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author | Linus Torvalds <torvalds@linux-foundation.org> | 2014-08-11 18:04:17 +0400 |
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committer | Linus Torvalds <torvalds@linux-foundation.org> | 2014-08-11 18:04:17 +0400 |
commit | 5fd41f2a10b38ab84b4c2436140ce490d34291fa (patch) | |
tree | 0c5e39f8c0ca03004db863cf05e5b20873c0cb48 /Documentation | |
parent | 2213d7c29a434626a15ffb285182cd19ed0b722d (diff) | |
parent | 47d104ba5879790c7c91c3390b0b08399e168efe (diff) | |
download | linux-5fd41f2a10b38ab84b4c2436140ce490d34291fa.tar.xz |
Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal updates from Zhang Rui:
"Specifics:
- adds full support for 2 types of Thermal Controllers produced by
STMicroelectronics. One is a more traditional memory mapped
variant, the other is controlled solely by system configuration
registers. From Lee Jones.
- add TMU (Thermal Management Unit) support for Exynos3250 Soc.
From Chanwoo Choi.
- add critical and passive trip point support for int3403 thermal
driver. From Srinivas Pandruvada.
- a couple of small fixes/cleanups from Javi Merino, and Geert
Uytterhoeven"
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
thermal: document struct thermal_zone_device and thermal_governor
thermal: cpu_cooling: fix typo highjack -> hijack
thermal: rcar: Document SoC-specific bindings
thermal: samsung: Add TMU support for Exynos3250 SoC
thermal: exynos: fix ordering in exynos_tmu_remove()
thermal: allow building dove_thermal with mvebu
thermal: sti: Add support for ST's Memory Mapped based Thermal controller
thermal: sti: Add support for ST's System Config Register based Thermal controller
thermal: sti: Introduce ST Thermal core code
thermal: sti: Supply Device Tree documentation
Thermal: int3403: Add CRT and PSV trip
Diffstat (limited to 'Documentation')
3 files changed, 55 insertions, 6 deletions
diff --git a/Documentation/devicetree/bindings/thermal/exynos-thermal.txt b/Documentation/devicetree/bindings/thermal/exynos-thermal.txt index c94909215c07..ae738f562acc 100644 --- a/Documentation/devicetree/bindings/thermal/exynos-thermal.txt +++ b/Documentation/devicetree/bindings/thermal/exynos-thermal.txt @@ -3,6 +3,7 @@ ** Required properties: - compatible : One of the following: + "samsung,exynos3250-tmu" "samsung,exynos4412-tmu" "samsung,exynos4210-tmu" "samsung,exynos5250-tmu" diff --git a/Documentation/devicetree/bindings/thermal/rcar-thermal.txt b/Documentation/devicetree/bindings/thermal/rcar-thermal.txt index 28ef498a66e5..0ef00be44b01 100644 --- a/Documentation/devicetree/bindings/thermal/rcar-thermal.txt +++ b/Documentation/devicetree/bindings/thermal/rcar-thermal.txt @@ -1,7 +1,13 @@ * Renesas R-Car Thermal Required properties: -- compatible : "renesas,rcar-thermal" +- compatible : "renesas,thermal-<soctype>", "renesas,rcar-thermal" + as fallback. + Examples with soctypes are: + - "renesas,thermal-r8a73a4" (R-Mobile AP6) + - "renesas,thermal-r8a7779" (R-Car H1) + - "renesas,thermal-r8a7790" (R-Car H2) + - "renesas,thermal-r8a7791" (R-Car M2) - reg : Address range of the thermal registers. The 1st reg will be recognized as common register if it has "interrupts". @@ -12,18 +18,18 @@ Option properties: Example (non interrupt support): -thermal@e61f0100 { - compatible = "renesas,rcar-thermal"; - reg = <0xe61f0100 0x38>; +thermal@ffc48000 { + compatible = "renesas,thermal-r8a7779", "renesas,rcar-thermal"; + reg = <0xffc48000 0x38>; }; Example (interrupt support): thermal@e61f0000 { - compatible = "renesas,rcar-thermal"; + compatible = "renesas,thermal-r8a73a4", "renesas,rcar-thermal"; reg = <0xe61f0000 0x14 0xe61f0100 0x38 0xe61f0200 0x38 0xe61f0300 0x38>; - interrupts = <0 69 4>; + interrupts = <0 69 IRQ_TYPE_LEVEL_HIGH>; }; diff --git a/Documentation/devicetree/bindings/thermal/st-thermal.txt b/Documentation/devicetree/bindings/thermal/st-thermal.txt new file mode 100644 index 000000000000..3b9251b4a145 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/st-thermal.txt @@ -0,0 +1,42 @@ +Binding for Thermal Sensor driver for STMicroelectronics STi series of SoCs. + +Required parameters: +------------------- + +compatible : st,<SoC>-<module>-thermal; should be one of: + "st,stih415-sas-thermal", + "st,stih415-mpe-thermal", + "st,stih416-sas-thermal" + "st,stih416-mpe-thermal" + "st,stid127-thermal" or + "st,stih407-thermal" + according to the SoC type (stih415, stih416, stid127, stih407) + and module type (sas or mpe). On stid127 & stih407 there is only + one die/module, so there is no module type in the compatible + string. +clock-names : Should be "thermal". + See: Documentation/devicetree/bindings/resource-names.txt +clocks : Phandle of the clock used by the thermal sensor. + See: Documentation/devicetree/bindings/clock/clock-bindings.txt + +Optional parameters: +------------------- + +reg : For non-sysconf based sensors, this should be the physical base + address and length of the sensor's registers. +interrupts : Standard way to define interrupt number. + Interrupt is mandatory to be defined when compatible is + "stih416-mpe-thermal". + NB: For thermal sensor's for which no interrupt has been + defined, a polling delay of 1000ms will be used to read the + temperature from device. + +Example: + + temp1@fdfe8000 { + compatible = "st,stih416-mpe-thermal"; + reg = <0xfdfe8000 0x10>; + clock-names = "thermal"; + clocks = <&clk_m_mpethsens>; + interrupts = <GIC_SPI 23 IRQ_TYPE_NONE>; + }; |