EDK II (mirror) https://git.radix-linux.su/Tianocore/edk2.git/atom?h=master 2019-04-09T17:58:03+00:00 2019-04-09T17:58:03+00:00 Michael D Kinney michael.d.kinney@intel.com 2019-04-03T23:04:06+00:00 urn:sha1:512e23a3339ddfb4d227d62feebe733825904de3 https://bugzilla.tianocore.org/show_bug.cgi?id=1373 Replace BSD 2-Clause License with BSD+Patent License. This change is based on the following emails: https://lists.01.org/pipermail/edk2-devel/2019-February/036260.html https://lists.01.org/pipermail/edk2-devel/2018-October/030385.html RFCs with detailed process for the license change: V3: https://lists.01.org/pipermail/edk2-devel/2019-March/038116.html V2: https://lists.01.org/pipermail/edk2-devel/2019-March/037669.html V1: https://lists.01.org/pipermail/edk2-devel/2019-March/037500.html Contributed-under: TianoCore Contribution Agreement 1.1 Signed-off-by: Michael D Kinney <michael.d.kinney@intel.com> Reviewed-by: Chasel Chiu <chasel.chiu@intel.com> 2018-09-28T02:55:10+00:00 shenglei shenglei.zhang@intel.com 2018-08-28T02:12:07+00:00 urn:sha1:631db6b24d84c12c8710ee8b01cc095937c35e10 The PCDs below are unused, so they have been removed from inf. gIntelFsp2PkgTokenSpaceGuid.PcdTemporaryRamBase gIntelFsp2PkgTokenSpaceGuid.PcdTemporaryRamSize Cc: Jiewen Yao <jiewen.yao@intel.com> Cc: Chasel Chiu <chasel.chiu@intel.com> Cc: Laszlo Ersek <lersek@redhat.com> Contributed-under: TianoCore Contribution Agreement 1.1 Signed-off-by: shenglei <shenglei.zhang@intel.com> Reviewed-by: Chasel Chiu <chasel.chiu@intel.com> 2018-09-28T02:50:43+00:00 Chasel, Chiu chasel.chiu@intel.com 2018-09-28T02:31:37+00:00 urn:sha1:ed5de31189faf5437eaa39236d178543be8baa39 Commit formats had issues so reverted 9 commits from IntelFsp2Pkg and IntelFsp2WrapperPkg. Will re-submit them with correct formats. Cc: Jiewen Yao <Jiewen.yao@intel.com> Cc: Star Zeng <star.zeng@intel.com> Contributed-under: TianoCore Contribution Agreement 1.1 Signed-off-by: Chasel Chiu <chasel.chiu@intel.com> Reviewed-by: Star Zeng <star.zeng@intel.com> 2018-09-27T07:42:57+00:00 Chasel, Chiu chasel.chiu@intel.com 2018-09-27T07:39:33+00:00 urn:sha1:6532fdec11d7940a584a73797b5cc067d64f84a5 Remove PCDs The PCDs below are unused, so they have been removed from inf. gIntelFsp2PkgTokenSpaceGuid.PcdTemporaryRamBase gIntelFsp2PkgTokenSpaceGuid.PcdTemporaryRamSize Cc: Jiewen Yao <jiewen.yao@intel.com> Cc: Chasel Chiu <chasel.chiu@intel.com> Cc: Laszlo Ersek <lersek@redhat.com> Contributed-under: TianoCore Contribution Agreement 1.1 Signed-off-by: shenglei <shenglei.zhang@intel.com> Reviewed-by: Chasel Chiu <chasel.chiu@intel.com> 2016-05-13T05:00:53+00:00 Jiewen Yao jiewen.yao@intel.com 2016-05-13T05:00:53+00:00 urn:sha1:cf1d454983fb4fd3b580a92bd242310467a5eaef Add FSP2.0 support. This series of patch is to support FSP2.0 specification at https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf Some major updates include: 1) One FSP binary is separated to multiple components: FSP-T, FSP-M, FSP-S, and optional FSP-O. Each component has its own configuration data region. 2) All FSP-APIs use same UPD format - FSP_UPD_HEADER. 3) Add EnumInitPhaseEndOfFirmware notifyphase. 4) FSP1.1/FSP1.0 compatibility is NOT maintained. 5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg, to indicate that it is for FspWrapper only. IntelFspPkg and IntelFspWrapperPkg will be deprecated. The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg and IntelFsp2WrapperPkg. The old platform can still use IntelFspPkg and IntelFspWrapperPkg for compatibility consideration. Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com> Cc: Maurice Ma <maurice.ma@intel.com> Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com> Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: Jiewen Yao <jiewen.yao@intel.com> Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com> Reviewed-by: Maurice Ma <maurice.ma@intel.com> Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>