kernel/linux.git/drivers/thermal/devfreq_cooling.c, branch v6.6.131

thermal: devfreq_cooling: Fix perf state when calculate dfc res_util

2024-04-03T13:28:56+00:00

commit a26de34b3c77ae3a969654d94be49e433c947e3b upstream. The issue occurs when the devfreq cooling device uses the EM power model and the get_real_power() callback is provided by the driver. The EM power table is sorted ascending，can't index the table by cooling device state，so convert cooling state to performance state by dfc->max_state - dfc->capped_state. Fixes: 615510fe13bd ("thermal: devfreq_cooling: remove old power model and use EM") Cc: 5.11+ # 5.11+ Signed-off-by: Ye Zhang Reviewed-by: Dhruva Gole Reviewed-by: Lukasz Luba Signed-off-by: Rafael J. Wysocki Signed-off-by: Greg Kroah-Hartman

thermal/core: Relocate the traces definition in thermal directory

2023-04-01T18:51:45+00:00

The traces are exported but only local to the thermal core code. On the other side, the traces take the thermal zone device structure as argument, thus they have to rely on the exported thermal.h header file. As we want to move the structure to the private thermal core header, first we have to relocate those traces to the same place as many drivers do. Cc: Steven Rostedt Suggested-by: Steven Rostedt Signed-off-by: Daniel Lezcano Reviewed-by: Steven Rostedt (Google) Link: https://lore.kernel.org/r/20230307133735.90772-2-daniel.lezcano@linaro.org

Merge tag 'thermal-5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm

2022-08-02T18:27:53+00:00

Pull thermal control updates from Rafael Wysocki: "These start a rework of the handling of trip points in the thermal core, improve the cpufreq/devfreq cooling device handling, update some thermal control drivers and the tmon utility and clean up code. Specifics: - Consolidate the thermal core code by beginning to move the thermal trip structure from the thermal OF code as a generic structure to be used by the different sensors when registering a thermal zone (Daniel Lezcano). - Make per cpufreq / devfreq cooling device ops instead of using a global variable, fix comments and rework the trace information (Lukasz Luba). - Add the include/dt-bindings/thermal.h under the area covered by the thermal maintainer in the MAINTAINERS file (Lukas Bulwahn). - Improve the error output by giving the sensor identification when a thermal zone failed to initialize, the DT bindings by changing the positive logic and adding the r8a779f0 support on the rcar3 (Wolfram Sang). - Convert the QCom tsens DT binding to the dtsformat format (Krzysztof Kozlowski). - Remove the pointless get_trend() function in the QCom, Ux500 and tegra thermal drivers, along with the unused DROP_FULL and RAISE_FULL trends definitions. Simplify the code by using clamp() macros (Daniel Lezcano). - Fix ref_table memory leak at probe time on the k3_j72xx bandgap (Bryan Brattlof). - Fix array underflow in prep_lookup_table (Dan Carpenter). - Add static annotation to the k3_j72xx_bandgap_j7* data structure (Jin Xiaoyun). - Fix typos in comments detected on sun8i by Coccinelle (Julia Lawall). - Fix typos in comments on rzg2l (Biju Das). - Remove as unnecessary call to dev_err() as the error is already printed by the failing function on u8500 (Yang Li). - Register the thermal zones as hwmon sensors for the Qcom thermal sensors (Dmitry Baryshkov). - Fix 'tmon' tool compilation issue by adding phtread.h include (Markus Mayer). - Fix typo in the comments for the 'tmon' tool (Slark Xiao). - Make the thermal core use ida_alloc()/free() directly instead of ida_simple_get()/ida_simple_remove() that have been deprecated (keliu). - Drop ACPI_FADT_LOW_POWER_S0 check from the Intel PCH thermal control driver (Rafael Wysocki)" * tag 'thermal-5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (39 commits) thermal/of: Initialize trip points separately thermal/of: Use thermal trips stored in the thermal zone thermal/core: Add thermal_trip in thermal_zone thermal/core: Rename 'trips' to 'num_trips' thermal/core: Move thermal_set_delay_jiffies to static thermal/core: Remove unneeded EXPORT_SYMBOLS thermal/of: Move thermal_trip structure to thermal.h thermal/of: Remove the device node pointer for thermal_trip thermal/of: Replace device node match with device node search thermal/core: Remove duplicate information when an error occurs thermal/core: Avoid calling ->get_trip_temp() unnecessarily thermal/tools/tmon: Fix typo 'the the' in comment thermal/tools/tmon: Include pthread and time headers in tmon.h thermal/ti-soc-thermal: Fix comment typo thermal/drivers/qcom/spmi-adc-tm5: Register thermal zones as hwmon sensors thermal/drivers/qcom/temp-alarm: Register thermal zones as hwmon sensors thermal/drivers/u8500: Remove unnecessary print function dev_err() thermal/drivers/rzg2l: Fix comments thermal/drivers/sun8i: Fix typo in comment thermal/drivers/k3_j72xx_bandgap: Make k3_j72xx_bandgap_j721e_data and k3_j72xx_bandgap_j7200_data static ...

