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2019-08-28dt-bindings: thermal: qoriq: Add optional clocks propertyAnson Huang1-0/+1
Some platforms like i.MX8M series SoCs have clock control for TMU, add optional clocks property to the binding doc. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Dong Aisheng <aisheng.dong@nxp.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2019-05-14dt-bindings: rockchip-thermal: Support the PX30 SoC compatibleElaine Zhang1-0/+1
Add a new compatible for thermal founding on PX30 SoCs. Signed-off-by: Elaine Zhang <zhangqing@rock-chips.com> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-05-14dt-bindings: thermal: generic-adc: make lookup-table optionalJean-Francois Dagenais1-2/+8
Update binding description making lookup-table optional. Signed-off-by: Jean-Francois Dagenais <jeff.dagenais@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-05-14dt-bindings: thermal: al-thermal: Add binding documentationTalel Shenhar1-0/+33
Add thermal binding documentation for Amazon's Annapurna Labs Thermal Sensor. Signed-off-by: Talel Shenhar <talel@amazon.com> Reviewed-by: David Woodhouse <dwmw@amazon.co.uk> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-05-14dt: thermal: tsens: Add bindings for qcs404Amit Kucheria1-0/+14
qcs404 uses v1 of the TSENS IP block. Create a fallback DT property "qcom,tsens-v1" to gather common code Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-05-14of: Add bindings of OC hw throttle for Tegra socthermWei Ni1-0/+25
Add OC HW throttle configuration for soctherm in DT. It is used to describe the OCx throttle events. Signed-off-by: Wei Ni <wni@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-05-14of: Add bindings of gpu hw throttle for Tegra socthermWei Ni1-2/+15
Add "nvidia,gpu-throt-level" property to set gpu hw throttle level. Signed-off-by: Wei Ni <wni@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-05-14of: Add bindings of thermtrip for Tegra socthermWei Ni1-3/+17
Add optional property "nvidia,thermtrips". If present, these trips will be used as HW shutdown trips, and critical trips will be used as SW shutdown trips. Signed-off-by: Wei Ni <wni@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-02-06dt-bindings: thermal: add binding document for mt8183 thermal controllerMichael Kao1-0/+1
This patch adds binding document for mt8183 thermal controller. Signed-off-by: Michael Kao <michael.kao@mediatek.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-02-06dt-bindings: thermal: Add binding document for SR thermalPramod Kumar1-0/+105
Add binding document for supported thermal implementation in Stingray. Reviewed-by: Ray Jui <ray.jui@broadcom.com> Reviewed-by: Scott Branden <scott.branden@broadcom.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Pramod Kumar <pramod.kumar@broadcom.com> Signed-off-by: Srinath Mannam <srinath.mannam@broadcom.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-01-02dt-bindings: thermal: rcar-thermal: add R8A77990 supportYoshihiro Kaneko1-2/+3
Document the R-Car E3 (R8A77990) SoC bindings. Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> Tested-by: Simon Horman <horms+renesas@verge.net.au> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-01-02dt-bindings: thermal: rcar-thermal: add R8A774C0 supportFabrizio Castro1-2/+3
Document RZ/G2E SoC (a.k.a. r8a774c0) bindings. Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-01-02dt-bindings: thermal: tegra-bpmp: Add Tegra194 supportThierry Reding1-1/+2
The thermal controller implementation on Tegra194 is very similar to the implementation on Tegra186. Add a compatible string for the new generation. Signed-off-by: Thierry Reding <treding@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-01-02dt-bindings: thermal: rcar-gen3-thermal: All variants use 3 interruptsGeert Uytterhoeven1-2/+1
