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Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20211006085836.42155-5-wsa+renesas@sang-engineering.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
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Add device node for RPC on R8A779A0 SoC.
Signed-off-by: Duc Nguyen <duc.nguyen.ub@renesas.com>
[wsa: rebased]
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20211006085836.42155-4-wsa+renesas@sang-engineering.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
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Add SPI Multi I/O Bus controller node to R9A07G044 (RZ/G2L) SoC DTSI.
Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Reviewed-by: Biju Das <biju.das.jz@bp.renesas.com>
Link: https://lore.kernel.org/r/20210928155852.32569-1-prabhakar.mahadev-lad.rj@bp.renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
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Reset the DSI hardware is needed to prevent different settings between
the bootloader and the kernel.
While here, also remove the undocumented and also not used
'mediatek,syscon-dsi' property.
Signed-off-by: Enric Balletbo i Serra <enric.balletbo@collabora.com>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20210930103105.v4.5.I933f1532d7a1b2910843a9644c86a7d94a4b44e1@changeid
Signed-off-by: Matthias Brugger <matthias.bgg@gmail.com>
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Reset the DSI hardware is needed to prevent different settings between
the bootloader and the kernel.
Signed-off-by: Enric Balletbo i Serra <enric.balletbo@collabora.com>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20210930103105.v4.4.I7bd7d9a8da5e2894711b700a1127e6902a2b2f1d@changeid
Signed-off-by: Matthias Brugger <matthias.bgg@gmail.com>
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Update device tree binding documentation for the dsi to add the optional
property to reset the dsi controller.
Signed-off-by: Enric Balletbo i Serra <enric.balletbo@collabora.com>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20210930103105.v4.3.Ifec72a83f224b62f24cfc967edfe78c5d276b2e3@changeid
Signed-off-by: Matthias Brugger <matthias.bgg@gmail.com>
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The mmsys system controller exposes a set of memory client resets and
needs to specify the #reset-cells property in order to advertise the
number of cells needed to describe each of the resets.
Signed-off-by: Enric Balletbo i Serra <enric.balletbo@collabora.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20210930103105.v4.2.I3f7f1c9a8e46be07d1757ddf4e0097535f3a7d41@changeid
Signed-off-by: Matthias Brugger <matthias.bgg@gmail.com>
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The DT binding includes for reset controllers are located in
include/dt-bindings/reset/. Move the Mediatek reset constants in there.
Signed-off-by: Enric Balletbo i Serra <enric.balletbo@collabora.com>
Reviewed-by: Guenter Roeck <linux@roeck-us.net>
Reviewed-by: Matthias Brugger <matthias.bgg@gmail.com>
Link: https://lore.kernel.org/r/20210930103105.v4.1.I514d9aafff3a062f751b37d3fea7402f67595b86@changeid
Signed-off-by: Matthias Brugger <matthias.bgg@gmail.com>
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Input pin that indicates that the BMC is configured to boot with security
protections enforced.
Pulled up by default (secure). Placing the jumper will pull the pin down
(bypass security).
When in the secure boot state, it makes the EEPROM at 0x50 on bus 14
read only.
Link: https://lore.kernel.org/r/20210923074606.283393-1-joel@jms.id.au
Signed-off-by: Joel Stanley <joel@jms.id.au>
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Add S0_SCP_AUTH_FAIL, S1_SCP_AUTH_FAIL gpios to indicates firmware
authentication fail on each socket.
Add gpio RTC_BAT_SEN_EN to enable RTC battery adc sensor.
Add BMC_I2C4_O_EN gpio to go high at boot to enable access to I2C4 bus.
Signed-off-by: Quan Nguyen <quan@os.amperecomputing.com>
Signed-off-by: Thang Nguyen <thang@os.amperecomputing.com>
Link: https://lore.kernel.org/r/20210917082945.19111-1-quan@os.amperecomputing.com
Signed-off-by: Joel Stanley <joel@jms.id.au>
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As defined by Documentation/devicetree/bindings/pci/pci-ep.yaml,
PCIe endpoints match this pattern:
properties:
$nodename:
pattern: "^pcie-ep@"
Change the existing ones in the DT bindings examples to avoid warnings
during DT bindings validation.
