kernel/linux.git/include/dt-bindings/interconnect, branch v6.18.21

Merge tag 'char-misc-6.18-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc

2025-10-04T23:26:32+00:00

Pull Char/Misc/IIO/Binder updates from Greg KH: "Here is the big set of char/misc/iio and other driver subsystem changes for 6.18-rc1. Loads of different stuff in here, it was a busy development cycle in lots of different subsystems, with over 27k new lines added to the tree. Included in here are: - IIO updates including new drivers, reworking of existing apis, and other goodness in the sensor subsystems - MEI driver updates and additions - NVMEM driver updates - slimbus removal for an unused driver and some other minor updates - coresight driver updates and additions - MHI driver updates - comedi driver updates and fixes - extcon driver updates - interconnect driver additions - eeprom driver updates and fixes - minor UIO driver updates - tiny W1 driver updates But the majority of new code is in the rust bindings and additions, which includes: - misc driver rust binding updates for read/write support, we can now write "normal" misc drivers in rust fully, and the sample driver shows how this can be done. - Initial framework for USB driver rust bindings, which are disabled for now in the build, due to limited support, but coming in through this tree due to dependencies on other rust binding changes that were in here. I'll be enabling these back on in the build in the usb.git tree after -rc1 is out so that developers can continue to work on these in linux-next over the next development cycle. - Android Binder driver implemented in Rust. This is the big one, and was driving a huge majority of the rust binding work over the past years. Right now there are two binder drivers in the kernel, selected only at build time as to which one to use as binder wants to be included in the system at boot time. The binder C maintainers all agreed on this, as eventually, they want the C code to be removed from the tree, but it will take a few releases to get there while both are maintained to ensure that the rust implementation is fully stable and compliant with the existing userspace apis. All of these have been in linux-next for a while" * tag 'char-misc-6.18-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc: (320 commits) rust: usb: keep usb::Device private for now rust: usb: don't retain device context for the interface parent USB: disable rust bindings from the build for now samples: rust: add a USB driver sample rust: usb: add basic USB abstractions coresight: Add label sysfs node support dt-bindings: arm: Add label in the coresight components coresight: tnoc: add new AMBA ID to support Trace Noc V2 coresight: Fix incorrect handling for return value of devm_kzalloc coresight: tpda: fix the logic to setup the element size coresight: trbe: Return NULL pointer for allocation failures coresight: Refactor runtime PM coresight: Make clock sequence consistent coresight: Refactor driver data allocation coresight: Consolidate clock enabling coresight: Avoid enable programming clock duplicately coresight: Appropriately disable trace bus clocks coresight: Appropriately disable programming clocks coresight: etm4x: Support atclk coresight: catu: Support atclk ...

dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in Glymur SoC

2025-08-14T21:30:47+00:00

Document the RPMh Network-On-Chip Interconnect in Glymur platform. Co-developed-by: Odelu Kukatla Signed-off-by: Odelu Kukatla Reviewed-by: "Rob Herring (Arm)" Signed-off-by: Raviteja Laggyshetty Link: https://lore.kernel.org/r/20250814-glymur-icc-v2-1-596cca6b6015@oss.qualcomm.com Signed-off-by: Georgi Djakov

dt-bindings: clock: ipq5424-apss-clk: Add ipq5424 apss clock controller

2025-08-11T15:05:20+00:00

The CPU core in ipq5424 is clocked by a huayra PLL with RCG support. The RCG and PLL have a separate register space from the GCC. Also the L3 cache has a separate pll and needs to be scaled along with the CPU. Co-developed-by: Md Sadre Alam Signed-off-by: Md Sadre Alam Signed-off-by: Sricharan Ramabadhran [ Added interconnect related changes ] Reviewed-by: Krzysztof Kozlowski Signed-off-by: Varadarajan Narayanan Link: https://lore.kernel.org/r/20250811090954.2854440-2-quic_varada@quicinc.com Signed-off-by: Bjorn Andersson

dt-bindings: interconnect: document the RPMh Network-On-Chip Interconnect in Qualcomm Milos SoC

2025-07-21T16:41:07+00:00

Document the RPMh Network-On-Chip Interconnect of the Milos (e.g. SM7635) SoC. Reviewed-by: Krzysztof Kozlowski Signed-off-by: Luca Weiss Link: https://lore.kernel.org/r/20250709-sm7635-icc-v3-1-c446203c3b3a@fairphone.com Signed-off-by: Georgi Djakov

dt-bindings: interconnect: sm8650: document the MASTER_APSS_NOC

2025-04-28T14:50:07+00:00

Document the MASTER_APSS_NOC interconnect node for the SM8650 SoC system NoC. Signed-off-by: Neil Armstrong Acked-by: "Rob Herring (Arm)" Link: https://lore.kernel.org/r/20250415-topic-sm8650-upstream-icc-apss-noc-v1-1-9e6bea3943d8@linaro.org Signed-off-by: Georgi Djakov