RZ/G2M also has 3 interrupts routed to the TSC, but the list was not updated to reflect this. Just drop the list, as this is the case for this TSC variant in all R-Car Gen3 and RZ/G2 SoCs. Fixes: be6af481f3b2d508 ("dt-bindings: thermal: rcar-gen3-thermal: Add r8a774a1 support") Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-10-26Merge branch 'linus' of ↵Linus Torvalds6-18/+78
git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal Pull thermal SoC updates from Eduardo Valentin: "Several new things coming up. Specifics: - Rework of tsens and hisi thermal drivers - OF-thermal now allows sharing multiple cooling devices on maps - Added support for r8a7744 and R8A77970 on rcar thermal driver - Added support for r8a774a1 on rcar_gen3 thermal driver - New thermal driver stm32 - Fixes on multiple thermal drivers: of-thermal, imx, qoriq, armada, qcom-spmi, rcar, da9062/61" * 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (41 commits) thermal: da9062/61: Prevent hardware access during system suspend thermal: rcar_thermal: Prevent doing work after unbind thermal: rcar_thermal: Prevent hardware access during system suspend thermal: rcar_gen3_thermal: add R8A77980 support dt-bindings: thermal: rcar-gen3-thermal: document R8A77980 bindings thermal: add stm32 thermal driver dt-bindings: stm32-thermal: add binding documentation thermal: rcar_thermal: add R8A77970 support dt-bindings: thermal: rcar-thermal: document R8A77970 bindings thermal: rcar_thermal: fix duplicate IRQ request dt-bindings: thermal: rcar: Add device tree support for r8a7744 thermal/drivers/hisi: Add the dual clusters sensors for hi3660 thermal/drivers/hisi: Add more sensors channel thermal/drivers/hisi: Remove pointless irq field thermal/drivers/hisi: Use platform_get_irq_byname thermal/drivers/hisi: Replace macro name with relevant sensor location thermal/drivers/hisi: Add multiple sensors support thermal/drivers/hisi: Prepare to support multiple sensors thermal/drivers/hisi: Factor out the probe functions thermal/drivers/hisi: Set the thermal zone private data to the sensor pointer ...
2018-10-25dt-bindings: thermal: rcar-gen3-thermal: document R8A77980 bindingsSergei Shtylyov1-1/+3
Document the R-Car V3H (R8A77980) SoC in the Renesas R-Car gen3 thermal bindings. Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-10-25dt-bindings: stm32-thermal: add binding documentationDavid HERNANDEZ SANCHEZ1-0/+61
Add thermal binding documentation for STM32 DTS sensor Signed-off-by: David Hernandez Sanchez <david.hernandezsanchez@st.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-10-25dt-bindings: thermal: rcar-thermal: document R8A77970 bindingsSergei Shtylyov1-2/+3
Document the R-Car V3M (R8A77970) SoC in the Renesas R-Car gen2 thermal bindings. The hardware is the same as in the R-Car D3 (R8A77995) plus an extra status register. Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-10-23dt-bindings: thermal: rcar: Add device tree support for r8a7744Biju Das1-0/+1
Add thermal sensor support for r8a7744 SoC. The Renesas RZ/G1N (r8a7744) thermal sensor module is identical to the R-Car Gen2 family. No driver change is needed due to the fallback compatible value "renesas,rcar-gen2-thermal". Signed-off-by: Biju Das <biju.das@bp.renesas.com> Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-10-23dt-bindings: thermal: Fix a typo in documentationAmit Kucheria1-1/+1
c(1) + x(1) was actually meant to be c(1) * x(1). Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Reviewed-by: Matthias Kaehlcke <mka@chromium.org> Acked-by: Rob Herring <robh@kernel.org> Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-10-23thermal: qoriq: add i.mx8mq supportAnson Huang1-3/+3
Add i.mx8mq specific compatible string. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-08-25dt-bindings: thermal: rcar-gen3-thermal: Add r8a774a1 supportFabrizio Castro1-0/+1
Document RZ/G2M (R8A774A1) SoC bindings. Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com> Reviewed-by: Biju Das <biju.das@bp.renesas.com> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-08-25dt-bindings: thermal: qcom-spmi-temp-alarm: Improve thermal zone in exampleMatthias Kaehlcke1-8/+3