drivers/thermal/devfreq_cooling: Extend the devfreq_cooling_device with ops

2022-07-28T15:29:43+00:00

Remove unneeded global variable devfreq_cooling_ops which is used only as a copy pattern. Instead, extend the struct devfreq_cooling_device with the needed ops structure. This also simplifies the allocation/free code during the setup/cleanup. Signed-off-by: Lukasz Luba Link: https://lore.kernel.org/r/20220613124327.30766-5-lukasz.luba@arm.com Signed-off-by: Daniel Lezcano

PM: EM: convert power field to micro-Watts precision and align drivers

2022-07-15T17:17:30+00:00

The milli-Watts precision causes rounding errors while calculating efficiency cost for each OPP. This is especially visible in the 'simple' Energy Model (EM), where the power for each OPP is provided from OPP framework. This can cause some OPPs to be marked inefficient, while using micro-Watts precision that might not happen. Update all EM users which access 'power' field and assume the value is in milli-Watts. Solve also an issue with potential overflow in calculation of energy estimation on 32bit machine. It's needed now since the power value (thus the 'cost' as well) are higher. Example calculation which shows the rounding error and impact: power = 'dyn-power-coeff' * volt_mV * volt_mV * freq_MHz power_a_uW = (100 * 600mW * 600mW * 500MHz) / 10^6 = 18000 power_a_mW = (100 * 600mW * 600mW * 500MHz) / 10^9 = 18 power_b_uW = (100 * 605mW * 605mW * 600MHz) / 10^6 = 21961 power_b_mW = (100 * 605mW * 605mW * 600MHz) / 10^9 = 21 max_freq = 2000MHz cost_a_mW = 18 * 2000MHz/500MHz = 72 cost_a_uW = 18000 * 2000MHz/500MHz = 72000 cost_b_mW = 21 * 2000MHz/600MHz = 70 // <- artificially better cost_b_uW = 21961 * 2000MHz/600MHz = 73203 The 'cost_b_mW' (which is based on old milli-Watts) is misleadingly better that the 'cost_b_uW' (this patch uses micro-Watts) and such would have impact on the 'inefficient OPPs' information in the Cpufreq framework. This patch set removes the rounding issue. Signed-off-by: Lukasz Luba Acked-by: Daniel Lezcano Acked-by: Viresh Kumar Signed-off-by: Rafael J. Wysocki

Merge tag 'thermal-5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm

2022-05-24T23:19:30+00:00

Pull thermal control updates from Rafael Wysocki: "These add a thermal library and thermal tools to wrap the netlink interface into event-based callbacks, improve overheat condition handling during suspend-to-idle on Intel SoCs, add some new hardware support, fix bugs and clean up code. Specifics: - Add thermal library and thermal tools to encapsulate the netlink into event based callbacks (Daniel Lezcano, Jiapeng Chong). - Improve overheat condition handling during suspend-to-idle in the Intel PCH thermal driver (Zhang Rui). - Use local ops instead of global ops in devfreq_cooling (Kant Fan). - Clean up _OSC handling in int340x (Davidlohr Bueso). - Switch hisi_termal from CONFIG_PM_SLEEP guards to pm_sleep_ptr() (Hesham Almatary). - Add new k3 j72xx bangdap driver and the corresponding bindings (Keerthy). - Fix missing of_node_put() in the SC iMX driver at probe time (Miaoqian Lin). - Fix memory leak in __thermal_cooling_device_register() when device_register() fails by calling thermal_cooling_device_destroy_sysfs() (Yang Yingliang). - Add sc8180x and sc8280xp compatible string in the DT bindings and lMH support for QCom tsens driver (Bjorn Andersson). - Fix OTP Calibration Register values conforming to the documentation on RZ/G2L and bindings documentation for RZ/G2UL (Biju Das). - Fix type in kerneldoc description for __thermal_bind_params (Corentin Labbe). - Fix potential NULL dereference in sr_thermal_probe() on Broadcom platform (Zheng Yongjun). - Add change mode ops to the thermal-of sensor (Manaf Meethalavalappu Pallikunhi). - Fix non-negative value support by preventing the value to be clamp to zero (Stefan Wahren). - Add compatible string and DT bindings for MSM8960 tsens driver (Dmitry Baryshkov). - Add hwmon support for K3 driver (Massimiliano Minella). - Refactor and add multiple generations support for QCom ADC driver (Jishnu Prakash). - Use platform_get_irq_optional() to get the interrupt on RCar driver and document Document RZ/V2L bindings (Lad Prabhakar). - Remove NULL check after container_of() call from the Intel HFI thermal driver (Haowen Bai)" * tag 'thermal-5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (38 commits) thermal: intel: pch: improve the cooling delay log thermal: intel: pch: enhance overheat handling thermal: intel: pch: move cooling delay to suspend_noirq phase PM: wakeup: expose pm_wakeup_pending to modules thermal: k3_j72xx_bandgap: Add the bandgap driver support dt-bindings: thermal: k3-j72xx: Add VTM bindings documentation thermal/drivers/imx_sc_thermal: Fix refcount leak in imx_sc_thermal_probe thermal/core: Fix memory leak in __thermal_cooling_device_register() dt-bindings: thermal: tsens: Add sc8280xp compatible dt-bindings: thermal: lmh: Add Qualcomm sc8180x compatible thermal/drivers/qcom/lmh: Add sc8180x compatible thermal/drivers/rz2gl: Fix OTP Calibration Register values dt-bindings: thermal: rzg2l-thermal: Document RZ/G2UL bindings thermal: thermal_of: fix typo on __thermal_bind_params tools/thermal: remove unneeded semicolon tools/lib/thermal: remove unneeded semicolon thermal/drivers/broadcom: Fix potential NULL dereference in sr_thermal_probe tools/thermal: Add thermal daemon skeleton tools/thermal: Add a temperature capture tool tools/thermal: Add util library ...