Signed-off-by: Mauro Carvalho Chehab <mchehab+huawei@kernel.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Thierry Reding <treding@nvidia.com>
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As defined by Documentation/devicetree/bindings/pci/pci-ep.yaml,
PCIe endpoints match this pattern:
properties:
$nodename:
pattern: "^pcie-ep@"
Change the existing ones in order to avoid those warnings:
arch/arm64/boot/dts/nvidia/tegra194-p3509-0000+p3668-0001.dt.yaml: pcie_ep@14160000: $nodename:0: 'pcie_ep@14160000' does not match '^pcie-ep@'
From schema: Documentation/devicetree/bindings/pci/snps,dw-pcie-ep.yaml
arch/arm64/boot/dts/nvidia/tegra194-p3509-0000+p3668-0001.dt.yaml: pcie_ep@14180000: $nodename:0: 'pcie_ep@14180000' does not match '^pcie-ep@'
From schema: Documentation/devicetree/bindings/pci/snps,dw-pcie-ep.yaml
arch/arm64/boot/dts/nvidia/tegra194-p3509-0000+p3668-0001.dt.yaml: pcie_ep@141a0000: $nodename:0: 'pcie_ep@141a0000' does not match '^pcie-ep@'
From schema: Documentation/devicetree/bindings/pci/snps,dw-pcie-ep.yaml
arch/arm64/boot/dts/nvidia/tegra194-p3509-0000+p3668-0000.dt.yaml: pcie_ep@14160000: $nodename:0: 'pcie_ep@14160000' does not match '^pcie-ep@'
From schema: Documentation/devicetree/bindings/pci/snps,dw-pcie-ep.yaml
arch/arm64/boot/dts/nvidia/tegra194-p3509-0000+p3668-0000.dt.yaml: pcie_ep@14180000: $nodename:0: 'pcie_ep@14180000' does not match '^pcie-ep@'
From schema: Documentation/devicetree/bindings/pci/snps,dw-pcie-ep.yaml
arch/arm64/boot/dts/nvidia/tegra194-p3509-0000+p3668-0000.dt.yaml: pcie_ep@141a0000: $nodename:0: 'pcie_ep@141a0000' does not match '^pcie-ep@'
From schema: Documentation/devicetree/bindings/pci/snps,dw-pcie-ep.yaml
arch/arm64/boot/dts/nvidia/tegra194-p2972-0000.dt.yaml: pcie_ep@14160000: $nodename:0: 'pcie_ep@14160000' does not match '^pcie-ep@'
From schema: Documentation/devicetree/bindings/pci/snps,dw-pcie-ep.yaml
arch/arm64/boot/dts/nvidia/tegra194-p2972-0000.dt.yaml: pcie_ep@14180000: $nodename:0: 'pcie_ep@14180000' does not match '^pcie-ep@'
From schema: Documentation/devicetree/bindings/pci/snps,dw-pcie-ep.yaml
arch/arm64/boot/dts/nvidia/tegra194-p2972-0000.dt.yaml: pcie_ep@141a0000: $nodename:0: 'pcie_ep@141a0000' does not match '^pcie-ep@'
From schema: Documentation/devicetree/bindings/pci/snps,dw-pcie-ep.yaml
Signed-off-by: Mauro Carvalho Chehab <mchehab+huawei@kernel.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Thierry Reding <treding@nvidia.com>
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There's no such thing as a generic USB EHCI controller. The EHCI
controllers found on Tegra SoCs are instantiations that need Tegra-
specific glue to work properly, so drop the generic compatible string
and keep only the Tegra-specific ones.
