kernel/linux.git/drivers/thermal, branch v6.6.132

thermal: int340x: Fix sysfs group leak on DLVR registration failure

2026-03-04T12:20:56+00:00

[ Upstream commit 15176b818e048ccf6ef4b96db34eda7b7e98938a ] When DLVR sysfs group creation fails in proc_thermal_rfim_add(), the function returns immediately without cleaning up the FIVR group that may have been created earlier. Add proper error unwinding to remove the FIVR group before returning failure. Signed-off-by: Kaushlendra Kumar Acked-by: Srinivas Pandruvada Link: https://patch.msgid.link/LV3PR11MB876881B77D32A2854AD2908EF563A@LV3PR11MB8768.namprd11.prod.outlook.com Signed-off-by: Rafael J. Wysocki Signed-off-by: Sasha Levin

thermal/drivers/qcom/lmh: Add missing IRQ includes

2025-10-15T09:57:54+00:00

[ Upstream commit b50b2c53f98fcdb6957e184eb488c16502db9575 ] As reported by LKP, the Qualcomm LMH driver needs to include several IRQ-related headers, which decrlare necessary IRQ functionality. Currently driver builds on ARM64 platforms, where the headers are pulled in implicitly by other headers, but fails to build on other platforms. Fixes: 53bca371cdf7 ("thermal/drivers/qcom: Add support for LMh driver") Reported-by: kernel test robot Closes: https://lore.kernel.org/oe-kbuild-all/202507270042.KdK0KKht-lkp@intel.com/ Signed-off-by: Dmitry Baryshkov Signed-off-by: Daniel Lezcano Link: https://lore.kernel.org/r/20250728-lmh-scm-v2-2-33bc58388ca5@oss.qualcomm.com Signed-off-by: Sasha Levin

thermal/drivers/qcom: Make LMH select QCOM_SCM

2025-10-15T09:57:54+00:00

[ Upstream commit 57eda47bd14b0c2876f2db42e757c57b7a671965 ] The QCOM_SCM symbol is not user-visible, so it makes little sense to depend on it. Make LMH driver select QCOM_SCM as all other drivers do and, as the dependecy is now correctly handled, enable || COMPILE_TEST in order to include the driver into broader set of build tests. Fixes: 9e5a4fb84230 ("thermal/drivers/qcom/lmh: make QCOM_LMH depends on QCOM_SCM") Signed-off-by: Dmitry Baryshkov Signed-off-by: Daniel Lezcano Link: https://lore.kernel.org/r/20250728-lmh-scm-v2-1-33bc58388ca5@oss.qualcomm.com Signed-off-by: Sasha Levin

thermal/drivers/mediatek/lvts: Disable low offset IRQ for minimum threshold

2025-09-09T16:56:29+00:00

[ Upstream commit fa17ff8e325a657c84be1083f06e54ee7eea82e4 ] In order to get working interrupts, a low offset value needs to be configured. The minimum value for it is 20 Celsius, which is what is configured when there's no lower thermal trip (ie the thermal core passes -INT_MAX as low trip temperature). However, when the temperature gets that low and fluctuates around that value it causes an interrupt storm. Prevent that interrupt storm by not enabling the low offset interrupt if the low threshold is the minimum one. Cc: stable@vger.kernel.org Fixes: 77354eaef821 ("thermal/drivers/mediatek/lvts_thermal: Don't leave threshold zeroed") Reviewed-by: AngeloGioacchino Del Regno Signed-off-by: Nícolas F. R. A. Prado Link: https://lore.kernel.org/r/20250113-mt8192-lvts-filtered-suspend-fix-v2-3-07a25200c7c6@collabora.com Signed-off-by: Daniel Lezcano [ Adapted interrupt mask definitions ] Signed-off-by: Sasha Levin Signed-off-by: Greg Kroah-Hartman

thermal: sysfs: Return ENODATA instead of EAGAIN for reads

2025-08-28T14:28:17+00:00

[ Upstream commit 1a4aabc27e95674837f2e25f4ef340c0469e6203 ] According to POSIX spec, EAGAIN returned by read with O_NONBLOCK set means the read would block. Hence, the common implementation in nonblocking model will poll the file when the nonblocking read returns EAGAIN. However, when the target file is thermal zone, this mechanism will totally malfunction because thermal zone doesn't implement sysfs notification and thus the poll will never return. For example, the read in Golang implemnts such method and sometimes hangs at reading some thermal zones via sysfs. Change to return -ENODATA instead of -EAGAIN to userspace. Signed-off-by: Hsin-Te Yuan Link: https://patch.msgid.link/20250620-temp-v3-1-6becc6aeb66c@chromium.org Signed-off-by: Rafael J. Wysocki Signed-off-by: Sasha Levin

thermal/drivers/qcom-spmi-temp-alarm: Enable stage 2 shutdown when required

2025-08-28T14:28:17+00:00

[ Upstream commit f8e157ff2df46ddabd930815d196895976227831 ] Certain TEMP_ALARM GEN2 PMIC peripherals need over-temperature stage 2 automatic PMIC partial shutdown. This will ensure that in the event of reaching the hotter stage 3 over-temperature threshold, repeated faults will be avoided during the automatic PMIC hardware full shutdown. Modify the stage 2 shutdown control logic to ensure that stage 2 shutdown is enabled on all affected PMICs. Read the digital major and minor revision registers to identify these PMICs. Signed-off-by: David Collins Signed-off-by: Anjelique Melendez Link: https://lore.kernel.org/r/20250710224555.3047790-2-anjelique.melendez@oss.qualcomm.com Signed-off-by: Daniel Lezcano Signed-off-by: Sasha Levin

