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2013-04-27Merge branch 'thermal_core-doc-comments-update' of .git into nextZhang Rui1-3/+11
2013-04-27thermal: db8500_cpufreq_cooling: remove usage of IS_ERR_OR_NULL()Eduardo Valentin1-1/+1
This patch changes the driver to avoid the usage of IS_ERR_OR_NULL() macro. This macro can lead to dangerous results, like returning success (0) during a failure scenario (NULL pointer handling). The case present in this driver can be translated to a simple check for IS_ERR(), as the cpufreq_cooling_register() returns either a valid pointer or an ERR_PTR(). Cc: Zhang Rui <rui.zhang@intel.com> Cc: Russell King <rmk@arm.linux.org.uk> Cc: Grant Likely <grant.likely@secretlab.ca> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Hongbo Zhang <hongbo.zhang@stericsson.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devicetree-discuss@lists.ozlabs.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Fabio Baltieri <fabio.baltieri@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-27thermal: thermal_core: remove usage of IS_ERR_OR_NULLEduardo Valentin1-1/+1
This patch changes the driver to avoid the usage of IS_ERR_OR_NULL() macro. This macro can lead to dangerous results, like returning success (0) during a failure scenario (NULL pointer handling). The case present in this patch has simply be translated to normal check for NULL and if the pointer has an error code. The later case is needed because functions like thermal_zone_get_zone_by_name() could return an ERR_PTR(). Cc: Zhang Rui <rui.zhang@intel.com> Cc: Russell King <rmk@arm.linux.org.uk> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-27Thermal: update documentation for thermal_zone_device_registerZhang Rui1-3/+11
Update kernel Documentation for thermal_zone_device_register. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24Merge branch 'cpu_cooling-doc-comments-update' of .git into nextZhang Rui3-28/+88
2013-04-24Merge branch 'thermal_core-doc-comments-update' of .git into nextZhang Rui3-25/+59
2013-04-24thermal: update kernel-doc for thermal_zone_device_registerEduardo Valentin1-1/+8
This patch updates the documentation for thermal_zone_device_register and removes the warnings generated by scripts/kernel-doc -v. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: update kernel-doc for create_trip_attrsEduardo Valentin1-1/+6
This patch updates the documentation for create_trip_attrs and removes the warnings generated by scripts/kernel-doc -v. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: update kernel-doc for thermal_cooling_device_registerEduardo Valentin1-1/+8
This patch updates the documentation for thermal_cooling_device_register and removes the warnings generated by scripts/kernel-doc -v. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: update kernel-doc for thermal_zone_unbind_cooling_deviceEduardo Valentin1-3/+8
This patch updates the documentation for thermal_zone_unbind_cooling_device and removes the warnings generated by scripts/kernel-doc -v. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: update kernel-doc for thermal_zone_bind_cooling_deviceEduardo Valentin1-3/+13
This patch updates the documentation for thermal_zone_bind_cooling_device and removes the warnings generated by scripts/kernel-doc -v. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: use EXPORT_SYMBOL_GPLEduardo Valentin1-9/+9
Restrict usage of GPL modules. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: rename notify_thermal_framework to thermal_notify_frameworkEduardo Valentin3-5/+5
To follow the prefix names used by the thermal functions, this patch renames notify_thermal_framework to thermal_notify_framework. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: update driver licenseEduardo Valentin1-1/+1
As per the comment at the top of this file, this is a GPLv2 driver. This patch updates the driver license accordingly. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: use strlcpy instead of strcpyEduardo Valentin1-2/+2
For memory boundaries safety, use strlcpy instead of strcpy. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: cpu_cooling: remove unused symbols on cpu_cooling.hEduardo Valentin1-3/+0
Remove defines that are not in used. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: cpu_cooling: add needed header for cpu_cooling.hEduardo Valentin1-0/+1
Update header list for cpu_cooling.h. Missing definition of cpumask. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: cpu_cooling: remove unused symbolsEduardo Valentin1-5/+1
The list is not needed so far. Thus removing it. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: cpu_cooling: remove not needed curl bracketsEduardo Valentin1-2/+2
Just for style purposes, remove extra curl brackets. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: cpu_cooling: use snprintf instead of sprintfEduardo Valentin1-1/+2
Limit the amount of bytes written to dev_name by secure writing with snprintf. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: cpu_cooling: update kernel-doc comment for cpufreq_cooling_unregisterEduardo Valentin1-0/+2
Update comments for this exported function. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: cpu_cooling: update kernel-doc for cpufreq_cooling_registerEduardo Valentin1-0/+7
Add proper documentation for exported function cpufreq_cooling_register. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: cpu_cooling: update documentation for cpufreq_set_cur_stateEduardo Valentin1-0/+5
Update documentation for cpufreq_set_cur_state callback. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: cpu_cooling: update documentation for cpufreq_get_cur_stateEduardo Valentin1-0/+5
Update documentation for cpufreq_get_cur_state callback. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: cpu_cooling: update documentation for cpufreq_get_max_stateEduardo Valentin1-0/+5
Update documentation for cpufreq_get_max_state callback. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: cpu_cooling: update Kconfig entryEduardo Valentin1-2/+3
There is no support for hotplug or any other means of reducing temperature. So, this patch removes these references from Kconfig. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: cpu_cooling: update documentation for cpufreq_thermal_notifierEduardo Valentin1-0/+6
Update kernel-doc comment and documentation for cpufreq_thermal_notifier. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: cpu_cooling: update documentation for cpufreq_apply_coolingEduardo Valentin1-0/+6