thermal: devfreq_cooling: use local ops instead of global ops

2022-04-13T14:49:43+00:00

Fix access illegal address problem in following condition: There are multiple devfreq cooling devices in system, some of them has EM model but others do not. Energy model ops such as state2power will append to global devfreq_cooling_ops when the cooling device with EM model is registered. It makes the cooling device without EM model also use devfreq_cooling_ops after appending when registered later by of_devfreq_cooling_register_power() or of_devfreq_cooling_register(). The IPA governor regards the cooling devices without EM model as a power actor, because they also have energy model ops, and will access illegal address at dfc->em_pd when execute cdev->ops->get_requested_power, cdev->ops->state2power or cdev->ops->power2state. Fixes: 615510fe13bd2 ("thermal: devfreq_cooling: remove old power model and use EM") Cc: 5.13+ # 5.13+ Signed-off-by: Kant Fan Reviewed-by: Lukasz Luba Signed-off-by: Rafael J. Wysocki

thermal: cooling: Check Energy Model type in cpufreq_cooling and devfreq_cooling

2022-04-13T14:26:18+00:00

The Energy Model can now be artificial, which means the power values are mathematically generated to leverage EAS while not expected to be on an uniform scale with other devices providing power information. If this EM type is in use, the thermal governor IPA should not be allowed to operate, since the relation between cooling devices is not properly defined. Thus, it might be possible that big GPU has lower power values than a Little CPU. To mitigate a misbehaviour of the thermal control algorithm, simply do not register the cooling device as IPA's power actor. Signed-off-by: Lukasz Luba Acked-by: Viresh Kumar Reviewed-by: Ionela Voinescu Signed-off-by: Rafael J. Wysocki

thermal/drivers/devfreq_cooling: use HZ macros

2021-09-08T18:50:25+00:00

HZ unit conversion macros are available in units.h, use them and remove the duplicate definition. The new macro uses a unsigned long type which is already the type in the current code via the 'freq' variable. Link: https://lkml.kernel.org/r/20210816114732.1834145-4-daniel.lezcano@linaro.org Signed-off-by: Daniel Lezcano Reviewed-by: Andy Shevchenko Reviewed-by: Christian Eggers Cc: Chanwoo Choi Cc: Guenter Roeck Cc: Jonathan Cameron Cc: Jonathan Cameron Cc: Kyungmin Park Cc: Lars-Peter Clausen Cc: Lukasz Luba Cc: Maxime Coquelin Cc: Miquel Raynal Cc: MyungJoo Ham Cc: Peter Meerwald Cc: "Rafael J. Wysocki" Cc: Zhang Rui Signed-off-by: Andrew Morton Signed-off-by: Linus Torvalds

thermal: devfreq_cooling: Fix kernel-doc

2021-07-04T16:28:04+00:00

Fix function name in devfreq_cooling.c comment to remove a warning found by kernel-doc. drivers/thermal/devfreq_cooling.c:479: warning: expecting prototype for devfreq_cooling_em_register_power(). Prototype was for devfreq_cooling_em_register() instead. Reported-by: Abaci Robot Signed-off-by: Yang Li Reviewed-by: Nick Desaulniers Reviewed-by: Nathan Chancellor Reviewed-by: Lukasz Luba Signed-off-by: Daniel Lezcano Link: https://lore.kernel.org/r/1623223350-128104-1-git-send-email-yang.lee@linux.alibaba.com