thermal: intel: x86_pkg_temp_thermal: Fix bogus trip temperature

2025-06-04T12:42:20+00:00

commit cf948c8e274e8b406e846cdf6cc48fe47f98cf57 upstream. The tj_max value obtained from the Intel TCC library are in Celsius, whereas the thermal subsystem operates in milli-Celsius. This discrepancy leads to incorrect trip temperature calculations. Fix bogus trip temperature by converting tj_max to milli-Celsius Unit. Fixes: 8ef0ca4a177d ("Merge back other thermal control material for 6.3.") Signed-off-by: Zhang Rui Reported-by: zhang ning Closes: https://lore.kernel.org/all/TY2PR01MB3786EF0FE24353026293F5ACCD97A@TY2PR01MB3786.jpnprd01.prod.outlook.com/ Tested-by: zhang ning Cc: 6.3+ # 6.3+ Link: https://patch.msgid.link/20250519070901.1031233-1-rui.zhang@intel.com Signed-off-by: Rafael J. Wysocki Signed-off-by: Greg Kroah-Hartman

thermal/drivers/qoriq: Power down TMU on system suspend

2025-06-04T12:41:55+00:00

[ Upstream commit 229f3feb4b0442835b27d519679168bea2de96c2 ] Enable power-down of TMU (Thermal Management Unit) for TMU version 2 during system suspend to save power. Save approximately 4.3mW on VDD_ANA_1P8 on i.MX93 platforms. Signed-off-by: Alice Guo Signed-off-by: Frank Li Link: https://lore.kernel.org/r/20241209164859.3758906-2-Frank.Li@nxp.com Signed-off-by: Daniel Lezcano Signed-off-by: Sasha Levin

thermal/drivers/rockchip: Add missing rk3328 mapping entry

2025-04-25T08:45:32+00:00

commit ee022e5cae052e0c67ca7c5fec0f2e7bc897c70e upstream. The mapping table for the rk3328 is missing the entry for -25C which is found in the TRM section 9.5.2 "Temperature-to-code mapping". NOTE: the kernel uses the tsadc_q_sel=1'b1 mode which is defined as: 4096-

. Whereas the table in the TRM gives the code
      "3774" for -25C, the kernel uses 4096-3774=322.

[Dragan Simic] : "After going through the RK3308 and RK3328 TRMs, as
  well as through the downstream kernel code, it seems we may have
  some troubles at our hands.  Let me explain, please.

  To sum it up, part 1 of the RK3308 TRM v1.1 says on page 538 that
  the equation for the output when tsadc_q_sel equals 1 is (4096 -
  tsadc_q), while part 1 of the RK3328 TRM v1.2 says that the output
  equation is (1024 - tsadc_q) in that case.

  The downstream kernel code, however, treats the RK3308 and RK3328
  tables and their values as being the same.  It even mentions 1024 as
  the "offset" value in a comment block for the rk_tsadcv3_control()
  function, just like the upstream code does, which is obviously wrong
  "offset" value when correlated with the table on page 544 of part 1
  of the RK3308 TRM v1.1.

  With all this in mind, it's obvious that more work is needed to make
  it clear where's the actual mistake (it could be that the TRM is
  wrong), which I'll volunteer for as part of the SoC binning project.
  In the meantime, this patch looks fine as-is to me, by offering
  what's a clear improvement to the current state of the upstream
  code"

Link: https://opensource.rock-chips.com/images/9/97/Rockchip_RK3328TRM_V1.1-Part1-20170321.pdf
Cc: stable@vger.kernel.org
Fixes: eda519d5f73e ("thermal: rockchip: Support the RK3328 SOC in thermal driver")
Signed-off-by: Trevor Woerner 
Reviewed-by: Dragan Simic 
Link: https://lore.kernel.org/r/20250207175048.35959-1-twoerner@gmail.com
Signed-off-by: Daniel Lezcano 
Signed-off-by: Greg Kroah-Hartman



thermal: int340x: Add NULL check for adev
2025-04-10T12:37:26+00:00
[ Upstream commit 2542a3f70e563a9e70e7ded314286535a3321bdb ]

Not all devices have an ACPI companion fwnode, so adev might be NULL.
This is similar to the commit cd2fd6eab480
("platform/x86: int3472: Check for adev == NULL").

Add a check for adev not being set and return -ENODEV in that case to
avoid a possible NULL pointer deref in int3402_thermal_probe().

Note, under the same directory, int3400_thermal_probe() has such a
check.

Fixes: 77e337c6e23e ("Thermal: introduce INT3402 thermal driver")
Signed-off-by: Chenyuan Yang 
Acked-by: Uwe Kleine-König 
Link: https://patch.msgid.link/20250313043611.1212116-1-chenyuan0y@gmail.com
[ rjw: Subject edit, added Fixes: ]
Signed-off-by: Rafael J. Wysocki 
Signed-off-by: Sasha Levin