Signed-off-by: Thierry Reding <treding@nvidia.com>
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There's no such thing as a generic USB EHCI controller. The EHCI
controllers found on Tegra SoCs are instantiations that need Tegra-
specific glue to work properly, so drop the generic compatible string
and keep only the Tegra-specific ones.
Signed-off-by: Thierry Reding <treding@nvidia.com>
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Extend APE audio support by adding more audio components such as SFC,
MVC, AMX, ADX and Mixer. These components can be plugged into an audio
path and required processing can be done. ASoC audio-graph based sound
driver is used to facilitate this and thus extend sound bindings as
well.
The components in the path may require different PCM parameters (such
as sample rate, channels or sample size). Depending on the pre-defined
audio paths, these can be statically configured with "convert-xxx" DT
properties in endpoint subnode. The support for the rate and channel
conversion is already available in generic audio-graph driver. Sample
size conversion support can be added based on the need in future.
The support is extended for following platforms:
* Jertson TX1
* Jetson Nano
* Jetson TX2
* Jetson AGX Xavier
* Jetson Xavier NX
Signed-off-by: Sameer Pujar <spujar@nvidia.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>
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Add DT nodes for following AHUB devices:
* SFC (Sampling Frequency Converter)
* MVC (Master Volume Control)
* AMX (Audio Multiplexer)
* ADX (Audio Demultiplexer)
* Mixer
Above devices are added for Tegra210, Tegra186 and Tegra194 generations
of Tegra SoC.
Signed-off-by: Sameer Pujar <spujar@nvidia.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>
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The backlight-boot-off property was proposed as a patch, but ended not
being accepted since different solution was already in the place:
https://patchwork.kernel.org/project/linux-arm-kernel/patch/1406806970-12561-1-git-send-email-thierry.reding@gmail.com/#21327479
Signed-off-by: David Heidelberg <david@ixit.cz>
Signed-off-by: Thierry Reding <treding@nvidia.com>
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The backlight-boot-off property was proposed as a patch, but ended not
being accepted since different solution was already in the place:
https://patchwork.kernel.org/project/linux-arm-kernel/patch/1406806970-12561-1-git-send-email-thierry.reding@gmail.com/#21327479
Signed-off-by: David Heidelberg <david@ixit.cz>
Signed-off-by: Thierry Reding <treding@nvidia.com>
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Add a device tree node for NVDEC on Tegra186, and
device tree nodes for NVDEC and NVDEC1 on Tegra194.
Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>
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Add YAML device tree bindings for NVDEC, now in a more appropriate
place compared to the old textual Host1x bindings.
Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Thierry Reding <treding@nvidia.com>
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This adds a reference to the dts of the Raspberry Pi Compute Module 4
IO Board, so we don't need to maintain the content in arm64.
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Link: https://lore.kernel.org/r/1628334401-6577-11-git-send-email-stefan.wahren@i2se.com
Signed-off-by: Nicolas Saenz Julienne <nsaenz@kernel.org>
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This adds the matching carrier for Raspberry Pi Compute Module 4.
Instead of xHCI USB host controller there is just a USB 2.0 interface
connected to the DWC2 controller from the BCM2711. As a result
there is a free PCIe Gen 2 socket. Also there are 2 full-size HDMI 2.0
connectors.
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Link: https://lore.kernel.org/r/1628334401-6577-10-git-send-email-stefan.wahren@i2se.com
Signed-off-by: Nicolas Saenz Julienne <nsaenz@kernel.org>
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The Raspberry Pi Compute Module 4 (CM4) are SoMs which contain the
following:
* BCM2711 quad core processor
* up to 8 GB RAM
* up to 32 GB eMMC
* a GPIO expander
* Gigabit PHY BCM54210PE
* Wifi/BT module with internal and external antenna
The eMMC and the Wifi/BT module are optional.
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Link: https://lore.kernel.org/r/1628334401-6577-9-git-send-email-stefan.wahren@i2se.com
Signed-off-by: Nicolas Saenz Julienne <nsaenz@kernel.org>
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Add the Raspberry Pi Compute Module 4 to DT schema.
