chromium.org> Reviewed-by: Douglas Anderson <dianders@chromium.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-07-28dt-bindings: thermal: armada: add reference to new bindingsMiquel Raynal1-0/+5
New bindings (using a syscon) are available for AP806 and CP110 compatibles. Add a reference to these files from the original documentation. Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-07-25dt-bindings: remove 'interrupt-parent' from bindingsRob Herring2-2/+0
'interrupt-parent' is often documented as part of define bindings, but it is really outside the scope of a device binding. It's never required in a given node as it is often inherited from a parent node. Or it can be implicit if a parent node is an 'interrupt-controller' node. So remove it from all the binding files. Cc: Mark Rutland <mark.rutland@arm.com> Cc: devicetree@vger.kernel.org Signed-off-by: Rob Herring <robh@kernel.org>
2018-06-12Merge branch 'linus' of ↵Linus Torvalds7-18/+18
git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal Pull thermal SoC updates from Zhang Rui: "Thermal SoC management updates: - imx thermal driver now supports i.MX7 thermal sensor (Anson Huang) - exynos thermal driver dropped support for exynos 5440 (Krzysztof Kozlowski) - rcar_thermal now supports r8a77995 (Yoshihiro Kaneko) - rcar_gen3_thermal now supports r8a77965 (Niklas Söderlund) - qcom-spmi-temp-alarm now supports GEN2 PMIC peripherals (David Collins) - uniphier thermal now supports UniPhier PXs3 (Kunihiko Hayashi) - mediatek thermal now supports MT7622 SoC (Sean Wang) - considerable refactoring of exynos driver (Bartlomiej Zolnierkiewicz) - small fixes all over the place on different drivers" * 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (50 commits) thermal: qcom: tsens: Allow number of sensors to come from DT thermal: tegra: soctherm: add const to struct thermal_cooling_device_ops thermal: exynos: Reduce severity of too early temperature read thermal: imx: Switch to SPDX identifier thermal: qcom-spmi-temp-alarm: add support for GEN2 PMIC peripherals thermal: ti-soc-thermal: fix incorrect entry in omap5430_adc_to_temp[] thermal: rcar_thermal: add r8a77995 support dt-bindings: thermal: rcar-thermal: add R8A77995 support thermal: mediatek: use of_device_get_match_data() thermal: exynos: remove trip reporting to user-space thermal: exynos: remove unused defines for Exynos5433 thermal: exynos: cleanup code for enabling threshold interrupts thermal: exynos: check return values of ->get_trip_[temp, hyst] methods thermal: exynos: move trips setting to exynos_tmu_initialize() thermal: exynos: set trips in ascending order in exynos7_tmu_initialize() thermal: exynos: do not use trips structure directly in ->tmu_initialize thermal: exynos: add exynos*_tmu_set_[trip,hyst]() helpers thermal: exynos: move IRQs clearing to exynos_tmu_initialize() thermal: exynos: clear IRQs later in exynos4412_tmu_initialize() thermal: exynos: make ->tmu_initialize method void ...