The current example for a thermal zone isn't very useful as reference since it would result in a hardware shutdown at 145°C, instead of allowing the system to try to shutdown gracefully. Without an ADC channel a maximum of two trip points is useful in practice for this sensor, with temperatures corresponding to the stage 1 and stage 2 'hardware trip points'. A critical trip point at stage 2 may allow the system to shutdown before a hardware shutdown at stage 3 kicks in. It should be noted though that by default the chip performs a 'partial shutdown' when the temperature reaches stage 2, which may prevent an orderly shutdown. The 'partial shutdown' can be disabled by software. Signed-off-by: Matthias Kaehlcke <mka@chromium.org> Reviewed-by: Douglas Anderson <dianders@chromium.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-08-25dt-bindings: thermal: qcom-spmi-temp-alarm: Fix documentation of 'reg'Matthias Kaehlcke1-3/+2
The documentation claims that the 'reg' property consists of two values, the SPMI address and the length of the controller's registers. However the SPMI bus to which it is added specifies "#size-cells = <0>;". Remove the controller register length from the documentation of the field and the example. Signed-off-by: Matthias Kaehlcke <mka@chromium.org> Reviewed-by: Douglas Anderson <dianders@chromium.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-08-24Merge branch 'next' of ↵Linus Torvalds1-8/+3
git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management updates from Zhang Rui: - Add Daniel Lezcano as the reviewer of thermal framework and SoC driver changes (Daniel Lezcano). - Fix a bug in intel_dts_soc_thermal driver, which does not translate IO-APIC GSI (Global System Interrupt) into Linux irq number (Hans de Goede). - For device tree bindings, allow cooling devices sharing same trip point with same contribution value to share cooling map (Viresh Kumar). * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: dt-bindings: thermal: Allow multiple devices to share cooling map MAINTAINERS: Add Daniel Lezcano as designated reviewer for thermal Thermal: Intel SoC DTS: Translate IO-APIC GSI number to linux irq number
2018-08-16Merge branch 'linus' of ↵Linus Torvalds2-6/+30
git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal Pull thermal management updates from Eduardo Valentin: - rework tsens driver to add support for tsens-v2 (Amit Kucheria) - rework armada thermal driver to use syscon and multichannel support (Miquel Raynal) - fixes to TI SoC, IMX, Exynos, RCar, and hwmon drivers * 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (34 commits) thermal: armada: fix copy-paste error in armada_thermal_probe() thermal: rcar_thermal: avoid NULL dereference in absence of IRQ resources thermal: samsung: Remove Exynos5440 clock handling left-overs thermal: tsens: Fix negative temperature reporting thermal: tsens: switch from of_iomap() to devm_ioremap_resource() thermal: tsens: Rename variable thermal: tsens: Add generic support for TSENS v2 IP thermal: tsens: Rename tsens-8996 to tsens-v2 for reuse thermal: tsens: Add support to split up register address space into two dt: thermal: tsens: Document the fallback DT property for v2 of TSENS IP thermal: tsens: Get rid of unused fields in structure thermal_hwmon: Pass the originating device down to hwmon_device_register_with_info thermal_hwmon: Sanitize attribute name passed to hwmon dt-bindings: thermal: armada: add reference to new bindings dt-bindings: cp110: add the thermal node in the syscon file dt-bindings: cp110: update documentation since DT de-duplication dt-bindings: ap806: add the thermal node in the syscon file dt-bindings: cp110: prepare the syscon file to list other syscons nodes dt-bindings: ap806: prepare the syscon file to list other syscons nodes dt-bindings: cp110: rename cp110 syscon file ...
