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author | Len Brown <len.brown@intel.com> | 2012-10-09 09:35:52 +0400 |
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committer | Len Brown <len.brown@intel.com> | 2012-10-09 09:35:52 +0400 |
commit | 29b19e250434c6193c8b8e4c34c9c6284dd4f101 (patch) | |
tree | 8a1c8e308c9ae964f7fb612e921e10cf4c30ba15 /Documentation | |
parent | 125c4c706b680c7831f0966ff873c1ad0354ec25 (diff) | |
parent | c072fed95c9855a920c114d7fa3351f0f54ea06e (diff) | |
download | linux-29b19e250434c6193c8b8e4c34c9c6284dd4f101.tar.xz |
Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into thermal
Conflicts:
drivers/staging/omap-thermal/omap-thermal-common.
OMAP supplied dummy TC1 and TC2,
at the same time that the thermal tree removed them
from thermal_zone_device_register()
drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c
propogate the upstream MAX_IDR_LEVEL re-name
to prevent a build failure
Previously-fixed-by: Stephen Rothwell <sfr@canb.auug.org.au>
Signed-off-by: Len Brown <len.brown@intel.com>
Diffstat (limited to 'Documentation')
-rw-r--r-- | Documentation/thermal/cpu-cooling-api.txt | 32 | ||||
-rw-r--r-- | Documentation/thermal/exynos_thermal (renamed from Documentation/hwmon/exynos4_tmu) | 35 | ||||
-rw-r--r-- | Documentation/thermal/sysfs-api.txt | 9 |
3 files changed, 43 insertions, 33 deletions
diff --git a/Documentation/thermal/cpu-cooling-api.txt b/Documentation/thermal/cpu-cooling-api.txt new file mode 100644 index 000000000000..fca24c931ec8 --- /dev/null +++ b/Documentation/thermal/cpu-cooling-api.txt @@ -0,0 +1,32 @@ +CPU cooling APIs How To +=================================== + +Written by Amit Daniel Kachhap <amit.kachhap@linaro.org> + +Updated: 12 May 2012 + +Copyright (c) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com) + +0. Introduction + +The generic cpu cooling(freq clipping) provides registration/unregistration APIs +to the caller. The binding of the cooling devices to the trip point is left for +the user. The registration APIs returns the cooling device pointer. + +1. cpu cooling APIs + +1.1 cpufreq registration/unregistration APIs +1.1.1 struct thermal_cooling_device *cpufreq_cooling_register( + struct cpumask *clip_cpus) + + This interface function registers the cpufreq cooling device with the name + "thermal-cpufreq-%x". This api can support multiple instances of cpufreq + cooling devices. + + clip_cpus: cpumask of cpus where the frequency constraints will happen. + +1.1.2 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) + + This interface function unregisters the "thermal-cpufreq-%x" cooling device. + + cdev: Cooling device pointer which has to be unregistered. diff --git a/Documentation/hwmon/exynos4_tmu b/Documentation/thermal/exynos_thermal index c3c6b41db607..2b46f67b1ccb 100644 --- a/Documentation/hwmon/exynos4_tmu +++ b/Documentation/thermal/exynos_thermal @@ -46,36 +46,7 @@ The threshold levels are defined as follows: The threshold and each trigger_level are set through the corresponding registers. -When an interrupt occurs, this driver notify user space of -one of four threshold levels for the interrupt -through kobject_uevent_env and sysfs_notify functions. +When an interrupt occurs, this driver notify kernel thermal framework +with the function exynos4_report_trigger. Although an interrupt condition for level_0 can be set, -it is not notified to user space through sysfs_notify function. - -Sysfs Interface ---------------- -name name of the temperature sensor - RO - -temp1_input temperature - RO - -temp1_max temperature for level_1 interrupt - RO - -temp1_crit temperature for level_2 interrupt - RO - -temp1_emergency temperature for level_3 interrupt - RO - -temp1_max_alarm alarm for level_1 interrupt - RO - -temp1_crit_alarm - alarm for level_2 interrupt - RO - -temp1_emergency_alarm - alarm for level_3 interrupt - RO +it can be used to synchronize the cooling action. diff --git a/Documentation/thermal/sysfs-api.txt b/Documentation/thermal/sysfs-api.txt index c087dbcf3535..ca1a1a34970e 100644 --- a/Documentation/thermal/sysfs-api.txt +++ b/Documentation/thermal/sysfs-api.txt @@ -84,7 +84,8 @@ temperature) and throttle appropriate devices. 1.3 interface for binding a thermal zone device with a thermal cooling device 1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz, - int trip, struct thermal_cooling_device *cdev); + int trip, struct thermal_cooling_device *cdev, + unsigned long upper, unsigned long lower); This interface function bind a thermal cooling device to the certain trip point of a thermal zone device. @@ -93,6 +94,12 @@ temperature) and throttle appropriate devices. cdev: thermal cooling device trip: indicates which trip point the cooling devices is associated with in this thermal zone. + upper:the Maximum cooling state for this trip point. + THERMAL_NO_LIMIT means no upper limit, + and the cooling device can be in max_state. + lower:the Minimum cooling state can be used for this trip point. + THERMAL_NO_LIMIT means no lower limit, + and the cooling device can be in cooling state 0. 1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz, int trip, struct thermal_cooling_device *cdev); |