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The omap3_pmx_core pinmux device in the device tree handles the system
controller module (SCM) PADCONFS fonction. Its control registers are
split in two distinct areas, with other SCM registers in-between. Those
other registers can't thus be requested by other drivers as the memory
region gets reserved by the pinmux driver.
Split the omap3_pmx_core device tree node in two for the two memory
regions. The second region address and size depends on the SoC model.
The change in omap3.dtsi fixes an "external abort on non-linefetch" when
doing
cat /sys/kernel/debug/pinctrl/.../pins
on a Nokia N900.
Note that the core2 padconf region is different for 3430 vs 3630,
and does not exist on 3517 as noted by Nishanth Menon <nm@ti.com>.
Reported-by: Tomi Valkeinen <tomi.valkeinen@ti.com>
Signed-off-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com>
Acked-By: Sebastian Reichel <sre@debian.org>
Signed-off-by: Nishanth Menon <nm@ti.com>
[tony@atomide.com: updated for 3430 vs 3630 core2 based on Nishant's patch]
Signed-off-by: Tony Lindgren <tony@atomide.com>
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Most of the boards are using the TI AM/DM37x processor, there is only a small
quantity of IGEP Processor Boards based on TI OMAP3530. So it's better use the
omap36xx.dtsi include instead of omap34xx.dtsi include. We can add support
for the 34xx based variant later on as needed.
To avoid confusion we have added to the model the (TI AM/DM37x) comment.
Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
[tony@atomide.com: updated comments for the 34xx to 36xx include change]
Signed-off-by: Tony Lindgren <tony@atomide.com>
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Cc: Tony Lindgren <tony@atomide.com>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
Signed-off-by: Benoit Cousson <bcousson@baylibre.com>
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The IGEP COM MOdule has a GPIO LED connected to OMAP
pins. Configure this pin as output GPIO.
Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Tested-by: Enric Balletbo i Serra <eballetbo@iseebcn.com>
Signed-off-by: Benoit Cousson <bcousson@baylibre.com>
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Use standard GPIO constants to enhance the readability of DT GPIOs.
Signed-off-by: Florian Vaussard <florian.vaussard@epfl.ch>
Acked-by: Santosh Shilimkar <santosh.shilimkar@ti.com>
Reviewed-by: Stephen Warren <swarren@nvidia.com>
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
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Replace /include/ by #include for OMAP2+ DT, in order to use the
C pre-processor, making use of #define features possible.
Signed-off-by: Florian Vaussard <florian.vaussard@epfl.ch>
Acked-by: Santosh Shilimkar <santosh.shilimkar@ti.com>
Reviewed-by: Stephen Warren <swarren@nvidia.com>
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
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The IGEP COM Module has an 512MB NAND flash memory.
Add a device node for this NAND and its partition layout.
Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
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ISEE IGEP COM Module is an TI OMAP3 SoC computer on module.
This patch adds an initial device tree support to boot an
IGEP COM Module from the MMC/SD.
Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Tested-by: Enric Balletbo i Serra <eballetbo@gmail.com>
[b-cousson@ti.com: Update the Makefile for 3.8-rc2]
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
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