2018-08-06dt-bindings: thermal: Allow multiple devices to share cooling mapViresh Kumar1-8/+3
Allow cooling devices sharing same trip point with same contribution value to share the cooling map as well. Otherwise the same information will be duplicated for each device sharing the trip point. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2018-07-28dt: thermal: tsens: Document the fallback DT property for v2 of TSENS IPAmit Kucheria1-6/+25
We want to create common code for v2 of the TSENS IP block that is used in a large number of Qualcomm SoCs. "qcom,tsens-v2" should be able to handle most of the common functionality start with a common get_temp() function. It is also necessary to split out the memory regions for the TM and SROT register banks because their offsets are not constant across SoC families. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Tested-by: Matthias Kaehlcke <mka@chromium.org> Reviewed-by: Matthias Kaehlcke <mka@chromium.org> Reviewed-by: Douglas Anderson <dianders@chromium.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-07-28dt-bindings: thermal: armada: add reference to new bindingsMiquel Raynal1-0/+5
New bindings (using a syscon) are available for AP806 and CP110 compatibles. Add a reference to these files from the original documentation. Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-07-25dt-bindings: remove 'interrupt-parent' from bindingsRob Herring2-2/+0
'interrupt-parent' is often documented as part of define bindings, but it is really outside the scope of a device binding. It's never required in a given node as it is often inherited from a parent node. Or it can be implicit if a parent node is an 'interrupt-controller' node. So remove it from all the binding files. Cc: Mark Rutland <mark.rutland@arm.com> Cc: devicetree@vger.kernel.org Signed-off-by: Rob Herring <robh@kernel.org>
2018-06-12Merge branch 'linus' of ↵Linus Torvalds7-18/+18
git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal Pull thermal SoC updates from Zhang Rui: "Thermal SoC management updates: - imx thermal driver now supports i.MX7 thermal sensor (Anson Huang) - exynos thermal driver dropped support for exynos 5440 (Krzysztof Kozlowski) - rcar_thermal now supports r8a77995 (Yoshihiro Kaneko) - rcar_gen3_thermal now supports r8a77965 (Niklas Söderlund) - qcom-spmi-temp-alarm now supports GEN2 PMIC peripherals (David Collins) - uniphier thermal now supports UniPhier PXs3 (Kunihiko Hayashi) - mediatek thermal now supports MT7622 SoC (Sean Wang) - considerable refactoring of exynos driver (Bartlomiej Zolnierkiewicz) - small fixes all over the place on different drivers" * 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (50 commits) thermal: qcom: tsens: Allow number of sensors to come from DT thermal: tegra: soctherm: add const to struct thermal_cooling_device_ops thermal: exynos: Reduce severity of too early temperature read thermal: imx: Switch to SPDX identifier thermal: qcom-spmi-temp-alarm: add support for GEN2 PMIC peripherals thermal: ti-soc-thermal: fix incorrect entry in omap5430_adc_to_temp[] thermal: rcar_thermal: add r8a77995 support dt-bindings: thermal: rcar-thermal: add R8A77995 support thermal: mediatek: use of_device_get_match_data() thermal: exynos: remove trip reporting to user-space thermal: exynos: remove unused defines for Exynos5433 thermal: exynos: cleanup code for enabling threshold interrupts thermal: exynos: check return values of ->get_trip_[temp, hyst] methods thermal: exynos: move trips setting to exynos_tmu_initialize() thermal: exynos: set trips in ascending order in exynos7_tmu_initialize() thermal: exynos: do not use trips structure directly in ->tmu_initialize thermal: exynos: add exynos*_tmu_set_[trip,hyst]() helpers thermal: exynos: move IRQs clearing to exynos_tmu_initialize() thermal: exynos: clear IRQs later in exynos4412_tmu_initialize() thermal: exynos: make ->tmu_initialize method void ...
