Merge tag 'devicetree-for-6.0' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux

Pull devicetree updates from Rob Herring:
 "Bindings:

   - Add spi-peripheral-props.yaml references to various SPI device
     bindings

   - Convert qcom,pm8916-wdt, ds1307, Qualcomm BAM DMA, is31fl319x,
     skyworks,aat1290, Rockchip EMAC, gpio-ir-receiver, ahci-ceva, Arm
     CCN PMU, rda,8810pl-intc, sil,sii9022, ps2-gpio, and
     arm-firmware-suite bindings to DT schema format

   - New bindings for Arm virtual platforms display, Qualcomm IMEM
     memory region, Samsung S5PV210 ChipID, EM Microelectronic EM3027
     RTC, and arm,cortex-a78ae

   - Add vendor prefixes for asrock, bytedance, hxt, ingrasys, inventec,
     quanta, and densitron

   - Add missing MSI and IOMMU properties to host-generic-pci

   - Remove bindings for removed EFM32 platform

   - Remove old chosen.txt binding (replaced by schema)

   - Treewide add missing type information for properties

   - Treewide fixing of typos and its vs. it's in bindings. Its all good
     now.

   - Drop unnecessary quoting in power related schemas

   - Several LED binding updates which didn't get picked up

   - Move various bindings to proper directories

  DT core code:

   - Convert unittest GPIO related tests to use fwnode

   - Check ima-kexec-buffer against memory bounds

   - Print reserved-memory allocation/reservation failures as errors

   - Cleanup early_init_dt_reserve_memory_arch()

   - Simplify of_overlay_fdt_apply() tail"

* tag 'devicetree-for-6.0' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (65 commits)
  dt-bindings: mtd: microchip,mchp48l640: use spi-peripheral-props.yaml
  dt-bindings: power: supply: drop quotes when not needed
  dt-bindings: power: reset: drop quotes when not needed
  dt-bindings: power: drop quotes when not needed
  dt-bindings: PCI: host-generic-pci: Allow IOMMU and MSI properties
  of/fdt: declared return type does not match actual return type
  devicetree/bindings: correct possessive "its" typos
  dt-bindings: net: convert emac_rockchip.txt to YAML
  dt-bindings: eeprom: microchip,93lc46b: move to eeprom directory
  dt-bindings: eeprom: at25: use spi-peripheral-props.yaml
  dt-bindings: display: use spi-peripheral-props.yaml
  dt-bindings: watchdog: qcom,pm8916-wdt: convert to dtschema
  dt-bindings: power: reset: qcom,pon: use absolute path to other schema
  dt-bindings: iio/dac: adi,ad5766: Add missing type to 'output-range-microvolts'
  dt-bindings: power: supply: charger-manager: Add missing type for 'cm-battery-stat'
  dt-bindings: panel: raydium,rm67191: Add missing type to 'video-mode'
  of/fdt: Clean up early_init_dt_reserve_memory_arch()
  dt-bindings: PCI: fsl,imx6q-pcie: Add missing type for 'reset-gpio-active-high'
  dt-bindings: rtc: Add EM Microelectronic EM3027 bindings
  dt-bindings: rtc: ds1307: Convert to json-schema
  ...

1 files changed, 16 insertions, 2 deletions

diff --git a/Documentation/devicetree/bindings/vendor-prefixes.yaml b/Documentation/devicetree/bindings/vendor-prefixes.yaml
index 5a3bc64773a9..2f0151e9f6be 100644
--- a/Documentation/devicetree/bindings/vendor-prefixes.yaml
+++ b/Documentation/devicetree/bindings/vendor-prefixes.yaml
@@ -141,6 +141,8 @@ patternProperties:
     description: ASIX Electronics Corporation
   "^aspeed,.*":
     description: ASPEED Technology Inc.
+  "^asrock,.*":
+    description: ASRock Inc.
   "^asus,.*":
     description: AsusTek Computer Inc.
   "^atheros,.*":
@@ -198,12 +200,14 @@ patternProperties:
     description: Broadcom Corporation
   "^bsh,.*":
     description: BSH Hausgeraete GmbH
+  "^bticino,.*":
+    description: Bticino International
   "^buffalo,.*":
     description: Buffalo, Inc.
   "^bur,.*":
     description: B&R Industrial Automation GmbH
-  "^bticino,.*":
-    description: Bticino International
+  "^bytedance,.*":
+    description: ByteDance Ltd.
   "^calamp,.*":
     description: CalAmp Corp.
   "^calaosystems,.*":
@@ -308,6 +312,8 @@ patternProperties:
     description: Dell Inc.
   "^delta,.*":
     description: Delta Electronics, Inc.
+  "^densitron,.*":
+    description: Densitron Technologies Ltd
   "^denx,.*":
     description: Denx Software Engineering
   "^devantech,.*":
@@ -551,6 +557,8 @@ patternProperties:
     description: Shenzhen Hugsun Technology Co. Ltd.
   "^hwacom,.*":
     description: HwaCom Systems Inc.
+  "^hxt,.*":
+    description: HXT Semiconductor
   "^hycon,.*":
     description: Hycon Technology Corp.
   "^hydis,.*":
@@ -585,6 +593,8 @@ patternProperties:
     description: Infineon Technologies
   "^inforce,.*":
     description: Inforce Computing
+  "^ingrasys,.*":
+    description: Ingrasys Technology Inc.
   "^ivo,.*":
     description: InfoVision Optoelectronics Kunshan Co. Ltd.
   "^ingenic,.*":
@@ -605,6 +615,8 @@ patternProperties:
     description: Inter Control Group
   "^invensense,.*":
     description: InvenSense Inc.
+  "^inventec,.*":
+    description: Inventec
   "^inversepath,.*":
     description: Inverse Path
   "^iom,.*":
@@ -1019,6 +1031,8 @@ patternProperties:
     description: Shenzhen QiShenglong Industrialist Co., Ltd.
   "^qnap,.*":
     description: QNAP Systems, Inc.
+  "^quanta,.*":
+    description: Quanta Computer Inc.
   "^radxa,.*":
     description: Radxa
   "^raidsonic,.*":