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/1628334401-6577-8-git-send-email-stefan.wahren@i2se.com
Signed-off-by: Nicolas Saenz Julienne <nsaenz@kernel.org>
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A Wifi/BT chip is quite common for the Raspberry Pi boards. So move those
definitions into a separate dtsi in order to avoid copy & paste. This
change was inspired by a vendor tree patch from Phil Elwell.
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Link: https://lore.kernel.org/r/1628334401-6577-7-git-send-email-stefan.wahren@i2se.com
Signed-off-by: Nicolas Saenz Julienne <nsaenz@kernel.org>
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The Raspberry Pi boards with BCM283x needs control of the power domains
to get display components running. DT schema warns us that it's used, but not
documented as a optional property:
hdmi@7e902000: 'power-domains' does not match any of the regexes: ...
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/1628334401-6577-4-git-send-email-stefan.wahren@i2se.com
Signed-off-by: Nicolas Saenz Julienne <nsaenz@kernel.org>
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BB2D is a Vivante GC 2D Accelerator.
This adds the node to the dts file within a target module node.
Crossbar index number is used for interrupt mapping.
Signed-off-by: Gowtham Tammana <g-tammana@ti.com>
Signed-off-by: Jyri Sarha <jsarha@ti.com>
Signed-off-by: Neil Armstrong <narmstrong@baylibre.com>
Signed-off-by: Tony Lindgren <tony@atomide.com>
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Change led node names to match schema.
Signed-off-by: Andreas Kemnade <andreas@kemnade.info>
Signed-off-by: Tony Lindgren <tony@atomide.com>
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Fix typo in pinctrl. It did only work because the bootloader
seems to have initialized it.
Fixes: ee327111953b ("ARM: dts: omap3-gta04: Define and use bma180 irq pin")
Signed-off-by: Andreas Kemnade <andreas@kemnade.info>
Signed-off-by: Tony Lindgren <tony@atomide.com>
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Add mandatory supply properties. The supply is always on, so it is just
a syntax issue, no functional change.
Signed-off-by: Andreas Kemnade <andreas@kemnade.info>
Signed-off-by: Tony Lindgren <tony@atomide.com>
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Add mandatory supply properties. The supply is always on, so it is just
a syntax issue, no functional change.
Signed-off-by: Andreas Kemnade <andreas@kemnade.info>
Signed-off-by: Tony Lindgren <tony@atomide.com>
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Replace depreciated nodenames, fix label name to match scheme.
Signed-off-by: Andreas Kemnade <andreas@kemnade.info>
Signed-off-by: Tony Lindgren <tony@atomide.com>
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Hyphens should be used in label names. make dtbs_check complains
about that since it does not match the corresponding pattern
Signed-off-by: Andreas Kemnade <andreas@kemnade.info>
Signed-off-by: Tony Lindgren <tony@atomide.com>
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Switch the compatible for the am33xx_pinmux pin controller node from
pinctrl-single to pinconf-single. The only change between these two
compatibles is that PCS_HAS_PINCONF will be true. This then allows
pinconf properties to be utilized.
The purpose of this change is to allow the PocketBeagle to use:
pinctrl-single,bias-pullup
pinctrl-single,bias-pulldown
This dts already defines these properites for gpio pins in the default
pinctrl state but it has no effect unless PCS_HAS_PINCONF is set.
The bias properties can then be modified on the corresponding gpio lines
through the gpiod uapi. The mapping between the pins and gpio lines is
defined by gpio-ranges under the gpio controller nodes in am33xx-l4.dtsi
Signed-off-by: Drew Fustini <drew@pdp7.com>
Signed-off-by: Tony Lindgren <tony@atomide.com>
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Two carveout reserved memory nodes each have been added for each of the
other remote processors devices within the MAIN domain on the TI J721E
SK boards. These nodes are assigned to the respective rproc device nodes
as well. The first region will be used as the DMA pool for the rproc
devices, and the second region will furnish the static carveout regions
for the firmware memory.