Update kernel-doc comments for cpufreq_apply_cooling function. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: cpu_cooling: improve documentation for get_cpu_frequencyEduardo Valentin1-1/+7
Fix kernel-doc warning on get_cpu_frequency and improve documentation comments. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: cpu_cooling: document cpufreq_get_cooling_levelEduardo Valentin1-0/+11
Add documentation for cpufreq_get_cooling_level. As this is an exported function, it has to be documented. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: cpu_cooling: add documentation for get_propertyEduardo Valentin1-3/+11
As this is one of the central functions of this file, it deserves a proper documentation. This patch improves the existing comment to format it as a kernel-doc style. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: cpu_cooling: fix kernel doc for is_cpufreq_validEduardo Valentin1-1/+7
Update documentation for is_cpufreq_valid function so that kernel-doc does not complain about return value. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: cpu_cooling: remove compiler warningEduardo Valentin1-1/+1
level will be used only if GET_FREQ mode is requested. There is no potential harm with current code. But for cleaning the compilation log, this patch initializes level to zero. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: cpu_cooling: use EXPORT_SYMBOL_GPLEduardo Valentin1-4/+3
Restrict the usage to GPL modules. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: cpu_cooling: fix kernel_doc for cpufreq_cooling_deviceEduardo Valentin1-3/+3
Simple fixes for making kernel_doc happy about struct cpufreq_cooling_device. Includes also a minor spelling fix. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24thermal: cpu_cooling: remove unused headersEduardo Valentin1-2/+0
Remove some unused header files. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24Merge branch 'exynos-fix' of .git into nextZhang Rui1-3/+11
2013-04-24Thermal: exynos: Add compatible string for exynos4412Sachin Kamat1-0/+4
Added compatible string for Exynos4412 SoC. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Cc: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24Thermal: exynos: Add clk_{un}prepare APIsSachin Kamat1-3/+7
clk_{un}prepare APIs are required to migrate to common clock framework. While at it convert to use devm_clk_get as it removes some cleanup code. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Cc: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24Merge branch 'eduardo-1' of .git into nextZhang Rui2-3/+57
2013-04-17Thermal: cpufreq cooling: endian bug in cpufreq_get_max_state()Dan Carpenter1-2/+2
This code doesn't work on big endian systems because we're storing low values in the high bits of the unsigned long. It makes it a very high value instead. Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-15thermal: expose thermal_zone_get_temp APIEduardo Valentin2-3/+18
This patch exports the thermal_zone_get_temp API so that driver writers can fetch temperature of thermal zones managed by other drivers. Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-15thermal: introduce thermal_zone_get_zone_by_name helper functionEduardo Valentin2-0/+39
This patch adds a helper function to get a reference of a thermal zone, based on the zone type name. It will perform a zone name lookup and return a reference to a thermal zone device that matches the name requested. In case the zone is not found or when several zones match same name or if the required parameters are invalid, it will return the corresponding error code (ERR_PTR). Cc: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-15Merge branch 'thermal' of ↵Zhang Rui16-261/+578
git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into next Conflicts: drivers/thermal/cpu_cooling.c
2013-04-14Thermal: build cpu_cooling code into thermal_sys moduleZhang Rui3-3/+3
Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-04-14Thermal: build thermal governors into thermal_sys moduleZhang Rui8-66/+84
The thermal governors are part of the thermal framework, rather than a seperate feature/module. Because the generic thermal layer can not work without thermal governors, and it must load the thermal governors during its initialization. Build them into one module in this patch. This also fix a problem that the generic thermal layer does not work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-04-13Thermal: rename thermal_sys.c to thermal_core.cZhang Rui2-0/+1
this is the preparation work to build all the thermal core framework source file, like governors, cpu cooling, etc, into one module. No functional change in this patch. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-04-12Thermal: exynos: remove unnecessary header inclusionsArnd Bergmann1-2/+0
In multiplatform configurations, we cannot include headers provided by only the exynos platform. Fortunately a number of drivers that include those headers do not actually need them, so we can just remove the inclusions. Signed-off-by: Arnd Bergmann <arnd@arndb.de> Cc: linux-pm@vger.kernel.org Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-12thermal: step_wise: set throttle target within thermal instance limitsAndrew Bresticker1-2/+8
When selecting a target cooling state in get_target_state(), make sure that the state is at least as high as the minimum when the temperature is rising and at least as low as the maximum when the temperature is falling. This is necessary because, in the THREAML_TREND_RAISING and THERMAL_TREND_DROPPING cases, the current state may only be incremented or decremented by one even if it is outside the bounds of the thermal instance. This might occur, for example, if the CPU is heating up and hits a thermal trip point for the first time when it's frequency is much higher than the range specified by the thermal instance corresponding to the trip point. Signed-off-by: Andrew Bresticker <abrestic@chromium.org> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02thermal: add a warning for temperature emulation featureEduardo Valentin2-0/+8
Because this feature is for debuging purposes, it is highly recommended to do not enable this on production systems. This patch adds warnings for system integrators, so that people are aware of this potential security issue. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
generated by cgit v1.2.3 (git 2.39.0) at 2025-01-10 06:00:42 +0300