2018-06-08Merge tag 'devicetree-for-4.18' of ↵Linus Torvalds1-3/+3
git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux Pull DeviceTree updates from Rob Herring: - Sync dtc with upstream version v1.4.6-21-g84e414b0b5bc. This adds new warnings which are either fixed or disabled by default (enabled with W=1). - Validate an untrusted offset in DT overlay function update_usages_of_a_phandle_reference - Fix a use after free error of_platform_device_destroy - Fix an off by 1 string errors in unittest - Avoid creating a struct device for OPP nodes - Update DT specific submitting-patches.txt with patch content and subject requirements. - Move some bindings to their proper subsystem locations - Add vendor prefixes for Kaohsiung, SiFive, Avnet, Wi2Wi, Logic PD, and ArcherMind - Add documentation for "no-gpio-delays" property in FSI bus GPIO master - Add compatible for r8a77990 SoC ravb ethernet block - More wack-a-mole removal of 'status' property in examples * tag 'devicetree-for-4.18' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (25 commits) dt-bindings: submitting-patches: add guidance on patch content and subject of: platform: stop accessing invalid dev in of_platform_device_destroy dt-bindings: net: ravb: Add support for r8a77990 SoC dt-bindings: Add vendor prefix for ArcherMind dt-bindings: fsi-master-gpio: Document "no-gpio-delays" property dt-bindings: Add vendor prefix for Logic PD of: overlay: validate offset from property fixups of: unittest: for strings, account for trailing \0 in property length field drm: rcar-du: disable dtc graph-endpoint warnings on DT overlays kbuild: disable new dtc graph and unit-address warnings scripts/dtc: Update to upstream version v1.4.6-21-g84e414b0b5bc MAINTAINERS: add keyword for devicetree overlay notifiers dt-bindings: define vendor prefix for Wi2Wi, Inc. dt-bindings: Add vendor prefix for Avnet, Inc. dt-bindings: Relocate Tegra20 memory controller bindings dt-bindings: Add "sifive" vendor prefix dt-bindings: exynos: move ADC binding to iio/adc/ directory dt-bindings: powerpc/4xx: move 4xx NDFC and EMAC bindings to subsystem directories dt-bindings: move various RNG bindings to rng/ directory dt-bindings: move various timer bindings to timer/ directory ...
2018-06-02thermal: qcom: tsens: Allow number of sensors to come from DTBjorn Andersson1-0/+1
For platforms that has multiple copies of the TSENS hardware block it's necessary to be able to specify the number of sensors per block in DeviceTree. Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-06-02dt-bindings: thermal: rcar-thermal: add R8A77995 supportYoshihiro Kaneko1-2/+5
Update rcar thermal dt-binding to add R8A77995 info. Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-05-07thermal: samsung: Remove support for Exynos5440Krzysztof Kozlowski1-13/+1
The Exynos5440 is not actively developed, there are no development boards available and probably there are no real products with it. Remove wide-tree support for Exynos5440. Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org> [b.zolnierkie: ported over driver changes] Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-05-07dt-bindings: thermal: rcar-gen3-thermal: add r8a77965Niklas Söderlund1-1/+2
Based on previous work by Ryo Kataoka <ryo.kataoka.wt@renesas.com>. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-05-07dt-bindings: thermal: uniphier: add a compatible string for PXs3Kunihiko Hayashi1-0/+1
Add a compatible string for thermal monitor implemented on UniPhier PXs3 SoC. Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-05-06thermal: imx: add i.MX7 thermal sensor supportAnson Huang1-2/+7
This patch adds i.MX7 thermal sensor support, most of the i.MX7 thermal sensor functions are same with i.MX6 except the registers offset/layout, so we move those registers offset/layout definitions to soc data structure. i.MX7 uses single calibration data @25C, the calibration data is located at OCOTP offset 0x4F0, bit[17:9], the formula is as below: Tmeas = (Nmeas - n1) + 25; n1 is the fuse value for 25C. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Signed-off-by: Bai Ping <ping.bai@nxp.com> Acked-by: Dong Aisheng <aisheng.dong@nxp.com> Acked-by: Shawn Guo <shawnguo@kernel.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-05-06dt-bindings: thermal: add binding for MT7622 SoCSean Wang1-0/+1