An additional reserved memory node is also added to reserve a portion of
the DDR memory to be used for performing inter-processor communication
between all the remote processors running RTOS or baremetal firmwares.
8 MB of memory is reserved for this purpose, and this accounts for all
the vrings and vring buffers between all the possible pairs of remote
processors.
The current carveout addresses and sizes are defined statically for each
rproc device. The R5F processors do not have an MMU, and as such require
the exact memory used by the firmwares to be set-aside. The C71x DSP
processor does support a MMU called CMMU, but is not currently supported
and as such requires the exact memory used by the firmware to be
set-aside. The firmware images do not require any RSC_CARVEOUT entries
in their resource tables to allocate the memory for firmware memory
segments
Signed-off-by: Sinthu Raja <sinthu.raja@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Link: https://lore.kernel.org/r/20210929081333.26454-5-sinthu.raja@ti.com
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Add the sub-mailbox nodes that are used to communicate between MPU and
various remote processors present in the J721E SoCs to the J721E EAIK
board. These include the R5F remote processors in the dual-R5F cluster
(MCU_R5FSS0) in the MCU domain and the two dual-R5F clusters
(MAIN_R5FSS0 & MAIN_R5FSS1) in the MAIN domain; the two C66x DSP remote
processors and the single C71x DSP remote processor in the MAIN domain.
These sub-mailbox nodes utilize the System Mailbox clusters 0 through 4.
All the remaining mailbox clusters are currently not used on A72 core,
and are hence disabled.
The sub-mailbox nodes added match the hard-coded mailbox configuration
used within the TI RTOS IPC software packages. The R5F processor
sub-systems are assumed to be running in Split mode, so a sub-mailbox
node is used by each of the R5F cores. Only the sub-mailbox node for
the first R5F core in each cluster is used in case of a Lockstep mode
for that R5F cluster.
Signed-off-by: Sinthu Raja <sinthu.raja@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Link: https://lore.kernel.org/r/20210929081333.26454-4-sinthu.raja@ti.com
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J721E Starter Kit (SK)[1] is a low cost, small form factor board designed
for TI’s J721E SoC. TI’s J721E SoC comprises of dual core A72, high
performance vision accelerators, video codec accelerators, latest C71x
and C66x DSP, high bandwidth real-time IPs for capture and display, GPU,
dedicated safety island and security accelerators. The SoC is power
optimized to provide best in class performance for industrial and
automotive applications.
J721E SK supports the following interfaces:
* 4 GB LPDDR4 RAM
* x1 Gigabit Ethernet interface
* x1 USB 3.0 Type-C port
* x3 USB 3.0 Type-A ports
* x1 PCIe M.2 E Key
* x1 PCIe M.2 M Key
* 512 Mbit OSPI flash
* x2 CSI2 Camera interface (RPi and TI Camera connector)
* 40-pin Raspberry Pi GPIO header
Add basic support for J721E-SK.
[1] https://www.ti.com/tool/SK-TDA4VM
Signed-off-by: Sinthu Raja <sinthu.raja@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Link: https://lore.kernel.org/r/20210929081333.26454-3-sinthu.raja@ti.com
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J721E Starter Kit (SK)[1] is a low cost, small form factor board
designed for TI’s J721E SoC. Add j721e-sk into compatible enum.
[1]https://www.ti.com/tool/SK-TDA4VM
Signed-off-by: Sinthu Raja <sinthu.raja@ti.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Nishanth Menon <nm@ti.com>
Link: https://lore.kernel.org/r/20210929081333.26454-2-sinthu.raja@ti.com
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This adds the devices trees for IOT2050 Product Generation 2 (PG2)
boards. We have Basic and an Advanced variants again, differing in
number of cores, RAM size, availability of eMMC and further details.
The major difference to PG1 is the used silicon revision (SR2.x on
PG2).