Merge tag 'soc-dt-6.14' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc

2025-01-24T22:48:03+00:00

Pull SoC devicetree updates from Arnd Bergmann: "We see the addition of eleven new SoCs, including a total of sixx arm64 chips from Qualcomm alone. Overall, the Qualcomm platforms once again make up the majority of all changes, after a couple of quieter releases. The new SoCs in this branch are: - Microchip sama7d65 is a new 32-bit embedded chip with a single Cortex-A7 and the current high end of the old Atmel SoC line. - Samsung Exynos 9810 is a mobile phone chip used in some older phones like the Samsung Galaxy S9 - Renesas R-Car V4H ES3.0 (R8A779G3) is an updated version of the V4H (R8A779G0) low-power automotive SoC - Renesas RZ/G3E (R0A09G047) is a family of embedded chips using Cortex-A55 cores - Qualcomm Snapdragon 8 Elite (SM8750) is a new phone chip based on Qualcomm's Oryon CPU cores. - Qualcomm Snapdragon AR2 (SAR2130P) is a SoC for augmented reality glasses. - Qualcomm IQ6 (QCS610) and IQ8 (QCS8300) are two industrial IOT platforms. - Snapdragon 425 (MSM8917) is a mobile phone SoC from 2016 - Qualcomm IPQ5424 is a Wi-Fi 7 networking chip All of the above are part of already supported SoC families that only need new devicetree files. Two additional SoCs in new families are part of a separate branch. There are 48 new machines in total, including six arm32 ones based on aspeed. broadcom, microchip and st SoCs all using Cortex-A7 cores, and a single risc-v board, the Banana Pi R3. The remaining ones use arm64 chips from Broadcom, Samsung, NXP, Mediatek, Qualcomm, Renesas and Rockchips and cover development boards, phones, laptops, industrial machines routers. A lot of ongoing work is for cleaning up build time warnings and other issues, in addition to the new machines and added features" * tag 'soc-dt-6.14' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (619 commits) arm64: tegra: Fix Tegra234 PCIe interrupt-map arm64: dts: qcom: x1e80100-romulus: Update firmware nodes arm64: dts: rockchip: add DTs for Firefly ITX-3588J and its Core-3588J SoM dt-bindings: arm: rockchip: Add Firefly ITX-3588J board arm64: dts: rockchip: Add Orange Pi 5 Max board dt-bindings: arm: rockchip: Add Xunlong Orange Pi 5 Max arm64: dts: rockchip: refactor common rk3588-orangepi-5.dtsi arm64: dts: rockchip: add WLAN to rk3588-evb1 controller arm64: dts: rockchip: increase gmac rx_delay on rk3399-puma arm64: dts: rockchip: Delete redundant RK3328 GMAC stability fixes arm64: tegra: Disable Tegra234 sce-fabric node arm64: tegra: Fix typo in Tegra234 dce-fabric compatible arm64: tegra: Fix DMA ID for SPI2 arm64: dts: qcom: msm8916-samsung-serranove: Add display panel arm64: dts: qcom: sm8650: Add 'global' interrupt to the PCIe RC nodes arm64: dts: qcom: sm8550: Add 'global' interrupt to the PCIe RC nodes arm64: dts: qcom: Remove unused and undocumented properties arm64: dts: qcom: sdm450-lenovo-tbx605f: add DSI panel nodes arm64: dts: qcom: pmi8950: add LAB-IBB nodes arm64: dts: qcom: ipq5424: enable the download mode support ...

dt-bindings: interconnect: Add Qualcomm IPQ5424 support

2025-01-08T02:38:41+00:00

Add master/slave ids for Qualcomm IPQ5424 Network-On-Chip interfaces. This will be used by the gcc-ipq5424 driver for providing interconnect services using the icc-clk framework. Signed-off-by: Varadarajan Narayanan Acked-by: Krzysztof Kozlowski Link: https://lore.kernel.org/r/20241213105808.674620-1-quic_varada@quicinc.com Signed-off-by: Bjorn Andersson

dt-bindings: interconnect: add interconnect bindings for SM8750

2024-12-17T12:05:37+00:00

Add interconnect device bindings. These devices can be used to describe any RPMh and NoC based interconnect devices. Signed-off-by: Raviteja Laggyshetty Signed-off-by: Melody Olvera Reviewed-by: Krzysztof Kozlowski Link: https://lore.kernel.org/r/20241204-sm8750_master_interconnects-v3-1-3d9aad4200e9@quicinc.com Signed-off-by: Georgi Djakov

Merge branch 'icc-sar2130p' into icc-next

2024-11-04T23:32:05+00:00

Add driver for the network of connects present on the SAR2130P platform. * icc-sar2130p dt-bindings: interconnect: qcom: document SAR2130P NoC interconnect: qcom: add support for SAR2130P Link: https://lore.kernel.org/r/20241018-sar2130p-icc-v2-0-c58c73dcd19d@linaro.org Signed-off-by: Georgi Djakov

Merge branch 'icc-qcs615' into icc-next

2024-11-04T23:30:52+00:00

Add interconnect dt-bindings and driver support for Qualcomm QCS615 SoC. * icc-qcs615 dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in QCS615 SoC interconnect: qcom: add QCS615 interconnect provider driver Link: https://lore.kernel.org/r/20240924143958.25-1-quic_rlaggysh@quicinc.com Signed-off-by: Georgi Djakov