Add devicetree bindings for MediaTek MT7622 thermal controller Changes v1 -> v2: add tag from Rob Signed-off-by: Sean Wang <sean.wang@mediatek.com> Signed-off-by: Shunli Wang <shunli.wang@mediatek.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-04-24dt-bindings: thermal: rcar-gen3-thermal: update register size in exampleNiklas Söderlund1-3/+3
The datasheet has been expanded with more registers and the DT files have been updated with the new size. This change updates the example so writing new DT files can use the enhanced driver which uses the new registers. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> [robh: s/have/has/, s/enchanted/enhanced/] Signed-off-by: Rob Herring <robh@kernel.org>
2018-04-18dt-bindings: thermal: Remove "cooling-{min|max}-level" propertiesViresh Kumar1-15/+1
The "cooling-min-level" and "cooling-max-level" properties are not parsed by any part of kernel currently and the max cooling state of a CPU cooling device is found by referring to the cpufreq table instead. Remove the unused bindings. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-04-18dt-bindings: thermal: remove no longer needed samsung thermal propertiesBartlomiej Zolnierkiewicz1-18/+5
Remove documentation for longer needed samsung thermal properties. Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-02-12dt-bindings: thermal: imx: update the binding to new methodDong Aisheng1-0/+25
Due to the old method has already been marked as deprecated in binding doc, so obviously it's better to update the example to new bindings as well. Cc: Shawn Guo <shawn.guo@linaro.org> Cc: Leonard Crestez <leonard.crestez@nxp.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Rob Herring <robh+dt@kernel.org> Cc: Mark Rutland <mark.rutland@arm.com> Signed-off-by: Dong Aisheng <aisheng.dong@nxp.com> Acked-by: Shawn Guo <shawnguo@kernel.org> Signed-off-by: Rob Herring <robh@kernel.org>
2018-02-07Merge branch 'next' of ↵Linus Torvalds2-12/+26
git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management updates from Zhang Rui: - fix a race condition issue in power allocator governor (Yi Zeng). - add support for AP806 and CP110 in armada thermal driver, together with several improvements (Baruch Siach, Miquel Raynal) - add support for r8z7743 in rcar thermal driver (Biju Das) - convert thermal core to use new hwmon API to avoid warning (Fabio Estevam) - small fixes and cleanups in thermal core and x86_pkg_thermal, int3400_thermal, hisi_thermal, mtk_thermal and imx_thermal drivers (Pravin Shedge, Geert Uytterhoeven, Alexey Khoroshilov, Brian Bian, Matthias Brugger, Nicolin Chen, Uwe Kleine-König) * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (25 commits) thermal: thermal_hwmon: Convert to hwmon_device_register_with_info() thermal/x86 pkg temp: Remove debugfs_create_u32() casts thermal: int3400_thermal: fix error handling in int3400_thermal_probe() thermal/drivers/hisi: Remove bogus const from function return type thermal: armada: Give meaningful names to the thermal zones thermal: armada: Wait sensors validity before exiting the init callback thermal: armada: Change sensors trim default value thermal: armada: Update Kconfig and module description thermal: armada: Add support for Armada CP110 thermal: armada: Add support for Armada AP806 thermal: armada: Use real status register name thermal: armada: Clarify control registers accesses thermal: armada: Simplify the check of the validity bit thermal: armada: Use msleep for long delays dt-bindings: thermal: Describe Armada AP806 and CP110 dt-bindings: thermal: rcar: Add device tree support for r8a7743 thermal: mtk: Cleanup unused defines thermal: imx: update to new formula according to NXP AN5215 thermal: imx: use consistent style to write temperatures thermal: imx: improve comments describing algorithm for temp calculation ...