Signed-off-by: Jan Kiszka <jan.kiszka@siemens.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Link: https://lore.kernel.org/r/cc868da8264324bde2c87d0c01d4763e3678c706.1632657917.git.jan.kiszka@web.de
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The current IOT2050 devices are Product Generation 1 (PG1), using SR1.0
AM65x silicon. Upcoming PG2 devices will use SR2.x SoCs and will
therefore need separate device trees. Prepare for that by factoring out
common bits that will be shared across both generations.
At this chance, drop a link to the product homepage to in the top-level
dts files. Also fix a typo in my email address in some headers.
Signed-off-by: Jan Kiszka <jan.kiszka@siemens.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Link: https://lore.kernel.org/r/31fece05f9728a852c0632985c4fa537cced4ece.1632657917.git.jan.kiszka@web.de
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Product Generation 2 (PG2) boards are based on SR2.x SoCs and will be
released soon.
Signed-off-by: Jan Kiszka <jan.kiszka@siemens.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Nishanth Menon <nm@ti.com>
Link: https://lore.kernel.org/r/5d99e69ff1e2fb78f51f03c351eff1fe1f6c3a71.1632657917.git.jan.kiszka@web.de
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Analogously to the am654-base-board, configure the mailboxes for the two
R5F cores, add them and the already existing memory carve-outs to the
related MCU nodes. Allows to load applications under Linux onto the
cores, e.g. the RTI watchdog firmware.
Signed-off-by: Jan Kiszka <jan.kiszka@siemens.com>
Reviewed-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Link: https://lore.kernel.org/r/1776f8be19b39a938d9248fcfc5332b753783c3e.1632657917.git.jan.kiszka@web.de
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The IOT2050 devices described so far are using SR1.0 silicon, thus do
not have the additional PRUs of the ICSSG of the SR2.0. Disable them.
Signed-off-by: Jan Kiszka <jan.kiszka@siemens.com>
Acked-by: Aswath Govindraju <a-govindraju@ti.com>
Acked-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Link: https://lore.kernel.org/r/189a91866fb1af02e4fd2345dc56774aa069d5ba.1632657917.git.jan.kiszka@web.de
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This ensures that the SD card will remain mmc0 across Basic and Advanced
devices, also avoiding surprises for users coming from the downstream
kernels.
Signed-off-by: Jan Kiszka <jan.kiszka@siemens.com>
Acked-by: Aswath Govindraju <a-govindraju@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Link: https://lore.kernel.org/r/fe20d6346f119a28e47d129b616682001299cf0e.1632657917.git.jan.kiszka@web.de
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Add j7200-evm compatible to the board to allow the board to distinguish
itself from other platforms that may be added in the future.
Signed-off-by: Nishanth Menon <nm@ti.com>
Acked-by: Suman Anna <s-anna@ti.com>
Link: https://lore.kernel.org/r/20210925201430.11678-5-nm@ti.com
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Add j721e-evm compatible to the board to allow the board to distinguish
itself from other platforms that are pending to be added.
Signed-off-by: Nishanth Menon <nm@ti.com>
Acked-by: Suman Anna <s-anna@ti.com>
Link: https://lore.kernel.org/r/20210925201430.11678-4-nm@ti.com
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Add compatibles for j721e and j7200 evms to allow for newer platforms
to distinguish themselves.
While doing this, maintain support for older style of description where
the board compatibility was not required.
Signed-off-by: Nishanth Menon <nm@ti.com>
Acked-by: Rob Herring <robh@kernel.org>
Acked-by: Suman Anna <s-anna@ti.com>
Link: https://lore.kernel.org/r/20210925201430.11678-2-nm@ti.com
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Make sure that the platforms are grouped together per SoC. This helps
keep the Makefile readable as newer platforms get added to the list.