2018-06-08Merge tag 'devicetree-for-4.18' of ↵Linus Torvalds1-3/+3
git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux Pull DeviceTree updates from Rob Herring: - Sync dtc with upstream version v1.4.6-21-g84e414b0b5bc. This adds new warnings which are either fixed or disabled by default (enabled with W=1). - Validate an untrusted offset in DT overlay function update_usages_of_a_phandle_reference - Fix a use after free error of_platform_device_destroy - Fix an off by 1 string errors in unittest - Avoid creating a struct device for OPP nodes - Update DT specific submitting-patches.txt with patch content and subject requirements. - Move some bindings to their proper subsystem locations - Add vendor prefixes for Kaohsiung, SiFive, Avnet, Wi2Wi, Logic PD, and ArcherMind - Add documentation for "no-gpio-delays" property in FSI bus GPIO master - Add compatible for r8a77990 SoC ravb ethernet block - More wack-a-mole removal of 'status' property in examples * tag 'devicetree-for-4.18' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (25 commits) dt-bindings: submitting-patches: add guidance on patch content and subject of: platform: stop accessing invalid dev in of_platform_device_destroy dt-bindings: net: ravb: Add support for r8a77990 SoC dt-bindings: Add vendor prefix for ArcherMind dt-bindings: fsi-master-gpio: Document "no-gpio-delays" property dt-bindings: Add vendor prefix for Logic PD of: overlay: validate offset from property fixups of: unittest: for strings, account for trailing \0 in property length field drm: rcar-du: disable dtc graph-endpoint warnings on DT overlays kbuild: disable new dtc graph and unit-address warnings scripts/dtc: Update to upstream version v1.4.6-21-g84e414b0b5bc MAINTAINERS: add keyword for devicetree overlay notifiers dt-bindings: define vendor prefix for Wi2Wi, Inc. dt-bindings: Add vendor prefix for Avnet, Inc. dt-bindings: Relocate Tegra20 memory controller bindings dt-bindings: Add "sifive" vendor prefix dt-bindings: exynos: move ADC binding to iio/adc/ directory dt-bindings: powerpc/4xx: move 4xx NDFC and EMAC bindings to subsystem directories dt-bindings: move various RNG bindings to rng/ directory dt-bindings: move various timer bindings to timer/ directory ...
2018-06-02thermal: qcom: tsens: Allow number of sensors to come from DTBjorn Andersson1-0/+1
For platforms that has multiple copies of the TSENS hardware block it's necessary to be able to specify the number of sensors per block in DeviceTree. Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-06-02dt-bindings: thermal: rcar-thermal: add R8A77995 supportYoshihiro Kaneko1-2/+5
Update rcar thermal dt-binding to add R8A77995 info. Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-05-07thermal: samsung: Remove support for Exynos5440Krzysztof Kozlowski1-13/+1
The Exynos5440 is not actively developed, there are no development boards available and probably there are no real products with it. Remove wide-tree support for Exynos5440. Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org> [b.zolnierkie: ported over driver changes] Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-05-07dt-bindings: thermal: rcar-gen3-thermal: add r8a77965Niklas Söderlund1-1/+2
Based on previous work by Ryo Kataoka <ryo.kataoka.wt@renesas.com>. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-05-07dt-bindings: thermal: uniphier: add a compatible string for PXs3Kunihiko Hayashi1-0/+1
Add a compatible string for thermal monitor implemented on UniPhier PXs3 SoC. Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-05-06thermal: imx: add i.MX7 thermal sensor supportAnson Huang1-2/+7
This patch adds i.MX7 thermal sensor support, most of the i.MX7 thermal sensor functions are same with i.MX6 except the registers offset/layout, so we move those registers offset/layout definitions to soc data structure. i.MX7 uses single calibration data @25C, the calibration data is located at OCOTP offset 0x4F0, bit[17:9], the formula is as below: Tmeas = (Nmeas - n1) + 25; n1 is the fuse value for 25C. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Signed-off-by: Bai Ping <ping.bai@nxp.com> Acked-by: Dong Aisheng <aisheng.dong@nxp.com> Acked-by: Shawn Guo <shawnguo@kernel.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-05-06dt-bindings: thermal: add binding for MT7622 SoCSean Wang1-0/+1
Add devicetree bindings for MediaTek MT7622 thermal controller Changes v1 -> v2: add tag from Rob Signed-off-by: Sean Wang <sean.wang@mediatek.com> Signed-off-by: Shunli Wang <shunli.wang@mediatek.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-04-24dt-bindings: thermal: rcar-gen3-thermal: update register size in exampleNiklas Söderlund1-3/+3
The datasheet has been expanded with more registers and the DT files have been updated with the new size. This change updates the example so writing new DT files can use the enhanced driver which uses the new registers. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> [robh: s/have/has/, s/enchanted/enhanced/] Signed-off-by: Rob Herring <robh@kernel.org>
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