kernel/linux.git/drivers/thermal/Makefile, branch v6.6.132

thermal/drivers/loongson-2: Add thermal management support

2023-08-17T07:27:18+00:00

This patch adds the support for Loongson-2 thermal sensor controller, which can support maximum four sensor selectors that corresponding to four sets of thermal control registers and one set of sampling register. The sensor selector can selector a speific thermal sensor as temperature input. The sampling register is used to obtain the temperature in real time, the control register GATE field is used to set the threshold of high or low temperature, when the input temperature is higher than the high temperature threshold or lower than the low temperature threshold, an interrupt will occur. Signed-off-by: zhanghongchen Signed-off-by: Yinbo Zhu Signed-off-by: Daniel Lezcano Link: https://lore.kernel.org/r/20230817021007.10350-1-zhuyinbo@loongson.cn

thermal/core: Relocate the traces definition in thermal directory

2023-04-01T18:51:45+00:00

The traces are exported but only local to the thermal core code. On the other side, the traces take the thermal zone device structure as argument, thus they have to rely on the exported thermal.h header file. As we want to move the structure to the private thermal core header, first we have to relocate those traces to the same place as many drivers do. Cc: Steven Rostedt Suggested-by: Steven Rostedt Signed-off-by: Daniel Lezcano Reviewed-by: Steven Rostedt (Google) Link: https://lore.kernel.org/r/20230307133735.90772-2-daniel.lezcano@linaro.org

thermal/drivers/mediatek: Relocate driver to mediatek folder

2023-02-15T16:28:25+00:00

Add MediaTek proprietary folder to upstream more thermal zone and cooler drivers, relocate the original thermal controller driver to it, and rename it as "auxadc_thermal.c" to show its purpose more clearly. Signed-off-by: Balsam CHIHI Reviewed-by: AngeloGioacchino Del Regno Link: https://lore.kernel.org/r/20230209105628.50294-2-bchihi@baylibre.com Signed-off-by: Daniel Lezcano Signed-off-by: Rafael J. Wysocki

Merge branch 'thermal-core'

2023-02-15T16:08:30+00:00

Merge thermal control core changes for 6.3-rc1: - Clean up thermal device unregistration code (Viresh Kumar). - Fix and clean up thermal control core initialization error code paths (Daniel Lezcano). - Relocate the trip points handling code into a separate file (Daniel Lezcano). - Make the thermal core fail registration of thermal zones and cooling devices if the thermal class has not been registered (Rafael Wysocki). - Make the core thermal control code use sysfs_emit_at() instead of scnprintf() where applicable (ye xingchen). * thermal-core: thermal: core: Use sysfs_emit_at() instead of scnprintf() thermal: Fail object registration if thermal class is not registered thermal/core: Move the thermal trip code to a dedicated file thermal/core: Remove unneeded ida_destroy() thermal/core: Fix unregistering netlink at thermal init time thermal: core: Use device_unregister() instead of device_del/put() thermal: core: Move cdev cleanup to thermal_release()

thermal/core: Move the thermal trip code to a dedicated file

2023-01-25T15:40:39+00:00

The thermal_core.c files contains a lot of functions handling different thermal components like the governors, the trip points, the cooling device, the OF cooling device, etc ... This organization does not help to migrate to a more sane code where there is a better self-encapsulation as all the components' internals can be directly accessed from a single file. For the sake of clarity, let's move the thermal trip points code in a dedicated thermal_trip.c file and add a function to browse all the trip points like we do with the thermal zones, the govenors and the cooling devices. The same can be done for the cooling devices and the governor code but that will come later as the current work in the thermal framework is to fix the trip point handling and use a generic trip point structure. No functional changes intended. Signed-off-by: Daniel Lezcano Reviewed-by: Zhang Rui Signed-off-by: Rafael J. Wysocki

thermal: ACPI: Add ACPI trip point routines

2023-01-24T20:13:42+00:00

Add library routines to populate a generic thermal trip point structure with data obtained by evaluating a specific object in the ACPI Namespace. Signed-off-by: Rafael J. Wysocki Co-developed-by: Daniel Lezcano Signed-off-by: Daniel Lezcano Tested-by: Srinivas Pandruvada

thermal/drivers/qcom: Drop false build dependency of all QCOM drivers on QCOM_TSENS

2022-10-04T09:21:11+00:00

The SPMI QCOM drivers have no dependency in Kconfig, but the Makefile will not be included without QCOM_TSENS. This unnecessarily reduces build coverage. Signed-off-by: Jonathan Cameron Cc: Dmitry Baryshkov Cc: Bhupesh Sharma Acked-by: Amit Kucheria Reviewed-by: Bhupesh Sharma Link: https://lore.kernel.org/r/20220821160032.2206349-1-jic23@kernel.org Signed-off-by: Daniel Lezcano

thermal: k3_j72xx_bandgap: Add the bandgap driver support

2022-05-19T10:11:53+00:00

Add VTM thermal support. In the Voltage Thermal Management Module(VTM), K3 J72XX supplies a voltage reference and a temperature sensor feature that are gathered in the band gap voltage and temperature sensor (VBGAPTS) module. The band gap provides current and voltage reference for its internal circuits and other analog IP blocks. The analog-to-digital converter (ADC) produces an output value that is proportional to the silicon temperature. Currently reading temperatures only is supported. There are no active/passive cooling agent supported. J721e SoCs have errata i2128: https://www.ti.com/lit/pdf/sprz455 The VTM Temperature Monitors (TEMPSENSORs) are trimmed during production, with the resulting values stored in software-readable registers. Software should use these register values when translating the Temperature Monitor output codes to temperature values. It has an involved workaround. Software needs to read the error codes for -40C, 30C, 125C from the efuse for each device & derive a new look up table for adc to temperature conversion. Involved calculating slopes & constants using 3 different straight line equations with adc refernce codes as the y-axis & error codes in the x-axis. -40C to 30C 30C to 125C 125C to 150C With the above 2 line equations we derive the full look-up table to workaround the errata i2128 for j721e SoC. Tested temperature reading on J721e SoC & J7200 SoC. [daniel.lezcano@linaro.org: Generate look-up tables run-time] Signed-off-by: Daniel Lezcano Signed-off-by: Keerthy Link: https://lore.kernel.org/r/20220517172920.10857-3-j-keerthy@ti.com Signed-off-by: Daniel Lezcano

thermal/drivers: Add TSU driver for RZ/G2L

2021-11-30T16:27:56+00:00

The RZ/G2L SoC incorporates a thermal sensor unit (TSU) that measures the temperature inside the LSI. The thermal sensor in this unit measures temperatures in the range from −40 degree Celsius to 125 degree Celsius with an accuracy of ±3°C. The TSU repeats measurement at 20 microseconds intervals and automatically updates the results of measurement. The TSU has no interrupts as well as no external pins. This patch adds Thermal Sensor Unit(TSU) driver for RZ/G2L SoC. Signed-off-by: Biju Das Reviewed-by: Lad Prabhakar Link: https://lore.kernel.org/r/20211130155757.17837-3-biju.das.jz@bp.renesas.com Signed-off-by: Daniel Lezcano

thermal/drivers/zx: Remove zx driver

2021-02-03T08:17:47+00:00

The zte zx platform is getting removed, so this driver is no longer needed. Cc: Jun Nie Cc: Shawn Guo Signed-off-by: Arnd Bergmann Signed-off-by: Daniel Lezcano Link: https://lore.kernel.org/r/20210120162400.4115366-3-arnd@kernel.org