Signed-off-by: Nishanth Menon <nm@ti.com>
Acked-by: Suman Anna <s-anna@ti.com>
Link: https://lore.kernel.org/r/20210915121442.27112-1-nm@ti.com
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Add the DT nodes for the ICSSG0 and ICSSG1 processor subsystems that are
present on the K3 AM64x SoCs. The two ICSSGs are identical to each other
for the most part, with some of the peripheral pins from ICSSG1 not pinned
out. Each ICSSG instance is represented by a PRUSS subsystem node and other
child nodes.
The nodes are all added and enabled in the common k3-am64-main.dtsi
file by default. The MDIO nodes need pinctrl lines, and so should be
enabled only on boards where they are actually wired and pinned out
for ICSSG Ethernet. Any new board dts file should disable these if
they are not sure. These are disabled in the existing AM64x board dts
files to begin with.
The ICSSGs on K3 AM64x SoCs are very similar to the versions of the ICSSG
on K3 J721E and AM65x SR2.0 SoCs. The IRAM and BroadSize RAM sizes are all
identical to those on J721E SoCs. All The ICSSG host interrupts intended
towards the main Arm core are also shared with other processors on the SoC,
and can be partitioned as per system integration needs.
The ICSSG subsystem node contains the entire address space. The various
sub-modules of the ICSSG are represented as individual child nodes (so
platform devices themselves) of the PRUSS subsystem node. These include:
- two Programmable Real-Time Units (PRUs)
- two auxiliary PRU cores called RTUs
- two Transmit Programmable Real-Time Units (Tx_PRUs)
- Interrupt controller (INTC)
- a 'memories' node containing all the ICSSG level Data RAMs
- Real Time Media Independent Interface controller (MII_RT)
- Gigabit capable MII_G_RT
- ICSSG CFG sub-module providing two internal clock muxes, with the
default clock parents also assigned using the assigned-clock-parents
property.
The default names for the firmware images for each PRU, RTU and Tx_PRU
cores are defined as follows using the 'firmware-name' property (these
can be adjusted either in derivative board dts files or through sysfs at
runtime if required):
ICSSG0 PRU0 Core : am64x-pru0_0-fw ; PRU1 Core : am64x-pru0_1-fw
ICSSG0 RTU0 Core : am64x-rtu0_0-fw ; RTU1 Core : am64x-rtu0_1-fw
ICSSG0 Tx_PRU0 Core : am64x-txpru0_0-fw ; Tx_PRU1 Core : am64x-txpru0_1-fw
ICSSG1 PRU0 Core : am64x-pru1_0-fw ; PRU1 Core : am64x-pru1_1-fw
ICSSG1 RTU0 Core : am64x-rtu1_0-fw ; RTU1 Core : am64x-rtu1_1-fw
ICSSG1 Tx_PRU0 Core : am64x-txpru1_0-fw ; Tx_PRU1 Core : am64x-txpru1_1-fw
Note:
1. The ICSSG INTC on AM64x SoCs share all the host interrupts with other
processors, so use the 'ti,irqs-reserved' property in derivative board
dts files _if_ any of them should not be handled by the host OS.
2. There are few more sub-modules like the Industrial Ethernet Peripherals
(IEPs), eCAP, PWM, UART that do not have bindings and so will be added
in the future.
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Signed-off-by: Grygorii Strashko <grygorii.strashko@ti.com>
Reviewed-by: Kishon Vijay Abraham I <kishon@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Link: https://lore.kernel.org/r/20210919202935.15604-1-s-anna@ti.com
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git://git.kernel.org/pub/scm/linux/kernel/git/geert/renesas-devel into arm/dt
Renesas DT binding updates for v5.16
- Document support for the new R-Car H3e, M3e, M3Ne(-2G), D3e, E3e, and
H3Ne SoCs and boards.
* tag 'renesas-dt-bindings-for-v5.16-tag1' of git://git.kernel.org/pub/scm/linux/kernel/git/geert/renesas-devel:
dt-bindings: arm: renesas: Document more R-Car Gen3e Socs and boards
Link: https://lore.kernel.org/r/cover.1633081158.git.geert+renesas@glider.be
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
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