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2019-11-23dt-bindings: iio: maxim_thermocouple: document new 'compatible' stringsAndrea Merello1-2/+5
Now the maxim_thermocouple has new, more specific, 'compatible' strings for better distinguish the various supported chips. This patch updates the DT bindings documentation accordingly Cc: Hartmut Knaack <knaack.h@gmx.de> Cc: Lars-Peter Clausen <lars@metafoo.de> Cc: Peter Meerwald-Stadler <pmeerw@pmeerw.net> Cc: Colin Ian King <colin.king@canonical.com> Cc: Patrick Havelange <patrick.havelange@essensium.com> Cc: Matt Weber <matthew.weber@rockwellcollins.com> Cc: Matt Ranostay <matt.ranostay@konsulko.com> Cc: Chuhong Yuan <hslester96@gmail.com> Cc: Daniel Gomez <dagmcr@gmail.com> Cc: linux-iio@vger.kernel.org Cc: Rob Herring <robh+dt@kernel.org> Cc: Mark Rutland <mark.rutland@arm.com> Cc: devicetree@vger.kernel.org Signed-off-by: Andrea Merello <andrea.merello@gmail.com> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2019-10-22dt-bindings: iio: Add ltc2983 documentationNuno Sá1-0/+480
Document the LTC2983 temperature sensor devicetree bindings. Tweaked by Jonathan to take into account the lack of signed output being maintained by dtc yaml output. For now a comment added that the unsigned array should actually be signed. Signed-off-by: Nuno Sá <nuno.sa@analog.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2019-04-04iio:temperature:max31856:Add device tree bind infoParesh Chaudhary1-0/+24
This patch added device tree binding info for MAX31856 driver. Signed-off-by: Paresh Chaudhary <paresh.chaudhary@rockwellcollins.com> Signed-off-by: Matt Weber <matthew.weber@rockwellcollins.com> Signed-off-by: Patrick Havelange <patrick.havelange@essensium.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2019-04-04dt-bindings: iio/temperature: Add thermocouple types (and doc)Patrick Havelange1-0/+7
This patch introduces common thermocouple types used by various temperature sensors. Also a brief documentation explaining this "thermocouple-type" property. Signed-off-by: Patrick Havelange <patrick.havelange@essensium.com> Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2018-07-25dt-bindings: remove 'interrupt-parent' from bindingsRob Herring1-2/+0
'interrupt-parent' is often documented as part of define bindings, but it is really outside the scope of a device binding. It's never required in a given node as it is often inherited from a parent node. Or it can be implicit if a parent node is an 'interrupt-controller' node. So remove it from all the binding files. Cc: Mark Rutland <mark.rutland@arm.com> Cc: devicetree@vger.kernel.org Signed-off-by: Rob Herring <robh@kernel.org>
2018-02-04dt-bindings: iio: temperature: add MLX90632 device bindingsCrt Mori1-0/+28
Add device tree bindings for MLX90632 IR temperature sensor. Signed-off-by: Crt Mori <cmo@melexis.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2017-07-01dt-bindings: iio: temperature: Add bindings for TSYS01 temperature sensorManivannan Sadhasivam1-0/+19
Add device tree bindings for Measurement Specialties TSYS01 temperature sensor Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Jonathan Cameron <jic23@kernel.org>
2017-01-28Documentation: dt-bindings: tmp007: Add optional interrupt supportManivannan Sadhasivam1-0/+8
This patch adds optional interrupt binding support for TI TMP007 - IR thermopiler sensor Signed-off-by: Manivannan Sadhasivam <manivannanece23@gmail.com> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Jonathan Cameron <jic23@kernel.org>
2017-01-14iio:temperature: Add support for TI TMP007 sensorManivannan Sadhasivam1-0/+27
This patch adds support for TI TMP007 - 16 bit IR thermopile sensor with integrated Math engine. Sensor takes care of calculating the object temperature with the help of calibrated constants stored in non-volatile memory, thereby reducing the calculation overhead. Signed-off-by: Manivannan Sadhasivam <manivannanece23@gmail.com> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Jonathan Cameron <jic23@kernel.org>
2016-07-10iio: temperature: add support for Maxim thermocouple chipsMatt Ranostay1-0/+21
Add initial driver support for MAX6675, and MAX31855 thermocouple chips. Cc: Marek Vasut <marex@denx.de> Cc: Matt Porter <mporter@konsulko.com> Signed-off-by: Matt Ranostay <mranostay@gmail.com> Signed-off-by: Jonathan Cameron <jic23@kernel.org>
2015-04-09iio: mlx90614: Add power managementVianney le Clément de Saint-Marcq1-0/+9
Add support for system sleep and runtime power management. To wake up the device, the SDA line should be held low for at least 33ms while SCL is high. As this is not possible using the i2c API (and not supported by all i2c adapters), a GPIO connected to the SDA line is needed. The GPIO is named "wakeup" and can be specified in a device tree with the "wakeup-gpios" binding. If the wake-up GPIO is not given, disable power management for the device. Entering sleep requires an SMBus byte access, hence power management is also disabled if byte access is not supported by the adapter. Signed-off-by: Vianney le Clément de Saint-Marcq <vianney.leclement@essensium.com> Cc: Arnout Vandecappelle (Essensium/Mind) <arnout@mind.be> Signed-off-by: Jonathan Cameron <jic23@kernel.org>
2015-04-09iio: mlx90614: Add devicetree bindings documentationVianney le Clément de Saint-Marcq1-0/+15
Also introduce "melexis" as a vendor prefix for device tree bindings. Signed-off-by: Vianney le Clément de Saint-Marcq <vianney.leclement@essensium.com> Cc: Arnout Vandecappelle (Essensium/Mind) <arnout@mind.be> Signed-off-by: Jonathan Cameron <jic23@kernel.org>