2018-01-13Merge branch 'linus' of ↵Zhang Rui2-12/+26
git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc
2018-01-01dt-bindings: thermal: Describe Armada AP806 and CP110Baruch Siach1-12/+25
Add compatible strings for AP806 and CP110 that are part of the Armada 8k/7k line of SoCs. Add a note on the differences in the size of the control area in different bindings. This is an existing difference between the Armada 375 binding and the other boards already supported. The new AP806 and CP110 bindings are similar to the existing Armada 375 in this regard. Signed-off-by: Baruch Siach <baruch@tkos.co.il> [<miquel.raynal@free-electrons.com>: reword, additional details] Signed-off-by: Miquel Raynal <miquel.raynal@free-electrons.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-01-01dt-bindings: thermal: rcar: Add device tree support for r8a7743Biju Das1-0/+1
Add thermal sensor support for r8a7743 SoC. The Renesas RZ/G1M (r8a7743) thermal sensor module is identical to the R-Car Gen2 family. No driver change is needed due to the fallback compatible value "renesas,rcar-gen2-thermal". Signed-off-by: Biju Das <biju.das@bp.renesas.com> Reviewed-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Simon Horman <simon.horman@netronome.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-12-26dt-bindings: Use lower case hex in unit-addressesRob Herring2-4/+4
DT unit addresses should be lower case hex. Fix all the binding examples. Converted with the following command from Krzysztof Kozlowski: sed -e 's/@\([a-fA-F0-9_-]*\) {/@\L\1 {/' -i $(find Documentation/devicetree/bindings -name '*.txt') Signed-off-by: Rob Herring <robh@kernel.org>
2017-12-06dt-bindings: Remove leading 0x from bindings notationMathieu Malaterre1-6/+6
Improve the binding example by removing all the leading 0x to fix the following dtc warnings: Warning (unit_address_format): Node /XXX unit name should not have leading "0x" Converted using the following command: find Documentation/devicetree/bindings -name "*.txt" -exec sed -i -e 's/([^ ])\@0x([0-9a-f])/$1\@$2/g' {} + This is a follow up to commit 48c926cd3414 Signed-off-by: Mathieu Malaterre <malat@debian.org> Signed-off-by: Rob Herring <robh@kernel.org>
2017-11-18Merge branch 'next' of ↵Linus Torvalds3-0/+28
git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management updates from Zhang Rui: - introduce brcmstb AVS TMON thermal driver (Brian Norris) - add Rockchip RV1108 support in rockchip thermal driver (Rocky Hao) - major rework on HISI driver plus additional support of hisi3660 (Daniel Lezcano) - add nvmem-cells binding on imx6sx (Leonard Crestez) - fix a NULL pointer dereference on ti thermal driver unloading (Tony Lindgren) - improve tmon tool to make it easier to cross-compile tmon (Markus Mayer) - add Coffee Lake and Cannon Lake support for intel processor and pch thermal drivers (Srinivas Pandruvada) - other small fixes and cleanups (Arvind Yadav, Colin Ian King, Allen Wild, Nicolin Chen, Baruch SiachNiklas Söderlund, Arnd Bergmann) * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (44 commits) thermal: pch: Add Cannon Lake support thermal: int340x: processor_thermal: Add Coffee Lake support thermal: int340x: processor_thermal: Add Cannon Lake support thermal: bxt: remove redundant variable trip thermal: cpu_cooling: pr_err() strings should end with newlines thermal: add brcmstb AVS TMON driver Documentation: devicetree: add binding for Broadcom STB AVS TMON thermal/drivers/hisi: Add support for hi3660 SoC thermal/drivers/hisi: Prepare to add support for other hisi platforms thermal/drivers/hisi: Add platform prefix to function name thermal/drivers/hisi: Put platform code together thermal/drivers/qcom-spmi: Use devm_iio_channel_get thermal/drivers/generic-iio-adc: Switch tz request to devm version thermal/drivers/step_wise: Fix temperature regulation misbehavior thermal/drivers/hisi: Use round up step value thermal/drivers/hisi: Move the clk setup in the corresponding functions thermal/drivers/hisi: Remove mutex_lock in the code thermal/drivers/hisi: Remove thermal data back pointer thermal/drivers/hisi: Convert long to int thermal/drivers/hisi: Rename and remove unused field ...
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